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公开(公告)号：US07984545B2
公开(公告)日：2011-07-26
申请号：US12220746
申请日：2008-07-25
CPC分类号： B23K20/007 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2201/10727 , H05K2203/041 , H05K2203/086 , H05K2203/107 , Y02P70/613 , Y10T29/49021 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903 , Y10T29/49032 , Y10T29/49169 , Y10T29/5313
摘要： Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.
摘要翻译： 有助于减少回流焊接头部滑块和悬架的连接端子所需的非活性气体量的方法。 非活性气体从回流装置的喷嘴吹向磁头滑块和悬架的互连接头。 磁头滑块被粘合到万向节舌头上。 喷嘴包括惰性气体通过的管道和装配在管的喷射出口中的多孔构件。 将多孔构件放置在头部滑块附近实现有效地减少焊球周围的氧浓度。
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公开(公告)号：US20090025205A1
公开(公告)日：2009-01-29
申请号：US12220746
申请日：2008-07-25
IPC分类号： G11B5/127
CPC分类号： B23K20/007 , H05K3/3442 , H05K3/3478 , H05K3/3494 , H05K2201/10727 , H05K2203/041 , H05K2203/086 , H05K2203/107 , Y02P70/613 , Y10T29/49021 , Y10T29/49025 , Y10T29/49027 , Y10T29/4903 , Y10T29/49032 , Y10T29/49169 , Y10T29/5313
摘要： Embodiments of the present invention help to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. In an embodiment of the present invention, inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.
摘要翻译： 本发明的实施例有助于减少回流到磁头滑块和悬架的互连连接端子所需的非活性气体的量。 在本发明的一个实施方案中，惰性气体从回流装置的喷嘴吹向磁头滑块和悬架的互连接头。 磁头滑块被粘合到万向节舌头上。 喷嘴包括惰性气体通过的管道和装配在管的喷射出口中的多孔构件。 将多孔构件放置在头部滑块附近实现有效地减少焊球周围的氧浓度。
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公开(公告)号：US20110132879A1
公开(公告)日：2011-06-09
申请号：US12961989
申请日：2010-12-07
IPC分类号： B23K9/04
CPC分类号： B23K1/0016 , B23K1/0056 , B23K3/0623
摘要： A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.
摘要翻译： 一种用于连接电气部件的方法该方法包括将一块金属保持在喷嘴内，向喷嘴供给惰性气体，并且在所供应的惰性气体从喷嘴中的孔流动的同时用光源照射保留的金属片。 金属被光源熔化。 该方法还包括通过所提供的惰性气体将熔融的金属从喷嘴喷射到电气部件上。
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4.发明授权公开(公告)号：US07583475B2
公开(公告)日：2009-09-01
申请号：US11066949
申请日：2005-02-25
申请人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
发明人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
IPC分类号： G11B5/48
CPC分类号： H05K3/3442 , G11B5/4853 , H05K1/111 , H05K2201/0397 , H05K2201/09663 , H05K2201/0969 , H05K2201/09745 , H05K2201/10727 , H05K2203/041 , Y02P70/611 , Y02P70/613
摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.
摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。
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公开(公告)号：US07137189B2
公开(公告)日：2006-11-21
申请号：US10964224
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
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公开(公告)号：US06879465B2
公开(公告)日：2005-04-12
申请号：US10459343
申请日：2003-06-11
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
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公开(公告)号：US07168154B2
公开(公告)日：2007-01-30
申请号：US10964187
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要翻译： 一体化引线悬架包括放置在设置在悬架的弯曲部上的引线布线焊盘之间的焊球和设置在头部万向节部分的滑块上的焊盘。 引线接线板和接合焊盘通过熔化焊球进行焊接。 结果，在引线布线焊盘的表面的中心线附近，使用重力提供了通过表面凸起部分放置焊球的凹部。 以这种方式，当通过焊球连接接合焊盘和引线接线焊盘时，焊球的位置不会偏离中心线。
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公开(公告)号：US07137188B2
公开(公告)日：2006-11-21
申请号：US10963671
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
摘要翻译： 一体化引线悬架包括放置在设置在悬架的弯曲部上的引线布线焊盘之间的焊球和设置在头部万向节部分的滑块上的焊盘。 引线接线板和接合焊盘通过熔化焊球进行焊接。 结果，在引线布线焊盘的表面的中心线附近，使用重力提供了通过表面凸起部分放置焊球的凹部。 以这种方式，当通过焊球连接接合焊盘和引线接线焊盘时，焊球的位置不会偏离中心线。
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9.发明申请公开(公告)号：US20050199680A1
公开(公告)日：2005-09-15
申请号：US11066949
申请日：2005-02-25
申请人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
发明人： Yuhsuke Matsumoto , Tatsumi Tsuchiya , Takaaki Murokawa , Yoshio Uematsu , Tatsushi Yoshida , Nobuyuki Hashi , Hiroyasu Tsuchida , Takuma Muraki
CPC分类号： H05K3/3442 , G11B5/4853 , H05K1/111 , H05K2201/0397 , H05K2201/09663 , H05K2201/0969 , H05K2201/09745 , H05K2201/10727 , H05K2203/041 , Y02P70/611 , Y02P70/613
摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.
摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。
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公开(公告)号：US20050047009A1
公开(公告)日：2005-03-03
申请号：US10964187
申请日：2004-10-13
申请人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
发明人： Tatsumi Tsuchiya , Yuhsuke Matsumoto , Takaaki Murokawa , Naoki Fujii , Takuya Satoh , Yasuhiro Mita , Hiroyasu Tsuchida , Yoshio Uematsu
CPC分类号： G11B5/4853 , G11B5/484 , G11B5/486 , H01L2224/742 , H05K1/189 , H05K3/3442 , H05K3/3494 , H05K2201/0397 , H05K2201/09663 , H05K2201/09745 , H05K2203/041 , H05K2203/107 , H05K2203/159 , Y02P70/613 , Y10T29/49025 , Y10T29/4903 , Y10T29/49032 , Y10T29/49046 , Y10T29/49144 , Y10T29/49179
摘要： An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.
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