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    Antenna structure
    1.
    发明授权
    Antenna structure 有权
    天线结构

    公开(公告)号：US09123994B2

    公开(公告)日：2015-09-01

    申请号：US13482453

    申请日：2012-05-29

    申请人： Young-ju Lee ,  Byung-chul Kim ,  Jung-min Park

    发明人： Young-ju Lee ,  Byung-chul Kim ,  Jung-min Park

    IPC分类号： H01Q1/36 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q9/04

    CPC分类号： H01Q1/36 ,  H01Q1/2291 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q9/0414

    摘要： An antenna structure includes: a substrate; a ground layer disposed on a first surface of the substrate; a patch antenna unit which is disposed on a second surface of the substrate opposite to the first surface of the substrate, and is configured to receive a signal to be radiated; and a three-dimensional (3D) antenna unit which comprises a shorting leg that is shorted with the patch antenna unit, and is configured to radiate the signal received by the patch antenna unit.

    摘要翻译： 天线结构包括：基板; 设置在所述基板的第一表面上的接地层; 贴片天线单元，设置在与基板的第一表面相对的基板的第二表面上，并且被配置为接收要辐射的信号; 以及三维（3D）天线单元，其包括与所述贴片天线单元短路的短路支路，并且被配置为辐射由所述贴片天线单元接收的信号。

    Method of fabricating metal-insulator-metal capacitor and metal-insulator-metal capacitor manufactured by the method
    3.
    发明申请
    Method of fabricating metal-insulator-metal capacitor and metal-insulator-metal capacitor manufactured by the method 有权
    通过该方法制造金属 - 绝缘体 - 金属电容器和金属 - 绝缘体 - 金属电容器的方法

    公开(公告)号：US20060163640A1

    公开(公告)日：2006-07-27

    申请号：US11339151

    申请日：2006-01-25

    申请人： Jung-min Park ,  Seok-jun Won ,  Min-woo Song ,  Yong-kuk Jeong ,  Dae-jin Kwon ,  Weon-hong Kim

    发明人： Jung-min Park ,  Seok-jun Won ,  Min-woo Song ,  Yong-kuk Jeong ,  Dae-jin Kwon ,  Weon-hong Kim

    IPC分类号： H01L29/94

    CPC分类号： H01L28/60 ,  H01L23/5223 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a method of fabricating a metal-insulator-metal (MIM) capacitor and a metal-insulator-metal (MIM) capacitor fabricated according to the method, the method comprises: forming an insulating-layer pattern on a semiconductor substrate, the insulating-layer pattern having a plurality of openings that respectively define areas where capacitor cells are to be formed; forming a lower electrode conductive layer on the insulating-layer pattern and on the semiconductor substrate; forming a first sacrificial layer that fills the openings on the lower electrode conductive layer; forming a second sacrificial layer on of the first sacrificial layer; planarizing the second sacrificial layer; exposing an upper surface of the lower electrode conductive layer; removing the exposed lower electrode conductive layer to form a plurality of lower electrodes that are separated from each other, each corresponding to a capacitor cell; and forming dielectric layers and upper electrodes, that are separated from each other, each corresponding to a capacitor cell, on each of the lower electrodes to provide a plurality of MIM capacitor cells constituting one capacitor to which the same electric signal is applied.

    摘要翻译： 在制造根据该方法制造的金属 - 绝缘体 - 金属（MIM）电容器和金属 - 绝缘体 - 金属（MIM））电容器的方法中，所述方法包括：在半导体衬底上形成绝缘层图案， 层图案具有分别限定要形成电容器单元的区域的多个开口; 在绝缘层图案和半导体衬底上形成下电极导电层; 形成填充所述下电极导电层上的开口的第一牺牲层; 在所述第一牺牲层上形成第二牺牲层; 平面化第二牺牲层; 暴露下电极导电层的上表面; 去除暴露的下电极导电层以形成彼此分离的多个下电极，每个相应于电容器单元; 并且在每个下电极上形成各自对应于电容器单元的电介质层和上电极，以提供构成相同电信号的一个电容器的多个MIM电容器单元。

    Method of fabricating metal-insulator-metal capacitor and metal-insulator-metal capacitor manufactured by the method
    6.
    发明授权
    Method of fabricating metal-insulator-metal capacitor and metal-insulator-metal capacitor manufactured by the method 有权
    通过该方法制造金属 - 绝缘体 - 金属电容器和金属 - 绝缘体 - 金属电容器的方法

    公开(公告)号：US07732296B2

    公开(公告)日：2010-06-08

    申请号：US11339151

    申请日：2006-01-25

    申请人： Jung-min Park ,  Seok-jun Won ,  Min-woo Song ,  Yong-kuk Jeong ,  Dae-jin Kwon ,  Weon-hong Kim

    发明人： Jung-min Park ,  Seok-jun Won ,  Min-woo Song ,  Yong-kuk Jeong ,  Dae-jin Kwon ,  Weon-hong Kim

    IPC分类号： H01L21/20

    CPC分类号： H01L28/60 ,  H01L23/5223 ,  H01L2924/0002 ,  H01L2924/00

    摘要： In a method of fabricating a metal-insulator-metal (MIM) capacitor and a metal-insulator-metal (MIM) capacitor fabricated according to the method, the method comprises: forming an insulating-layer pattern on a semiconductor substrate, the insulating-layer pattern having a plurality of openings that respectively define areas where capacitor cells are to be formed; forming a lower electrode conductive layer on the insulating-layer pattern and on the semiconductor substrate; forming a first sacrificial layer that fills the openings on the lower electrode conductive layer; forming a second sacrificial layer on of the first sacrificial layer; planarizing the second sacrificial layer; exposing an upper surface of the lower electrode conductive layer; removing the exposed lower electrode conductive layer to form a plurality of lower electrodes that are separated from each other, each corresponding to a capacitor cell; and forming dielectric layers and upper electrodes, that are separated from each other, each corresponding to a capacitor cell, on each of the lower electrodes to provide a plurality of MIM capacitor cells constituting one capacitor to which the same electric signal is applied.

    摘要翻译： 在制造根据该方法制造的金属 - 绝缘体 - 金属（MIM）电容器和金属 - 绝缘体 - 金属（MIM））电容器的方法中，所述方法包括：在半导体衬底上形成绝缘层图案， 层图案具有分别限定要形成电容器单元的区域的多个开口; 在绝缘层图案和半导体衬底上形成下电极导电层; 形成填充所述下电极导电层上的开口的第一牺牲层; 在所述第一牺牲层上形成第二牺牲层; 平面化第二牺牲层; 暴露下电极导电层的上表面; 去除暴露的下电极导电层以形成彼此分离的多个下电极，每个相应于电容器单元; 并且在每个下电极上形成各自对应于电容器单元的电介质层和上电极，以提供构成相同电信号的一个电容器的多个MIM电容器单元。

    Method of Manufacturing Memory Device
    9.
    发明申请
    Method of Manufacturing Memory Device 审中-公开
    制造存储器件的方法

    公开(公告)号：US20080081409A1

    公开(公告)日：2008-04-03

    申请号：US11858674

    申请日：2007-09-20

    申请人： Min-woo Song ,  Seok-jun Won ,  Weon-hong Kim ,  Ju-youn Kim ,  Jung-min Park

    发明人： Min-woo Song ,  Seok-jun Won ,  Weon-hong Kim ,  Ju-youn Kim ,  Jung-min Park

    IPC分类号： H01L21/8242

    CPC分类号： H01L28/90 ,  H01L27/10817 ,  H01L27/10852

    摘要： A method of manufacturing a memory device that improves electrical characteristics of an MIM capacitor using a zirconium oxide film (ZrO2) as a dielectric film includes: forming a lower metal electrode on a semiconductor substrate; forming a two or more-layered dielectric film including zirconium oxide films on the lower metal electrode; forming an upper metal electrode on the dielectric film; forming an MIM capacitor by patterning the upper metal electrode, the dielectric film, and the lower metal electrode; forming an interlayer insulating film covering the MIM capacitor; forming contacts in the insulating film; and performing heat treatment at a temperature range of 425 to 500° C.

    摘要翻译： 制造使用氧化锆膜（ZrO 2/2）作为电介质膜的MIM电容器的电气特性的存储器件的制造方法包括：在半导体衬底上形成下部金属电极; 在下金属电极上形成包含氧化锆膜的两层或多层电介质膜; 在所述电介质膜上形成上金属电极; 通过图案化上金属电极，电介质膜和下金属电极形成MIM电容器; 形成覆盖所述MIM电容器的层间绝缘膜; 在绝缘膜中形成接触; 并在425〜500℃的温度范围进行热处理。

    Method of Forming A Metallic Oxide Film Using Atomic Layer Deposition
    10.
    发明申请
    Method of Forming A Metallic Oxide Film Using Atomic Layer Deposition 审中-公开
    使用原子层沉积形成金属氧化物膜的方法

    公开(公告)号：US20080075881A1

    公开(公告)日：2008-03-27

    申请号：US11828897

    申请日：2007-07-26

    申请人： Seok-jun Won ,  Ju-youn Kim ,  Jung-min Park

    发明人： Seok-jun Won ,  Ju-youn Kim ,  Jung-min Park

    IPC分类号： C23C16/513 ,  C23C16/56

    CPC分类号： C23C16/4405 ,  C23C16/40 ,  C23C16/515

    摘要： A method of forming a metallic oxide film using atomic layer deposition includes loading a substrate into a reactor, supplying a metallic source gas into the reactor and absorbing the metallic source gas onto the substrate, purging the remaining metallic source gas that does not react, with the substrate, and directly producing plasma of an N-group-containing oxide reactant gas in the reactor.

    摘要翻译： 使用原子层沉积法形成金属氧化物膜的方法包括将基板装载到反应器中，将金属源气体供应到反应器中并将金属源气体吸收到基板上，将剩余的不起反应的金属源气体与 并且在反应器中直接生成含有N基团的氧化物反应物气体的等离子体。