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90 条记录 (耗时 0.026 秒)

    Heat-dissipating substrate and fabricating method thereof
    1.
    发明授权
    Heat-dissipating substrate and fabricating method thereof 有权
    散热基板及其制造方法

    公开(公告)号：US08686295B2

    公开(公告)日：2014-04-01

    申请号：US12614407

    申请日：2009-11-07

    申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

    发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

    IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K7/20

    CPC分类号： H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

    摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

    摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

    Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
    3.
    发明授权
    Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof 有权

    公开(公告)号：US08586128B2

    公开(公告)日：2013-11-19

    申请号：US12467513

    申请日：2009-05-18

    申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    IPC分类号： B05D5/12

    CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

    Light emitting diode package
    5.
    发明申请
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US20070221928A1

    公开(公告)日：2007-09-27

    申请号：US11717154

    申请日：2007-03-13

    申请人： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seon Goo Lee ,  Seog Moon Choi ,  Sang Hyun Shin

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01078 ,  H01L2924/00014

    摘要： A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.

    摘要翻译： 发光二极管封装，散热优良，易于制造。 在发光二极管封装中，Al衬底上形成有反射杯。 至少一个发光二极管芯片设置在反射杯的底表面上。 Al阳极氧化膜延伸穿过Al衬底，以将反射杯的底表面分成多个衬底电极。 这里，至少一个基板电极被Al阳极氧化膜包围。 此外，基板电极分别连接到发光二极管芯片。

    Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same
    8.
    发明授权
    Light emitting diode package, circuit board for light emitting diode package and method of manufacturing the same 有权
    发光二极管封装，发光二极管封装的电路板及其制造方法

    公开(公告)号：US07863640B2

    公开(公告)日：2011-01-04

    申请号：US11710436

    申请日：2007-02-26

    申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

    IPC分类号： H01L23/34 ,  H05K1/14

    CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

    摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。

    Ligth emitting device package and method of manufacturing the same
    10.
    发明申请
    Ligth emitting device package and method of manufacturing the same 有权
    第一发光器件封装及其制造方法

    公开(公告)号：US20090267505A1

    公开(公告)日：2009-10-29

    申请号：US12213241

    申请日：2008-06-17

    申请人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

    发明人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

    IPC分类号： H01J1/62 ,  H01L31/00 ,  H01J9/02

    CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48227

    摘要： The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

    摘要翻译： 本发明涉及一种发光器件封装及其制造方法。 提供了一种包括金属芯的发光器件封装; 形成在金属芯上的绝缘层; 形成在所述绝缘层上的金属层; 通过去除金属层和绝缘层的部分以暴露金属芯的顶表面而形成的第一腔; 以及直接安装在第一腔中的金属芯的顶表面上的发光器件，并且还提供了制造发光器件封装的方法。