公开(公告)号：US20110276289A1

公开(公告)日：2011-11-10

申请号：US13100643

申请日：2011-05-04

申请人： Young Jin PARK ,  Chi Hong Cho ,  Hyun Soo Park ,  Eun Tae Won ,  Dong Yun Hawng ,  Tae Han Bae ,  Hyoung Kyu Lim ,  Jae Hwi Jang ,  Se Hee Han

发明人： Young Jin PARK ,  Chi Hong Cho ,  Hyun Soo Park ,  Eun Tae Won ,  Dong Yun Hawng ,  Tae Han Bae ,  Hyoung Kyu Lim ,  Jae Hwi Jang ,  Se Hee Han

IPC分类号： G06F19/00

CPC分类号： G01D4/00 ,  G01R21/133 ,  H04L12/2827 ,  Y02B70/325 ,  Y04S20/228

摘要： A power monitoring apparatus is externally coupled to a household appliance so that the power monitoring apparatus can provide a communication function and a power metering function to the household appliance. As a result, the household appliance need not include the power monitoring apparatus, resulting in reduction in production costs of the household appliance.

摘要翻译： 电力监控装置外部耦合到家用电器，使得电力监控装置可以向家用电器提供通信功能和电力计量功能。 因此，家用电器不需要包括电力监控装置，导致家用电器的生产成本降低。

公开(公告)号：US20110163412A1

公开(公告)日：2011-07-07

申请号：US13004899

申请日：2011-01-12

申请人： Young Jin PARK

发明人： Young Jin PARK

IPC分类号： H01L29/06 ,  H01L21/76 ,  H01L21/50

CPC分类号： H01L23/60 ,  H01L23/5227 ,  H01L24/48 ,  H01L27/08 ,  H01L28/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to an isolator and a method of manufacturing the same. An isolator according to the present invention includes a silicon wafer, protective devices formed in predetermined regions of the silicon wafer, and a transformer formed in a predetermined region on the silicon wafer, the transformer having at least two coil patterns spaced apart from each other. According to the present invention, an isolator can be protected from impulses generated by ESD and surge, so that its reliability can be improved, and its size can be considerably decreased. Further, the number of wire bonding times is decreased, so that performance of a chip can be enhanced, and packaging efficiency can be improved, thereby increasing productivity.

摘要翻译： 隔离器及其制造方法技术领域本发明涉及隔离器及其制造方法。 根据本发明的隔离器包括硅晶片，形成在硅晶片的预定区域中的保护装置和形成在硅晶片上的预定区域中的变压器，所述变压器具有彼此间隔开的至少两个线圈图案。 根据本发明，可以防止隔离器免受ESD和浪涌产生的脉冲，从而可以提高其可靠性，并且其尺寸可以显着降低。 此外，引线键合时间的数量减少，从而可以提高芯片的性能，并且可以提高封装效率，从而提高生产率。

公开(公告)号：US20090160011A1

公开(公告)日：2009-06-25

申请号：US12343460

申请日：2008-12-23

申请人： Young Jin PARK

发明人： Young Jin PARK

IPC分类号： H01L23/58 ,  H01L21/762

CPC分类号： H01L23/60 ,  H01L23/5227 ,  H01L24/48 ,  H01L27/08 ,  H01L28/10 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to an isolator and a method of manufacturing the same. An isolator according to the present invention includes a silicon wafer, protective devices formed in predetermined regions of the silicon wafer, and a transformer formed in a predetermined region on the silicon wafer, the transformer having at least two coil patterns spaced apart from each other. According to the present invention, an isolator can be protected from impulses generated by ESD and surge, so that its reliability can be improved, and its size can be considerably decreased. Further, the number of wire bonding times is decreased, so that performance of a chip can be enhanced, and packaging efficiency can be improved, thereby increasing productivity.

摘要翻译： 隔离器及其制造方法技术领域本发明涉及隔离器及其制造方法。 根据本发明的隔离器包括硅晶片，形成在硅晶片的预定区域中的保护装置和形成在硅晶片上的预定区域中的变压器，所述变压器具有彼此间隔开的至少两个线圈图案。 根据本发明，可以防止隔离器免受ESD和浪涌产生的脉冲，从而可以提高其可靠性，并且其尺寸可以显着降低。 此外，引线键合时间的数量减少，从而可以提高芯片的性能，并且可以提高封装效率，从而提高生产率。

公开(公告)号：US20110245472A1

公开(公告)日：2011-10-06

申请号：US13087593

申请日：2011-04-15

申请人： Sung Youb JUNG ,  Jin Sun KIM ,  Young Jin PARK ,  Ki-Doo CHOI ,  Se Chang KWON ,  Gwan Sun LEE

发明人： Sung Youb JUNG ,  Jin Sun KIM ,  Young Jin PARK ,  Ki-Doo CHOI ,  Se Chang KWON ,  Gwan Sun LEE

IPC分类号： C12P21/08 ,  C07K16/00

CPC分类号： A61K47/68 ,  A61K47/6811 ,  A61K47/6813 ,  A61K47/6835 ,  C07K14/505 ,  C07K14/535 ,  C07K14/56 ,  C07K14/61 ,  C07K16/46 ,  C07K19/00 ,  C07K2317/52 ,  C07K2317/732 ,  C07K2317/734 ,  C07K2319/30

摘要： Disclosed are a recombinant expression vector comprising a nucleotide sequence encoding an E. coli-derived signal sequence and a nucleotide sequence encoding an immunoglobulin constant region, and a transformant transformed with the expression vector. Also, disclosed is a method of mass-producing an immunoglobulin constant region by culturing the transformant and expressing the immunoglobulin constant region in a water-soluble form.

摘要翻译： 公开了包含编码大肠杆菌来源的信号序列的核苷酸序列和编码免疫球蛋白恒定区的核苷酸序列的重组表达载体和用表达载体转化的转化体。 此外，公开了通过培养转化体并以水溶性形式表达免疫球蛋白恒定区来大规模生产免疫球蛋白恒定区的方法。

公开(公告)号：US20090115632A1

公开(公告)日：2009-05-07

申请号：US12056968

申请日：2008-03-27

申请人： Young Jin PARK

发明人： Young Jin PARK

IPC分类号： G08G1/09

CPC分类号： G08G1/096716 ,  G08G1/092 ,  G08G1/09675 ,  G08G1/096775

摘要： A terminal and computer program product for receiving traffic information, a method of providing traffic light information, and a method of guiding a signal are provided. The method of providing traffic light information includes receiving a message comprising traffic light information and having a hierarchical structure; acquiring the traffic light information by decoding the message; and displaying signal information of a specific traffic light in a display based on the traffic light information.

摘要翻译： 提供一种用于接收交通信息的终端和计算机程序产品，提供交通信号灯信息的方法以及引导信号的方法。 提供交通信号灯信息的方法包括：接收包含交通灯信息并具有层次结构的消息; 通过解码消息获取交通信号灯信息; 以及基于交通灯信息在显示器中显示特定交通信号灯的信号。

公开(公告)号：US20090014837A1

公开(公告)日：2009-01-15

申请号：US12171306

申请日：2008-07-11

申请人： Young Jin PARK

发明人： Young Jin PARK

IPC分类号： H01L21/822 ,  H01L27/06

CPC分类号： H01L27/0617 ,  H01L27/0629 ,  H01L27/08

摘要： The present invention relates to a semiconductor device and a method of manufacturing the same. A high-resistance silicon wafer is manufactured in such a manner that a large-sized silicon wafer manufactured by the Czochralski method is irradiated with neutrons, and high-resistance and low-resistance elements are simultaneously formed on the high-resistance silicon wafer. Thus, the manufacturing cost can be remarkably saved, and the reliability of products can be enhanced.

摘要翻译： 半导体器件及其制造方法技术领域本发明涉及半导体器件及其制造方法。 制造高电阻硅晶片，使用由Czochralski制造的大尺寸硅晶片用中子照射，并且在高电阻硅晶片上同时形成高电阻和低电阻元件。 因此，可以显着节省制造成本，可以提高产品的可靠性。

公开(公告)号：US20090215259A1

公开(公告)日：2009-08-27

申请号：US12417644

申请日：2009-04-03

申请人： Kye Nam LEE ,  Young Jin PARK ,  Hyun Kyu YANG ,  Yoo Ran KIM

发明人： Kye Nam LEE ,  Young Jin PARK ,  Hyun Kyu YANG ,  Yoo Ran KIM

IPC分类号： H01L21/768

CPC分类号： H01L24/12 ,  H01L23/3171 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/056 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/85466 ,  H01L2224/85481 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/013

摘要： Disclosed is a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip that includes metal pads provided on a predetermined area of an upper side of a semiconductor substrate, where element structures used to manufacture a semiconductor element are formed, and bump electrodes connected to the metal pads; and a passivation film that is provided on an entire surface of the semiconductor chip other than upper surface of the bump electrodes. Therefore, it is possible to avoid difficulties in performing an epoxy underfill process used in a conventional flip chip bonding, and complexity and high cost resulting from the use of a molding compound process and a solder ball process. It is also possible to prevent damages to the lateral surface of the semiconductor chip due to an absence of the passivation film on the lateral surface of the semiconductor chip in a conventional wafer level package.

摘要翻译： 公开了一种半导体封装及其制造方法。 半导体封装包括半导体芯片，其包括设置在半导体衬底的上侧的预定区域上的金属焊盘，其中形成用于制造半导体元件的元件结构，以及连接到金属焊盘的凸块电极; 以及设置在半导体芯片的除凸起电极的上表面以外的整个表面上的钝化膜。 因此，可以避免在传统的倒装芯片接合中使用的环氧底层填充工艺的困难，以及由于使用模塑复合工艺和焊球工艺而导致的复杂性和高成本。 由于在现有的晶片级封装中在半导体芯片的侧面上没有钝化膜，所以也可以防止半导体芯片的侧面的损坏。

公开(公告)号：US20080198238A1

公开(公告)日：2008-08-21

申请号：US12016239

申请日：2008-01-18

申请人： Young Jin PARK

发明人： Young Jin PARK

IPC分类号： H04N5/228

CPC分类号： H04B15/04 ,  G06K15/1219 ,  H04N1/00994

摘要： An image forming apparatus including a video controller that increases or reduces a pulse width of video data when video data is generated in synchronization with a video clock so as to vary a frequency of the video data. It is possible to effectively cope with emission of electromagnetic waves (electromagnetic interference) whose frequency increases when the same type of pulses is repeated, so that the electromagnetic waves are out of the recognition range of a user and image quality is prevented from deteriorating.

摘要翻译： 一种图像形成装置，包括视频控制器，当与视频时钟同步地生成视频数据时，增加或减小视频数据的脉冲宽度，以便改变视频数据的频率。 可以有效地应对当重复相同类型的脉冲时频率增加的电磁波（电磁干扰）的发射，使得电磁波不在用户的识别范围内，并且防止图像质量恶化。

公开(公告)号：US20080023974A1

公开(公告)日：2008-01-31

申请号：US11621849

申请日：2007-01-10

申请人： Young Jin PARK ,  Yong Sik Park ,  Jong Hun Park ,  Wan Kyun Chung

发明人： Young Jin PARK ,  Yong Sik Park ,  Jong Hun Park ,  Wan Kyun Chung

IPC分类号： B25J15/10

CPC分类号： B25J15/0009 ,  F16H21/54

摘要： An approach is disclosed for providing a humanoid joint for a robotic system. A joint apparatus includes a supporting part, a rotating part and a pair of joint part, wherein the supporting part and the rotating part are coupled in which the joint part is disposed, wherein a rotational force is initially driven by a joint part and the rotational force is transmitted to the other joint part using a sliding motion generated at an abutted surface of each joint part, wherein the surface is formed at the end of the joint part, wherein the transmitted rotational forces can be converted into a motion by the restriction of movement of joint part occurred within the limited space formed by the coupling of rotational part and supporting part.

摘要翻译： 公开了一种用于为机器人系统提供人形关节的方法。 联接装置包括支撑部，旋转部和一对接合部，其中支撑部和旋转部联接，其中设置有接合部，其中旋转力最初由接合部驱动，并且旋转 使用在每个关节部分的抵接表面处产生的滑动运动将力传递到另一关节部分，其中所述表面形成在所述关节部分的端部，其中所述传递的旋转力可以通过限制 接头部分的运动发生在由旋转部分和支撑部分的联接形成的有限空间内。

公开(公告)号：US20110175194A1

公开(公告)日：2011-07-21

申请号：US13010786

申请日：2011-01-21

申请人： Young Jin PARK

发明人： Young Jin PARK

IPC分类号： H01L29/02 ,  H01L21/02

CPC分类号： H01L27/0617 ,  H01L27/0629 ,  H01L27/08

摘要： The present invention relates to a semiconductor device and a method of manufacturing the same. A high-resistance silicon wafer is manufactured in such a manner that a large-sized silicon wafer manufactured by the Czochralski method is irradiated with neutrons, and high-resistance and low-resistance elements are simultaneously formed on the high-resistance silicon wafer. Thus, the manufacturing cost can be remarkably saved, and the reliability of products can be enhanced.

摘要翻译： 半导体器件及其制造方法技术领域本发明涉及半导体器件及其制造方法。 制造高电阻硅晶片，使用由Czochralski制造的大尺寸硅晶片用中子照射，并且在高电阻硅晶片上同时形成高电阻和低电阻元件。 因此，可以显着节省制造成本，可以提高产品的可靠性。