Abstract:
An activation system for electronic urinal comprises a urinal fluidly communicated with an inlet pipe and a control unit arranged between the urinal and the inlet pipe. The control unit includes a solenoid valve, a sensor, and a power supply. The solenoid valve is used for controlling to water or seal. The sensor is electrically connected to the solenoid valve. The power supply provides power to the solenoid valve and the sensor. The control unit has an activation switch which is electrically connected to the solenoid valve. The activation switch has a wireless transmission module and a timing controller for turning off the wireless transmission module. The activation switch is pressed so that the wireless transmission module is activated to set water discharge and a turn-off time of the solenoid valve and is turned off after a preset time counted by the time controller to save power.
Abstract:
A method for forming a semiconductor structure includes providing a semiconductor substrate; forming a gate dielectric layer over the semiconductor substrate; forming a gate electrode layer over the gate dielectric layer; doping carbon and nitrogen into the gate electrode layer; and, after the step of doping carbon and nitrogen, patterning the gate dielectric layer and the gate electrode layer to form a gate dielectric and a gate electrode, respectively.
Abstract:
The present invention discloses a standby current erasion circuit applied in DRAM, which improves prior art word line driving circuit to have the word line voltage outputted in standby mode be equal to the bit line voltage, thereby the short DC standby current between the word line and bit line can be erased.
Abstract:
A semiconductor device formed in a semiconductor substrate for dissipating electrostatic discharge and/or accumulated charge in an integrated circuit is provided. In one embodiment, the device comprises a semiconductor substrate; a plurality of layers of metal lines formed overlying the substrate; a plurality of via plugs through intermetal dielectric layers between the layers of metal lines and wherein the via plugs interconnect the metal lines; and a dummy pad formed over the plurality of layers of metal lines, the dummy pad having a diode connected thereto and to ground for providing a discharge path for the electrostatic discharge and/or accumulated charge.
Abstract:
A test key for monitoring GC-DT misalignment is provided. Deep trench capacitors are embedded in an interlacing matrix manner. GC lines are defined on a substrate and passing over the deep trench capacitors. A first bit line contact pattern surrounded by first assistant bit line contact patterns is disposed on the right side of a first deep trench capacitor. A second bit line contact pattern surrounded by second assistant bit line contact patterns is disposed on the left side of a second deep trench capacitor. The test key has a mirror symmetric line. The first assistant bit line contact patterns and second assistant bit line contact patterns are symmetric with respect to the mirror symmetric line. An active area connects the first bit line contact pattern and the second bit line contact pattern. A signal-in bit line is connected to the first bit line contact and a signal-out bit line is connected to the second bit line contact. The rest rows of the bit lines are dummy bit lines and floating.
Abstract:
An integrated circuit package bond pad includes an insulating layer and an electrode located over the insulating layer. The electrode has a first surface configured to be bonded to external circuitry and a second surface opposite the first surface. A plurality of conductive members is located in the insulating layer, wherein ones of the plurality of conductive members contact the second surface of the electrode.
Abstract:
A method for refreshing a memory capacitor is provided. First, the refresh controller provides a refresh control signal. The pre-decoded row address counter counts and outputs a regular pre-decoded row address in response to the refresh control signal. The regular pre-decoded row address is inputted to the pre-decoded row address re-driver to obtain a row address. The memory capacitor in response to the row address is refreshed.
Abstract:
A test device for detecting current leakage between deep trench capacitors in DRAM devices. The test device is disposed in a scribe line region of a wafer. In the test device, a first trench capacitor pair has a first deep trench capacitor and a second deep trench capacitor connected in parallel. A first transistor has a first terminal electrically coupled to the first deep trench capacitor and a control terminal electrically coupled to a first word line. A second transistor has a first terminal electrically coupled to the second deep trench capacitor and a control terminal electrically coupled to a second word line. First and second bit lines are electrically coupled to the first and second transistors respectively. The first and second bit lines are separated and the first and second word lines are perpendicular to the bit line regions.
Abstract:
A semiconductor device formed in a semiconductor substrate for dissipating electrostatic discharge and/or accumulated charge in an integrated circuit is provided. In one embodiment, the device comprises a semiconductor substrate; a plurality of layers of metal lines formed overlying the substrate; a plurality of via plugs through intermetal dielectric layers between the layers of metal lines and wherein the via plugs interconnect the metal lines; and a dummy pad formed over the plurality of layers of metal lines, the dummy pad having a diode connected thereto and to ground for providing a discharge path for the electrostatic discharge and/or accumulated charge.
Abstract:
An integrated circuit package bond pad includes an insulating layer and an electrode located over the insulating layer. The electrode has a first surface configured to be bonded to external circuitry and a second surface opposite the first surface. A plurality of conductive members is located in the insulating layer, wherein ones of the plurality of conductive members contact the second surface of the electrode.