公开(公告)号：US07929316B2

公开(公告)日：2011-04-19

申请号：US12697451

申请日：2010-02-01

申请人： Satoru Noda ,  Jun Harada

发明人： Satoru Noda ,  Jun Harada

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H01L23/49822 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/141 ,  H05K1/142 ,  H05K1/186 ,  H05K1/187 ,  H05K3/284 ,  H05K3/4694 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49165

摘要： A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

摘要翻译： 复合电子部件包括具有多个绝缘层和布线图案的多层布线块和具有多个绝缘载体和布线图案的芯片型电子部件内置多层块，并且包括第一芯片型电子 零件。 多层布线块和芯片型电子元件内置多层块电气互连并布置在基本相同的平面上。

公开(公告)号：US20060267159A1

公开(公告)日：2006-11-30

申请号：US11461855

申请日：2006-08-02

申请人： Yuki YAMAMOTO ,  Jun HARADA ,  Hiroshi TAKAGI ,  Katsuro HIRAYAMA

发明人： Yuki YAMAMOTO ,  Jun HARADA ,  Hiroshi TAKAGI ,  Katsuro HIRAYAMA

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2224/0401

摘要： In an electronic component, an active chip element and a passive chip element are respectively enclosed within first and second resin layers, which are separately disposed on upper and lower surfaces of a core substrate, respectively. The first resin layer includes a shielding metal film disposed on an upper surface thereof and a first via-hole conductor which connects the shielding metal film with a circuit pattern provided on the core substrate. The second resin layer includes an external-terminal electrode disposed on a lower surface thereof and a second via-hole conductor which connects the external-terminal electrode with a circuit pattern provided on the core substrate.

摘要翻译： 在电子部件中，分别将有源芯片元件和无源芯片元件封装在分别设置在芯基板的上表面和下表面上的第一和第二树脂层内。 第一树脂层包括设置在其上表面上的屏蔽金属膜和将屏蔽金属膜与设置在芯基板上的电路图案相连接的第一通孔导体。 第二树脂层包括设置在其下表面上的外部端子电极和将外部端子电极与设置在芯基板上的电路图案相连接的第二通孔导体。

公开(公告)号：US20060081977A1

公开(公告)日：2006-04-20

申请号：US10549986

申请日：2004-10-15

申请人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

发明人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

IPC分类号： H01L23/06

CPC分类号： H05K1/186 ,  H01L23/5385 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/0154 ,  H05K2201/09436 ,  H05K2203/1581 ,  H01L2224/0401

摘要： A ceramic multilayer substrate has a ceramic laminate including a plurality of ceramic layers laminated, having a first main surface, and including internal circuit elements disposed in the inside, a resin layer having a bonding surface in contact with the first main surface of the ceramic laminate and a mounting surface opposite to the bonding surface, external electrodes, each disposed on the mounting surface of the resin layer and electrically connected to at least one of the internal circuit elements of the ceramic laminate, and a ground electrode, a dummy electrode, or capacitor electrodes disposed at an interface between the first main surface of the ceramic laminate and the bonding surface of the resin layer or in the inside of the resin layer.

摘要翻译： 陶瓷多层基板具有包括多个陶瓷层的陶瓷层叠体，具有第一主表面，并且包括设置在内部的内部电路元件，具有与陶瓷层叠体的第一主表面接触的接合面的树脂层 和与接合面相反的安装面，外部电极，各自设置在树脂层的安装面上，与陶瓷层叠体的至少一个内部电路元件电连接，接地电极，虚拟电极或 设置在陶瓷层叠体的第一主面与树脂层的接合面或树脂层内侧的界面处的电容电极。

公开(公告)号：US06321716B1

公开(公告)日：2001-11-27

申请号：US09605785

申请日：2000-06-27

申请人： Zenichiro Mashiki ,  Jun Harada

发明人： Zenichiro Mashiki ,  Jun Harada

IPC分类号： F02B1700

CPC分类号： B60T13/72 ,  F02B17/005 ,  F02B2075/125 ,  F02D41/0005 ,  F02D41/0057 ,  F02D41/3023 ,  F02D2009/024 ,  F02D2200/0406 ,  F02D2250/41 ,  F02M26/53 ,  Y02T10/128 ,  Y02T10/42

摘要： A brake booster is actuated based on negative pressure in an intake passage. When an engine is operating in the stratified charge combustion, an ECU decreases the throttle opening size to lower the pressure in the intake passage if the pressure in the brake booster, or a booster working pressure, is higher than a demanded value. When the booster working pressure is lower than the demanded value, the ECU increases the throttle opening size as the difference between the booster working pressure and the demanded value increases. Therefore, when the difference between the booster working pressure and the demanded value is small, the booster working pressure is rapidly lowered if the booster working pressure increases above the demanded value. When the difference between the booster working pressure and the demanded value is great, the pumping loss of the engine is decreased.

摘要翻译： 基于进气通道中的负压致动制动助力器。 当发动机在分级充气燃烧中运行时，如果制动助力器中的压力或助力器工作压力高于所需值，则ECU减小节气门开度大小以降低进气通道中的压力。 当助力器工作压力低于要求值时，随着增压器工作压力和要求值之间的差异增大，ECU增加了节气门开度。 因此，当增压器工作压力和要求值之间的差小时，如果增压器工作压力升高到高于所需值，则助力器工作压力快速降低。 当增压器工作压力和要求值之间的差异大时，发动机的泵送损失减小。

公开(公告)号：US6095116A

公开(公告)日：2000-08-01

申请号：US881202

申请日：1997-06-24

申请人： Souichi Matsushita ,  Mitsuru Takada ,  Yukio Yoshioka ,  Jun Harada

发明人： Souichi Matsushita ,  Mitsuru Takada ,  Yukio Yoshioka ,  Jun Harada

IPC分类号： B60W10/04 ,  B60T13/52 ,  B60T17/02 ,  B60W10/06 ,  B60W10/18 ,  F02B75/12 ,  F02D9/02 ,  F02D29/02 ,  F02D41/00 ,  F02D41/02 ,  F02D41/04 ,  F02D41/12 ,  F02D41/32 ,  F02M25/07

CPC分类号： B60T17/02 ,  F02D41/0005 ,  F02D41/32 ,  F02B2075/125 ,  F02D2009/024 ,  F02D2200/501 ,  F02D2200/703 ,  Y02T10/123 ,  Y02T10/42 ,  Y10T477/877 ,  Y10T477/878

摘要： An improved apparatus controls negative pressure in a combustion engine. The apparatus has a brake booster that is capable of increasing braking force of a vehicle by means of the negative pressure in the brake booster. A valve disposed in an air intake pressure generates the negative pressure that is supplied to the brake booster. An electric control unit controls the valve when pressure in the brake booster is in excess of a predetermined magnitude.

摘要翻译： 改进的装置控制内燃机中的负压。 该装置具有能够通过制动助力器中的负压增加车辆的制动力的制动助力器。 设置在进气压力中的阀门产生供给制动助力器的负压。 当制动助力器中的压力超过预定值时，电控单元控制阀。

公开(公告)号：US5915357A

公开(公告)日：1999-06-29

申请号：US881200

申请日：1997-06-24

申请人： Jun Harada ,  Hiroyuki Mizuno

发明人： Jun Harada ,  Hiroyuki Mizuno

IPC分类号： B60W10/04 ,  B60T13/52 ,  B60T17/02 ,  B60W10/06 ,  B60W10/18 ,  F02B17/00 ,  F02B31/00 ,  F02B31/08 ,  F02B75/12 ,  F02D9/02 ,  F02D29/02 ,  F02D41/00 ,  F02D41/02 ,  F02D41/04 ,  F02D41/12 ,  F02D41/30 ,  F02D43/00 ,  F02M25/07

CPC分类号： F02D41/3076 ,  B60T17/02 ,  F02B17/005 ,  F02B31/085 ,  F02D41/0005 ,  F02D9/02 ,  F02B2031/006 ,  F02B2075/125 ,  F02D2009/024 ,  F02D2250/41 ,  F02D41/3029 ,  Y02T10/123 ,  Y02T10/146 ,  Y02T10/42 ,  Y10T477/87 ,  Y10T477/878

摘要： An apparatus for controlling brake force of a vehicle is disclosed. Each cylinders of a vehicle engine has a combustion chamber that receives fuel from a fuel injector and air from an air intake passage. The engine selectively performs a stratified charge combustion and a uniform charge combustion. The stratified charge combustion mode is selected to increase the amount of the air and the fuel supplied to the engine and improve a combusting state of the engine. The apparatus further includes a brake booster for increasing the brake force according to the negative pressure applied thereto. The brake booster is actuated by the negative pressure an amount of which is greater than a predetermined amount. Airflow in the air intake passage is restricted to generate the negative pressure. A fuel injector directly injects the fuel into the cylinder to set the engine to perform the stratified charge combustion. An electronic control unit (ECU) measures the an amount relating to the pressure applied to the brake booster. The ECU actuates the motor means to apply the negative pressure to the brake booster when the amount is smaller than the predetermined value and converts the driving condition of the engine from the stratified charge combustion to the uniform charge combustion.

摘要翻译： 公开了一种用于控制车辆制动力的装置。 车辆发动机的每个气缸具有从燃料喷射器接收燃料的燃烧室和来自进气通道的空气。 发动机选择性地执行分层充气燃烧和均匀的充气燃烧。 选择分层充气燃烧模式以增加供应到发动机的空气和燃料的量并且改善发动机的燃烧状态。 该装置还包括用于根据施加到其上的负压增加制动力的制动助力器。 制动助力器通过负压大于预定量来启动。 进气通道中的气流被限制以产生负压。 燃料喷射器将燃料直接喷射到气缸中以使发动机执行分层充气燃烧。 电子控制单元（ECU）测量与施加到制动助力器的压力有关的量。 当该量小于预定值时，ECU致动马达装置将负压施加到制动助力器，并将发动机的驱动条件从分层充气燃烧转换成均匀的充气燃烧。

公开(公告)号：US5483795A

公开(公告)日：1996-01-16

申请号：US295917

申请日：1994-09-15

申请人： Kenji Katoh ,  Tokuta Inoue ,  Hidetaka Nohira ,  Kiyoshi Nakanishi ,  Satoshi Iguchi ,  Tetsuro Kihara ,  Masato Gotoh ,  Takamitsu Asanuma ,  Hiroshi Okano ,  Jun Harada ,  Shinichi Takeshima ,  Masahiko Sugiyama ,  Shigenori Sakurai ,  Kenji Ohkubo ,  Mikio Murachi

发明人： Kenji Katoh ,  Tokuta Inoue ,  Hidetaka Nohira ,  Kiyoshi Nakanishi ,  Satoshi Iguchi ,  Tetsuro Kihara ,  Masato Gotoh ,  Takamitsu Asanuma ,  Hiroshi Okano ,  Jun Harada ,  Shinichi Takeshima ,  Masahiko Sugiyama ,  Shigenori Sakurai ,  Kenji Ohkubo ,  Mikio Murachi

IPC分类号： B01D53/30 ,  B01D53/94 ,  F01N3/08 ,  F01N3/20 ,  F01N9/00 ,  F01N11/00 ,  F02B1/04 ,  F02D41/02

CPC分类号： B01D53/9481 ,  B01D53/30 ,  B01D53/9495 ,  F01N11/007 ,  F01N3/0814 ,  F01N3/0842 ,  F01N3/0871 ,  F01N3/0885 ,  F01N9/00 ,  F02D41/0275 ,  F01N2240/16 ,  F01N2240/18 ,  F01N2250/12 ,  F01N2430/06 ,  F01N2550/03 ,  F01N2570/04 ,  F01N2570/14 ,  F01N2610/03 ,  F01N3/20 ,  F02B1/04 ,  Y02T10/47

摘要： An NO.sub.x absorber (18) is arranged in an exhaust passage of an internal combustion engine. The NO.sub.x absorber (18) absorbs the NO.sub.x when the air-fuel ratio of the exhaust gas flowing into the NO.sub.x absorber (18) is lean while releases the absorbed NO.sub.x when the air-fuel ratio of the exhaust gas flowing into the NO.sub.x absorber (18) becomes the stoichiometric air-fuel ratio or rich. An air-fuel ratio sensor (22) is arranged in the exhaust passage downstream of the NO.sub.x absorber (18). When the air-fuel ratio detected by the air-fuel ratio sensor (22) is switched from lean to rich after the air-fuel ratio of the exhaust gas flowing into NO.sub.x absorber (18) is switched from lean to rich, it is decided that the releasing action of NO.sub.x from the NO.sub.x absorber (18) is completed.

摘要翻译： PCT No.PCT / JP94 / 00050 Sec。 371日期1994年9月15日 102（e）1994年9月15日PCT 1994年1月14日PCT PCT。 公开号WO94 / 17291 日期为1994年8月4日。在内燃机的排气通道中设置NOx吸收器（18）。 当吸入NOx吸收器（18）的废气的空燃比是稀的时，NOx吸收器（18）吸收NOx，同时当流入NOx吸收器的排气的空燃比释放吸收的NOx 18）成为化学计量空燃比或浓。 空气燃料比传感器（22）布置在NOx吸收器（18）下游的排气通道中。 在空气燃料比传感器（22）检测出的空燃比在从稀薄变为富余的排气的空燃比变为富时，将从稀燃转为浓， 来自NOx吸收器（18）的NOx的释放动作结束。

公开(公告)号：US08759953B2

公开(公告)日：2014-06-24

申请号：US11461855

申请日：2006-08-02

申请人： Yuki Yamamoto ,  Jun Harada ,  Hiroshi Takagi ,  Katsuro Hirayama

发明人： Yuki Yamamoto ,  Jun Harada ,  Hiroshi Takagi ,  Katsuro Hirayama

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2224/0401

摘要： In an electronic component, an active chip element and a passive chip element are respectively enclosed within first and second resin layers, which are separately disposed on upper and lower surfaces of a core substrate, respectively. The first resin layer includes a shielding metal film disposed on an upper surface thereof and a first via-hole conductor which connects the shielding metal film with a circuit pattern provided on the core substrate. The second resin layer includes an external-terminal electrode disposed on a lower surface thereof and a second via-hole conductor which connects the external-terminal electrode with a circuit pattern provided on the core substrate.

摘要翻译： 在电子部件中，分别将有源芯片元件和无源芯片元件封装在分别设置在芯基板的上表面和下表面上的第一和第二树脂层内。 第一树脂层包括设置在其上表面上的屏蔽金属膜和将屏蔽金属膜与设置在芯基板上的电路图案相连接的第一通孔导体。 第二树脂层包括设置在其下表面上的外部末端电极和连接外部端子电极与设置在芯基板上的电路图案的第二通孔导体。

公开(公告)号：US20100134990A1

公开(公告)日：2010-06-03

申请号：US12697451

申请日：2010-02-01

申请人： Satoru NODA ,  Jun HARADA

发明人： Satoru NODA ,  Jun HARADA

IPC分类号： H05K1/18

CPC分类号： H01L23/49822 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/141 ,  H05K1/142 ,  H05K1/186 ,  H05K1/187 ,  H05K3/284 ,  H05K3/4694 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49165

摘要： A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

摘要翻译： 复合电子部件包括具有多个绝缘层和布线图案的多层布线块和具有多个绝缘载体和布线图案的芯片型电子部件内置多层块，并且包括第一芯片型电子 零件。 多层布线块和芯片型电子元件内置多层块电气互连并布置在基本相同的平面上。

公开(公告)号：US20070188998A1

公开(公告)日：2007-08-16

申请号：US11691666

申请日：2007-03-27

申请人： Satoru NODA ,  Jun HARADA

发明人： Satoru NODA ,  Jun HARADA

IPC分类号： H05K1/03

CPC分类号： H01L23/49822 ,  H01L23/5385 ,  H01L23/552 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/19105 ,  H05K1/141 ,  H05K1/142 ,  H05K1/186 ,  H05K1/187 ,  H05K3/284 ,  H05K3/4694 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49165

摘要： A composite electronic component includes a multilayer wiring block having a plurality of insulating layers and a wiring pattern, and a chip-type electronic component built-in multilayer block having a plurality of insulating payers and a wiring pattern and including a first chip-type electronic component. The multilayer wiring block and the chip-type electronic component built-in multilayer block are electrically interconnected and arranged on substantially the same plane.

摘要翻译： 复合电子部件包括具有多个绝缘层和布线图案的多层布线块和具有多个绝缘载体和布线图案的芯片型电子部件内置多层块，并且包括第一芯片型电子 零件。 多层布线块和芯片型电子元件内置多层块电气互连并布置在基本相同的平面上。