公开(公告)号：US08443484B2

公开(公告)日：2013-05-21

申请号：US12222653

申请日：2008-08-13

申请人： Yukio Ozaki ,  Teruo Yoshino ,  Satoru Takahata ,  Reizo Nunozawa

发明人： Yukio Ozaki ,  Teruo Yoshino ,  Satoru Takahata ,  Reizo Nunozawa

IPC分类号： A47L5/38

CPC分类号： H01L21/67017 ,  H01L21/67757

摘要： To automatically purge a transfer chamber by means of inert gas. There is provided a substrate processing apparatus including a controller that performs control so that a transfer chamber 102 connected to a processing chamber 202 for processing a substrate is purged by gas, the controller having a switching unit that switches a function of exhausting the gas in the transfer chamber 102 in a set direction, and a function of circulating the gas through the transfer chamber 102 in an inert gas atmosphere.

摘要翻译： 用惰性气体自动吹扫传送室。 提供了一种基板处理装置，其包括执行控制的控制器，使得连接到用于处理基板的处理室202的传送室102被气体清除，该控制器具有切换单元，该切换单元切换排气中的气体的功能 传送室102在设定方向上，并且具有使气体在惰性气体气氛中循环通过传送室102的功能。

公开(公告)号：US20090044749A1

公开(公告)日：2009-02-19

申请号：US12222653

申请日：2008-08-13

申请人： Yukio Ozaki ,  Teruo Yoshino ,  Satoru Takahata ,  Reizo Nunozawa

发明人： Yukio Ozaki ,  Teruo Yoshino ,  Satoru Takahata ,  Reizo Nunozawa

IPC分类号： B05C11/00 ,  C23C16/52

CPC分类号： H01L21/67017 ,  H01L21/67757

摘要： To automatically purge a transfer chamber by means of inert gas. There is provided a substrate processing apparatus including a controller that performs control so that a transfer chamber 102 connected to a processing chamber 202 for processing a substrate is purged by gas, the controller having a switching unit that switches a function of exhausting the gas in the transfer chamber 102 in a set direction, and a function of circulating the gas through the transfer chamber in an inert gas atmosphere.

摘要翻译： 用惰性气体自动吹扫传送室。 提供了一种基板处理装置，其包括执行控制的控制器，使得连接到用于处理基板的处理室202的传送室102被气体清除，该控制器具有切换单元，该切换单元切换排气中的气体的功能 传送室102在设定方向上，并且在惰性气体气氛中使气体循环通过传送室。

公开(公告)号：US09437465B2

公开(公告)日：2016-09-06

申请号：US12631152

申请日：2009-12-04

申请人： Satoru Takahata ,  Yukio Ozaki ,  Reizo Nunozawa

发明人： Satoru Takahata ,  Yukio Ozaki ,  Reizo Nunozawa

IPC分类号： H01L21/203 ,  H01L21/67 ,  C23C16/52 ,  C23C16/54 ,  G05B19/4063 ,  G05B19/418

CPC分类号： H01L21/67276 ,  C23C16/52 ,  C23C16/54 ,  G05B19/4063 ,  G05B19/41875 ,  G05B2219/31437 ,  G05B2219/45031 ,  Y02P90/14 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/22

摘要： When a step is delayed, an operator can be rapidly informed of the delay. A substrate processing apparatus comprises a process system configured to process a substrate; a control unit configured to control the process system for performing a plurality of steps; and a manipulation unit configured to monitor a progress of each of the plurality of steps, wherein when a time elapsed after the control unit goes into a hold state exceeds an allowable time previously allocated to the one of the plurality of steps while waiting for a completion of the one of the plurality of steps started by the process system, the control unit transmits an alarm message to the manipulation unit so as to inform the manipulation unit that the allowable time is exceeded, terminates the hold state, and performs a recovery action.

摘要翻译： 当一个步骤被延迟时，可以迅速地通知操作者延迟。 衬底处理设备包括被配置为处理衬底的工艺系统; 控制单元，被配置为控制所述处理系统以执行多个步骤; 以及操作单元，被配置为监视所述多个步骤中的每一个的进度，其中当所述控制单元进入保持状态之后经过的时间超过预先分配给所述多个步骤中的所述一个步骤的允许时间，同时等待完成 在由处理系统启动的多个步骤中的一个步骤中，控制单元向操作单元发送报警消息，以通知操作单元超过允许时间，终止保持状态，并执行恢复动作。

公开(公告)号：US08904955B2

公开(公告)日：2014-12-09

申请号：US12389431

申请日：2009-02-20

申请人： Makoto Nomura ,  Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

发明人： Makoto Nomura ,  Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

IPC分类号： C23C16/00 ,  H01L21/67

CPC分类号： H01L21/67276

摘要： A substrate processing apparatus includes a control unit executing a first recipe for substrate processing. After the substrate processing is completed through the execution of the first recipe, if a predetermined time is elapsed in a state that a next substrate to be processed is not carried into the process chamber, a second recipe is executed for maintaining a process chamber where the substrate is processed.

摘要翻译： 基板处理装置包括执行用于基板处理的第一配方的控制单元。 在通过执行第一配方完成基板处理之后，如果在未处理下一个待处理基板的状态下经过预定时间，则执行第二配方以维持处理室 底物被处理。

公开(公告)号：US20100055808A1

公开(公告)日：2010-03-04

申请号：US12537455

申请日：2009-08-07

申请人： Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

发明人： Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

IPC分类号： H01L21/66 ,  B05C11/00

CPC分类号： H01L22/34 ,  G05B19/418 ,  G05B2219/45031 ,  H01L21/67276 ,  H01L21/67288 ,  H01L22/26 ,  Y02P90/14 ,  Y02P90/20

摘要： A substrate processing apparatus for executing a predetermined process on a substrate loaded into a process chamber by running a recipe containing a plurality of steps is provided. The recipe includes a process step of processing the substrate, and a leak check step executed before the process step to check whether a leak occurs inside the process chamber, and the substrate processing apparatus includes a main control unit configured to execute the process step while keeping an error that occurs in the leak check step.

摘要翻译： 提供了一种用于通过运行包含多个步骤的配方在装载到处理室中的基板上执行预定处理的基板处理装置。 配方包括处理基板的处理步骤和在处理步骤之前执行的检查在处理室内是否发生泄漏的泄漏检查步骤，并且基板处理装置包括主控制单元，其被配置为在保持处理步骤的同时执行处理步骤 泄漏检查步骤中发生的错误。

公开(公告)号：US20090229634A1

公开(公告)日：2009-09-17

申请号：US12389431

申请日：2009-02-20

申请人： Makoto Nomura ,  Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

发明人： Makoto Nomura ,  Yukio Ozaki ,  Reizo Nunozawa ,  Satoru Takahata

IPC分类号： B08B5/00

CPC分类号： H01L21/67276

摘要： A substrate processing apparatus comprises a control unit executing a first recipe for substrate processing. After the substrate processing is completed through the execution of the first recipe, if a predetermined time is elapsed in a state that a next substrate to be processed is not carried into the process chamber, a second recipe is executed for maintaining a process chamber where the substrate is processed.

摘要翻译： 基板处理装置包括执行用于基板处理的第一配方的控制单元。 在通过执行第一配方完成基板处理之后，如果在未处理下一个待处理基板的状态下经过预定时间，则执行第二配方以维持处理室 底物被处理。

公开(公告)号：US08457774B2

公开(公告)日：2013-06-04

申请号：US12897111

申请日：2010-10-04

申请人： Yukio Ozaki ,  Satoru Takahata ,  Ichiro Nunomura

发明人： Yukio Ozaki ,  Satoru Takahata ,  Ichiro Nunomura

IPC分类号： G06F19/00

CPC分类号： H01L21/67276

摘要： To perform a maintenance work safely by a maintenance engineer, even if the maintenance work is performed with power of a substrate processing apparatus turned-on. A substrate processing apparatus, comprising: a controller that inhibits a shift from an idling state to a standby state, when a generation of a prescribed event is detected; the controller further comprising: a shift indicating part that controls an apparatus state so as to be shifted from the idling state possible to receive an indication of execution of the recipe, being an apparatus state possible to step into the substrate processing apparatus, to the standby state possible to execute a recipe, being an apparatus state impossible to step into the substrate processing apparatus; and an event detection part that detects a generation of the prescribed event for inhibiting a shift from the idling state to the standby state and notifies the shift indicating part of the prescribed event.

摘要翻译： 为了维护工程人员进行维护工作，即使维护工作是在打开基板处理装置的电源的情况下执行的。 一种基板处理装置，包括：当检测到规定事件的产生时，禁止从怠速状态向待机状态的转移的控制器; 所述控制器还包括：移动指示部，其控制装置状态以从所述怠速状态转移，以接收所述配方的执行指示，作为可能进入所述基板处理装置的装置状态到所述待机 状态可以执行配方，作为不可能进入基板处理装置的装置状态; 以及事件检测部，其检测用于禁止从空转状态向待机状态的转换的规定事件的生成，并通知规定事件的换档指示部。

公开(公告)号：US07938160B2

公开(公告)日：2011-05-10

申请号：US12564423

申请日：2009-09-22

申请人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

发明人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

IPC分类号： B32B37/00

CPC分类号： H01L24/75 ,  H01L24/12 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/0665 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

摘要翻译： 超声波接合装置包括超声波接合单元和擦拭单元，其被构造成通过使用擦拭构件来擦拭已经粘附到头部的工具表面的预固化底部填充物。 超声波接合单元包括：第一驱动器，被配置为驱动头部将基板上的电子部件按压，以及超声波发生器。 擦拭单元包括用于擦除工具表面的擦拭台，用于将擦拭构件供给到擦拭台并卷起擦拭构件的进给机构，构造成容纳擦拭台和进给机构的盒，以及 第二驱动器，其被配置为在所述平面内驱动所述盒。 第一个驱动器被配置为将头部压在擦拭台上的擦拭构件上。

公开(公告)号：US07823618B2

公开(公告)日：2010-11-02

申请号：US12564444

申请日：2009-09-22

申请人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

发明人： Yasuyuki Masuda ,  Yukio Ozaki ,  Jun Matsueda ,  Kazuyuki Ikura ,  Taizan Kobayashi ,  Toshinori Kasuga

IPC分类号： B32B37/00

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/7592 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/0401

摘要： An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

摘要翻译： 一种超声波接合装置，包括：头部，其包括被配置为安装电子部件的工具表面;超声波接合单元，其被配置为使所述电子部件与基板超声波结合;以及擦拭单元，其构造成擦除已经粘附到所述电子部件上的预固化底部填充物 通过在擦拭台上使用擦拭构件来使头部的工具表面。 擦拭单元包括：溶剂供给单元，被配置为将构成为将底部填充剂粉末化的溶剂供给到擦拭台上的擦拭部件;被配置为容纳擦拭台的密封盒;以及供给机构，其构造成将擦拭部件供给到擦拭部 并且从擦拭台卷起擦拭构件，以及盒支撑构件，其包括构造成驱动进给机构的马达，并且可拆卸地附接到卡盘。

公开(公告)号：US06254479B1

公开(公告)日：2001-07-03

申请号：US09233645

申请日：1999-01-19

申请人： Genichiro Okitani ,  Ryosuke Toriyama ,  Takaaki Ishii ,  Yukari Shibata ,  Yukio Ozaki

发明人： Genichiro Okitani ,  Ryosuke Toriyama ,  Takaaki Ishii ,  Yukari Shibata ,  Yukio Ozaki

IPC分类号： A63F1300

CPC分类号： G07F17/34 ,  G07F17/3244

摘要： In a game machine which comprises a roulette part for rotating an indicating mark along an outside of a play field, the indicating mark is stopped in accordance with a signal from a stop switch. If the indicating mark is stopped in a center position of a prize area which is indicated with a chance gage, a payment of medals as a reward is allowed. If the indicating mark is stopped in a position which is included in the prize area but don't coincide with the center position, a process of a lottery with a random number is carried out and a gage volume of a level gage is changed in the basis of the random number. An additional chance of a payment of medals is given corresponding to a position in which the indicating mark is stopped.

摘要翻译： 在包括用于沿着游戏场的外部旋转指示标记的轮盘部分的游戏机中，根据来自停止开关的信号停止指示标记。 如果指示标记被停止在用机会表示的奖励区域的中心位置，则允许奖励作为奖励的支付。 如果指示标记被停止在包括在奖励区域中但与中心位置不一致的位置，则执行具有随机数的彩票的处理，并且在 随机数的基础。 对应于指示标记停止的位置，给予额外奖金的机会。