公开(公告)号：US20110189835A1

公开(公告)日：2011-08-04

申请号：US13017218

申请日：2011-01-31

申请人： Yuki Sugo ,  Shumpei Tanaka ,  Takeshi Matsumura ,  Yasushi Inoue

发明人： Yuki Sugo ,  Shumpei Tanaka ,  Takeshi Matsumura ,  Yasushi Inoue

IPC分类号： H01L21/78 ,  B32B7/12

CPC分类号： B32B7/12 ,  H01L21/6836 ,  H01L21/78 ,  Y10T428/263 ,  Y10T428/2809

摘要： There is provided a new film for manufacturing a semiconductor device that is superior to prevent contamination of a semiconductor chip having an excellent balance of holding power during dicing a semiconductor wafer even where the semiconductor wafer is thin, peeling property when peeling the semiconductor chip that is obtained by dicing together with its adhesive layer, and low contamination property in which there is no attachment of cutting debris to the semiconductor chip. A film for manufacturing a semiconductor device that is used when manufacturing a semiconductor device has a base layer, a first pressure-sensitive adhesive layer that is provided on the base layer, a radiation curing-type second pressure-sensitive adhesive layer that is provided on the first pressure-sensitive adhesive layer and cured by radiation irradiation in advance, and an adhesive layer that is provided on the second pressure-sensitive adhesive layer.

摘要翻译： 提供了一种用于制造半导体器件的新膜，即使在半导体晶片较薄时也能够防止在半导体晶片切割期间具有优异的保持平衡的半导体芯片的污染，并且剥离半导体芯片时的剥离性 通过与其粘合剂层一起切割获得的低污染特性，其中没有将切屑附着到半导体芯片。 制造半导体器件时使用的半导体器件用薄膜，具有基底层，设置在基底层上的第一粘合剂层，设置在基底层上的辐射固化型第二压敏粘合剂层 预先通过辐射照射固化的第一粘合剂层和设置在第二压敏粘合剂层上的粘合剂层。

公开(公告)号：US08638001B2

公开(公告)日：2014-01-28

申请号：US13473397

申请日：2012-05-16

申请人： Yuta Kimura ,  Yasushi Inoue ,  Takeshi Matsumura

发明人： Yuta Kimura ,  Yasushi Inoue ,  Takeshi Matsumura

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L21/322

CPC分类号： H01L23/295 ,  C08K3/22 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.

摘要翻译： 本发明的目的是提供一种粘合片，其可以在制造半导体器件的各种工艺期间捕获从外部混入的阳离子，以防止要制造的半导体器件的电特性的劣化并提高产品的可靠性。 作为用于制造半导体器件的粘合片，其中当将2.5g粘合片浸泡在含有10ppm铜离子的50ml水溶液中时，将溶液在120℃下放置20小时， 水溶液中的铜离子的浓度为0〜9.9ppm。

公开(公告)号：US08659157B2

公开(公告)日：2014-02-25

申请号：US13477349

申请日：2012-05-22

申请人： Yuta Kimura ,  Yasushi Inoue ,  Takeshi Matsumura

发明人： Yuta Kimura ,  Yasushi Inoue ,  Takeshi Matsumura

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L21/20 ,  H01L23/31

CPC分类号： H01L21/6836 ,  C08L33/12 ,  C09J133/08 ,  C09J163/00 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  C08L63/00 ,  C08L71/00

摘要： An object of the present invention is to provide an adhesive composition that can form an adhesive sheet for producing a semiconductor device capable of suppressing deterioration in ion scavengeability after the adhesive sheet goes through thermal history. It is an adhesive composition for producing a semiconductor device containing at least an organic complex-forming compound that forms a complex with cations, and the 5% weight loss temperature of the organic complex-forming compound measured by thermogravimetry is 180° C. or more.

摘要翻译： 本发明的目的是提供一种可以形成用于制造半导体器件的粘合片的粘合剂组合物，该半导体器件能够抑制粘合片经过热历史后的离子清除能力的劣化。 它是用于制造半导体器件的粘合剂组合物，其至少包含与阳离子形成络合物的有机络合物形成化合物，并且通过热重分析测量的有机络合物形成化合物的5重量％失重温度为180℃以上 。

公开(公告)号：US08642362B2

公开(公告)日：2014-02-04

申请号：US13403467

申请日：2012-02-23

申请人： Hisataka Ito ,  Yasushi Inoue ,  Sadahito Misumi

发明人： Hisataka Ito ,  Yasushi Inoue ,  Sadahito Misumi

IPC分类号： H01L33/52

CPC分类号： H01L33/52 ,  H01L24/17 ,  H01L33/0079 ,  H01L33/44 ,  H01L2224/16225 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/0016 ,  H01L2924/00

摘要： A method for producing a light-emitting diode device includes the steps of: preparing a light-emitting laminate including an optical semiconductor layer, and an electrode unit formed on the optical semiconductor layer; forming an encapsulating resin layer on the optical semiconductor layer so as to cover the electrode unit, the encapsulating resin layer containing a light reflection component; partially removing the encapsulating resin layer so as to expose the top face of the electrode unit, thereby producing a light-emitting diode element; and disposing the light-emitting diode element and a base substrate provided with terminals so that the light-emitting diode element and the base substrate face each other, and that the electrode unit and the terminals are electrically connected, thereby flip chip mounting the light-emitting diode element on the base substrate.

摘要翻译： 一种发光二极管器件的制造方法，其特征在于，包括以下工序：制造包含光半导体层的发光层叠体和形成在所述光半导体层上的电极单元; 在所述光学半导体层上形成封装树脂层，以覆盖所述电极单元，所述封装树脂层包含光反射部件; 部分地去除封装树脂层以露出电极单元的顶面，从而产生发光二极管元件; 并且配置发光二极管元件和设置有端子的基底，使得发光二极管元件和基底基板彼此面对，并且电极单元和端子电连接，由此倒装芯片安装发光二极管元件， 发光二极管元件。

公开(公告)号：US20110109996A1

公开(公告)日：2011-05-12

申请号：US12642683

申请日：2009-12-18

申请人： Tetsuya Nakamura ,  Takahiro Sakai ,  Masahiko Katoh ,  Yasushi Inoue ,  Tetsuya Nakatsuka ,  Satoshi Kaneko ,  Masashi Okubo

发明人： Tetsuya Nakamura ,  Takahiro Sakai ,  Masahiko Katoh ,  Yasushi Inoue ,  Tetsuya Nakatsuka ,  Satoshi Kaneko ,  Masashi Okubo

IPC分类号： G11B5/29

CPC分类号： G11B5/4846 ,  G11B5/4813

摘要： A manufacturing method for a head-stack assembly. The method includes preparing a head-stack assembly. The method further includes placing a connection pad forming surface of a connector tab formed on an end of the trace so as to be positioned opposite to an edge of a circuit board; sliding an elastic component along a backside of the connection pad forming surface; and, stopping the elastic component on the backside and pressing the backside with the elastic component so as to press the connection pad forming surface against the edge. In addition, the method includes metal joining the connector tab and a connection pad of the circuit board by applying heat to a connection pad of the connector tab and the connection pad on the circuit board while pressing the connection pad forming surface against the edge with the elastic component; and, removing the elastic component after the metal joining.

摘要翻译： 一种头部堆叠组件的制造方法。 该方法包括制备头 - 堆叠组件。 该方法还包括将形成在迹线端部上的连接片的形成表面放置成与电路板的边缘相对定位; 沿着连接垫形成表面的后侧滑动弹性部件; 并且在后侧停止弹性部件并用弹性部件按压后侧，以将连接垫形成表面压靠在边缘上。 此外，该方法包括通过向连接器接头的连接焊盘和电路板上的连接焊盘施加热而将连接器接头和电路板的连接焊盘接合，同时将连接焊盘形成表面压靠在边缘上 弹性组分; 并且在金属接合之后移除弹性部件。

公开(公告)号：US07494108B2

公开(公告)日：2009-02-24

申请号：US11414930

申请日：2006-05-01

申请人： Yasushi Inoue ,  Kouji Higuchi ,  Hitoshi Umezawa

发明人： Yasushi Inoue ,  Kouji Higuchi ,  Hitoshi Umezawa

IPC分类号： F16K31/12

CPC分类号： F16K31/506 ,  F02M26/54 ,  F16K1/04 ,  F16K31/04

摘要： A motor-operated valve has a rotor unit in a can, and is rotationally driven by a stator unit. The rotation of the rotor unit is transmitted to a screw feed member. A stem member fixed to a valve body is engaged threadedly with the screw feed member by a first screw portion. At the same time, the screw feed member is engaged threadedly with an external thread portion fixed to a valve stem by the second screw portion. The first screw portion and the second screw portion constitute a differential screw mechanism, and feeds the valve stem according to a difference in pitch.

摘要翻译： 电动阀具有在罐中的转子单元，并且由定子单元旋转驱动。 转子单元的旋转传递到螺杆进给构件。 固定在阀体上的阀杆部件通过第一螺纹部分与螺杆进给部件螺纹接合。 同时，螺杆进给构件通过第二螺钉部分与固定到阀杆的外螺纹部分螺纹接合。 第一螺纹部分和第二螺纹部分构成差速螺旋机构，并且根据间距的差异供给阀杆。

公开(公告)号：US20050257800A1

公开(公告)日：2005-11-24

申请号：US11133164

申请日：2005-05-18

申请人： Yasushi Inoue

发明人： Yasushi Inoue

IPC分类号： A46B11/02 ,  A45D24/26 ,  A46B9/02 ,  A46B11/00 ,  A46B15/00 ,  B65D83/00 ,  A45D24/22 ,  A45D24/04 ,  B67D5/00

CPC分类号： A45D24/26 ,  A46B11/0041 ,  A46B2200/1046

摘要： A hair care equipment has: a brush part, having a plurality of projections; and a liquid-containing-part, connected in a separable manner to the brush part; the above-mentioned brush part in turn comprising: a projection assembly, having at least one liquid introduction projection, which is equipped in the interior with an outflow hole that enables a liquid stored in the above-mentioned liquid-containing part to flow out from a tip; and a supporting body, equipped with a supporting member, which replaceably supports the projection assembly, and a mounting member, onto which the above-mentioned liquid-containing part can be mounted, and having introduction holes, which introduce the liquid from the liquid-containing part and communicate with the above-mentioned outflow holes in the state in which the projection assembly and the supporting body are coupled.

摘要翻译： 护发设备具有：刷部，具有多个突起; 以及液体收纳部，其以可分离的方式连接到所述刷部; 上述刷子部分又包括：具有至少一个液体引入突起的突起组件，其在内部装备有流出孔，使得储存在上述液体容纳部分中的液体能够从 一个提示; 以及支撑体，其具有可替换地支撑突起组件的支撑构件和可以安装上述液体容纳部的安装构件，并且具有导入孔， 在突起组件和支撑体联接的状态下与上述流出孔连通。

公开(公告)号：US06770475B1

公开(公告)日：2004-08-03

申请号：US09936145

申请日：2001-09-07

申请人： Yasushi Inoue ,  Naoya Fushimi ,  Hiroyuki Mizubuchi ,  Yoshie Yamamoto ,  Yoshie Ohshima ,  Nozomu Yasutake ,  Shinsuke Miyoshi

发明人： Yasushi Inoue ,  Naoya Fushimi ,  Hiroyuki Mizubuchi ,  Yoshie Yamamoto ,  Yoshie Ohshima ,  Nozomu Yasutake ,  Shinsuke Miyoshi

IPC分类号： C12N1500

CPC分类号： C12N15/75

摘要： A promoter having a higher activity than that of an &agr;-amylase promoter of a microorganism of the genus Bacillus can be provided by introducing at least one restriction site sequence in the vicinity of the 3′ end of the promoter of the &agr;-amylase derived from the microorganism of the genus Bacillus.

摘要翻译： 具有比芽孢杆菌属微生物的α-淀粉酶启动子活性更高的活性的启动子可以通过在源自α-淀粉酶的α-淀粉酶的启动子的3'末端附近引入至少一个限制性位点序列来提供 芽孢杆菌属的微生物。

公开(公告)号：US06373000B1

公开(公告)日：2002-04-16

申请号：US09735893

申请日：2000-12-14

申请人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui ,  Masayuki Kaneto ,  Shinya Ota

发明人： Kei Nakamura ,  Masakazu Sugimoto ,  Yasushi Inoue ,  Megumu Nagasawa ,  Takuji Okeyui ,  Masayuki Kaneto ,  Shinya Ota

IPC分类号： H01R2372

摘要： A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

公开(公告)号：US06320096B1

公开(公告)日：2001-11-20

申请号：US09028057

申请日：1998-02-23

申请人： Yasushi Inoue ,  Toshifumi Otsubo

发明人： Yasushi Inoue ,  Toshifumi Otsubo

IPC分类号： A61F1315

CPC分类号： A61F13/51305 ,  A61F13/5116 ,  A61F13/5123

摘要： Disposable training pants includes a liquid-permeable topsheet layer, a liquid-impermeable backsheet layer and a liquid-absorbent core disposed therebetween. The topsheet layer is formed in a transverse middle thereof overlying at least a crotch region of the pants with a liquid-impermeable zone having a hydrophobicity higher than the laterally adjacent zones.

摘要翻译： 一次性训练裤包括液体可渗透的顶片层，液体不可渗透的底片层和设置在其间的吸液性芯。 顶片层的横向中间形成在裤子的至少裆部区域上，其中不透液区域的疏水性高于横向相邻区域。