公开(公告)号：US08759953B2

公开(公告)日：2014-06-24

申请号：US11461855

申请日：2006-08-02

申请人： Yuki Yamamoto ,  Jun Harada ,  Hiroshi Takagi ,  Katsuro Hirayama

发明人： Yuki Yamamoto ,  Jun Harada ,  Hiroshi Takagi ,  Katsuro Hirayama

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2224/0401

摘要： In an electronic component, an active chip element and a passive chip element are respectively enclosed within first and second resin layers, which are separately disposed on upper and lower surfaces of a core substrate, respectively. The first resin layer includes a shielding metal film disposed on an upper surface thereof and a first via-hole conductor which connects the shielding metal film with a circuit pattern provided on the core substrate. The second resin layer includes an external-terminal electrode disposed on a lower surface thereof and a second via-hole conductor which connects the external-terminal electrode with a circuit pattern provided on the core substrate.

摘要翻译： 在电子部件中，分别将有源芯片元件和无源芯片元件封装在分别设置在芯基板的上表面和下表面上的第一和第二树脂层内。 第一树脂层包括设置在其上表面上的屏蔽金属膜和将屏蔽金属膜与设置在芯基板上的电路图案相连接的第一通孔导体。 第二树脂层包括设置在其下表面上的外部末端电极和连接外部端子电极与设置在芯基板上的电路图案的第二通孔导体。

公开(公告)号：US08069558B2

公开(公告)日：2011-12-06

申请号：US12640264

申请日：2009-12-17

申请人： Katsuro Hirayama ,  Shigeo Nishimura

发明人： Katsuro Hirayama ,  Shigeo Nishimura

IPC分类号： H05K3/30 ,  H05K3/20 ,  H05K13/00 ,  H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  H01R43/00

CPC分类号： H05K1/187 ,  H05K3/205 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/382 ,  H05K2201/0355 ,  H05K2201/10636 ,  H05K2201/2081 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/1152 ,  Y02P70/611 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T29/49171

摘要： A method for manufacturing a substrate having built-in components prevents a short circuit caused by the spread of solder or conductive adhesive. Land regions to connect a circuit component and a wetting prevention region surrounding the land regions are formed on one primary surface of a metal foil. Terminal electrodes of the circuit component are electrically connected to the land regions using solder, and an uncured resin is disposed on and pressure bonded to the metal foil and the circuit component, so that a resin layer in which the circuit component is embedded is formed. Subsequently, a wiring pattern is formed by processing the metal foil. The wetting prevention region is a region obtained by roughening or oxidizing one primary surface of the metal foil so as to reduce solder wettability.

摘要翻译： 用于制造具有内置部件的基板的方法防止由焊料或导电粘合剂的扩散引起的短路。 在金属箔的一个主表面上形成用于连接电路部件和围绕焊盘区域的防止湿润区域的焊盘区域。 电路部件的端子电极使用焊料电连接到焊盘区域，并且将未固化的树脂设置在金属箔和电路部件上并压接在金属箔和电路部件上，从而形成嵌入电路部件的树脂层。 随后，通过处理金属箔形成布线图案。 润湿防止区域是通过使金属箔的一个主表面粗糙化或氧化而获得的区域，以减少焊料润湿性。