公开(公告)号：US07624498B2

公开(公告)日：2009-12-01

申请号：US11755170

申请日：2007-05-30

申请人： Youn-sung Ko ,  Hak-kyoon Byun ,  Jung-hwan Woo ,  Hyun-jung Song

发明人： Youn-sung Ko ,  Hak-kyoon Byun ,  Jung-hwan Woo ,  Hyun-jung Song

IPC分类号： B23P19/00 ,  H01L21/00

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  Y10T29/41 ,  Y10T29/49815 ,  Y10T29/49819 ,  Y10T29/49824 ,  Y10T29/53091 ,  Y10T29/53187 ,  Y10T29/53274

摘要： An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

摘要翻译： 从半导体芯片上分离半导体芯片的方法和方法最小化了半导体芯片会破裂的可能性。 该装置包括保持器，具有上端的第一喷射器和其上端设置在第一喷射器的中心的第二喷射器。 保持器具有延伸穿过上部的上部和通孔。 喷射器具有可以通过保持器上部的通孔而延伸和缩回到保持器内的上端。 安装有至少一个半导体芯片的胶带抵靠着保持器的上部。 第一喷射器从保持器延伸第一距离以向上推半导体芯片。 第二喷射器从保持器延伸大于第一距离的第二距离，以将半导体芯片进一步向上推。 因此，磁带从半导体芯片逐渐分离。

公开(公告)号：US20100037445A1

公开(公告)日：2010-02-18

申请号：US12603913

申请日：2009-10-22

申请人： Youn-sung Ko ,  Hak-kyoon Byun ,  Jung-hwan Woo ,  Hyun-jung Song

发明人： Youn-sung Ko ,  Hak-kyoon Byun ,  Jung-hwan Woo ,  Hyun-jung Song

IPC分类号： B23P19/04

CPC分类号： H01L21/67132 ,  H01L21/67092 ,  Y10T29/49815 ,  Y10T29/49819 ,  Y10T29/49824 ,  Y10T29/53091 ,  Y10T29/53187 ,  Y10T29/53274

摘要： An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.

摘要翻译： 从半导体芯片上分离半导体芯片的方法和方法最小化了半导体芯片会破裂的可能性。 该装置包括保持器，具有上端的第一喷射器和其上端设置在第一喷射器的中心的第二喷射器。 保持器具有延伸穿过上部的上部和通孔。 喷射器具有可以通过保持器上部的通孔而延伸和缩回到保持器内的上端。 安装有至少一个半导体芯片的胶带抵靠着保持器的上部。 第一喷射器从保持器延伸第一距离以向上推半导体芯片。 第二喷射器从保持器延伸大于第一距离的第二距离，以将半导体芯片进一步向上推。 因此，磁带从半导体芯片逐渐分离。

公开(公告)号：US08945985B2

公开(公告)日：2015-02-03

申请号：US14158131

申请日：2014-01-17

申请人： Won-keun Kim ,  Hyun-jung Song ,  Eun-young Choi ,  Hye-young Jang

发明人： Won-keun Kim ,  Hyun-jung Song ,  Eun-young Choi ,  Hye-young Jang

IPC分类号： H01L21/00 ,  H01L25/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L25/10

CPC分类号： H01L25/50 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A semiconductor package including an internal package including at least one semiconductor chip sealed with an internal seal, an external substrate on which the internal package is mounted, and an external seal sealing the internal package is provided. Also provided is a method of manufacturing the semiconductor package including forming an internal package including at least one semiconductor chip sealed with an internal seal, mounting the internal package on an external substrate, and sealing the internal package with an external seal. The internal seal and the external seal have different Young's moduli, for example, a Young's modulus of the internal seal is smaller than a Young's modulus of the external seal. Accordingly, the semiconductor package is less susceptible to warpage and can be handled with relative ease in subsequent semiconductor package processes.

摘要翻译： 一种半导体封装，包括：内部封装，其包括至少一个用内部密封件密封的半导体芯片;外部基板，其上安装有内部封装;以及外部密封件封装内部封装。 还提供了一种制造半导体封装的方法，包括形成包括至少一个用内部密封件密封的半导体芯片的内部封装，将内部封装安装在外部基板上，并用外部密封件密封内部封装。 内部密封件和外部密封件具有不同的杨氏模量，例如，内部密封件的杨氏模量小于外部密封件的杨氏模量。 因此，半导体封装不易翘曲，并且可以在随后的半导体封装工艺中相对容易地处理。

公开(公告)号：US08653676B2

公开(公告)日：2014-02-18

申请号：US13565111

申请日：2012-08-02

申请人： Won-keun Kim ,  Hyun-jung Song ,  Eun-young Choi ,  Hye-young Jang

发明人： Won-keun Kim ,  Hyun-jung Song ,  Eun-young Choi ,  Hye-young Jang

IPC分类号： H01L23/29

CPC分类号： H01L25/50 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A semiconductor package including an internal package including at least one semiconductor chip sealed with an internal seal, an external substrate on which the internal package is mounted, and an external seal sealing the internal package is provided. Also provided is a method of manufacturing the semiconductor package including forming an internal package including at least one semiconductor chip sealed with an internal seal, mounting the internal package on an external substrate, and sealing the internal package with an external seal. The internal seal and the external seal have different Young's moduli, for example, a Young's modulus of the internal seal is smaller than a Young's modulus of the external seal. Accordingly, the semiconductor package is less susceptible to warpage and can be handled with relative ease in subsequent semiconductor package processes.

摘要翻译： 一种半导体封装，包括：内部封装，其包括至少一个用内部密封件密封的半导体芯片;外部基板，其上安装有内部封装;以及外部密封件封装内部封装。 还提供了一种制造半导体封装的方法，包括形成包括至少一个用内部密封件密封的半导体芯片的内部封装，将内部封装安装在外部基板上，并用外部密封件密封内部封装。 内部密封件和外部密封件具有不同的杨氏模量，例如，内部密封件的杨氏模量小于外部密封件的杨氏模量。 因此，半导体封装不易翘曲，并且可以在随后的半导体封装工艺中相对容易地处理。

公开(公告)号：US20130082399A1

公开(公告)日：2013-04-04

申请号：US13565111

申请日：2012-08-02

申请人： Won-keun Kim ,  Hyun-jung Song ,  Eun-young Choi ,  Hye-young Jang

发明人： Won-keun Kim ,  Hyun-jung Song ,  Eun-young Choi ,  Hye-young Jang

IPC分类号： H01L23/522

CPC分类号： H01L25/50 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A semiconductor package including an internal package including at least one semiconductor chip sealed with an internal seal, an external substrate on which the internal package is mounted, and an external seal sealing the internal package is provided. Also provided is a method of manufacturing the semiconductor package including forming an internal package including at least one semiconductor chip sealed with an internal seal, mounting the internal package on an external substrate, and sealing the internal package with an external seal. The internal seal and the external seal have different Young's moduli, for example, a Young's modulus of the internal seal is smaller than a Young's modulus of the external seal. Accordingly, the semiconductor package is less susceptible to warpage and can be handled with relative ease in subsequent semiconductor package processes.

摘要翻译： 一种半导体封装，包括：内部封装，其包括至少一个用内部密封件密封的半导体芯片;外部基板，其上安装有内部封装;以及外部密封件封装内部封装。 还提供了一种制造半导体封装的方法，包括形成包括至少一个用内部密封件密封的半导体芯片的内部封装，将内部封装安装在外部基板上，并用外部密封件密封内部封装。 内部密封件和外部密封件具有不同的杨氏模量，例如，内部密封件的杨氏模量小于外部密封件的杨氏模量。 因此，半导体封装不易翘曲，并且可以在随后的半导体封装工艺中相对容易地处理。