Camera module with circuit board
    1.
    发明授权
    Camera module with circuit board 有权
    相机模块带电路板

    公开(公告)号:US07872685B2

    公开(公告)日:2011-01-18

    申请号:US11862515

    申请日:2007-09-27

    IPC分类号: H04N5/225

    摘要: A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.

    摘要翻译: 相机模块包括图像传感器,透镜模块和电路板。 透镜模块设置在图像传感器的物体侧,并且在其上具有多个电连接点。 电路板包括主体和与主体电连接的弯曲部分。 图像传感器安装在主体上,并被接收在镜头模块和主体之间。 弯曲部分从主体的侧表面延伸,并且在对应于透镜模块的电连接点的弯曲部分上形成多个电连接点。 弯曲部分的电连接点被构造成与透镜模块的电连接点连接以向透镜模块供电。

    CAMERA MODULE WITH CIRCUIT BOARD
    2.
    发明申请
    CAMERA MODULE WITH CIRCUIT BOARD 有权
    摄像机模块与电路板

    公开(公告)号:US20080252774A1

    公开(公告)日:2008-10-16

    申请号:US11862515

    申请日:2007-09-27

    IPC分类号: H04N5/225

    摘要: A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.

    摘要翻译: 相机模块包括图像传感器,透镜模块和电路板。 透镜模块设置在图像传感器的物体侧,并且在其上具有多个电连接点。 电路板包括主体和与主体电连接的弯曲部分。 图像传感器安装在主体上,并被接收在镜头模块和主体之间。 弯曲部分从主体的侧表面延伸,并且在对应于透镜模块的电连接点的弯曲部分上形成多个电连接点。 弯曲部分的电连接点被构造成与透镜模块的电连接点连接以向透镜模块供电。

    Objective holder for camera module with notches of wall receiving passing components
    3.
    发明授权
    Objective holder for camera module with notches of wall receiving passing components 有权
    相机模块的目标持有者,其具有壁接收通过部件的凹口

    公开(公告)号:US07924344B2

    公开(公告)日:2011-04-12

    申请号:US11947081

    申请日:2007-11-29

    IPC分类号: H04N5/225

    CPC分类号: G02B7/02

    摘要: An exemplary objective holder for engaging with a PCB substrate having an image sensor and several passive components arranged thereon, includes a base and several continuously connected walls extending from the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components.

    摘要翻译: 用于与具有图像传感器和布置在其上的若干无源部件的PCB基板接合的示例性目标保持器包括基部和从基部延伸的若干连续连接的壁。 墙壁围绕一个腔室,用于接收图像传感器,并在其中限定凹口以接收无源部件。

    Objective holder for camera module
    4.
    发明授权
    Objective holder for camera module 有权
    相机模块的目标持有人

    公开(公告)号:US07670071B2

    公开(公告)日:2010-03-02

    申请号:US11950391

    申请日:2007-12-04

    IPC分类号: G03B17/00 G03B17/02

    摘要: An exemplary objective holder engages with a PCB substrate having an image sensor and several passive components arranged thereon. The passive components surround the image sensor. The objective includes a lens barrel extending from a side of a base, and a plurality of walls extending from an opposite side of the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components therein. A transparent cover is received in the objective holder between the lens barrel and the chamber. An adhesive is used to connect the objective holder to the PCB substrate. The PCB substrate is rested on the walls. At least one of the notches communicates the chamber to an exterior for outgassing and is sealed by a mass of sealing material after a heating process of the adhesive.

    摘要翻译: 示例性目标支架与具有图像传感器和布置在其上的若干无源元件的PCB基板接合。 被动元件围绕图像传感器。 该目的包括从基座的一侧延伸的透镜镜筒和从基座的相对侧延伸的多个壁。 墙壁包围一个用于接收图像传感器的腔室,并在其中限定凹口以接收其中的无源部件。 透明盖被容纳在镜筒和腔室之间的物镜夹持器中。 使用粘合剂将物镜支架连接到PCB基板。 PCB基板放置在墙壁上。 至少一个槽口将室连通到外部用于脱气,并且在粘合剂的加热过程之后被密封材料密封。

    Camera module
    5.
    发明授权
    Camera module 有权
    相机模块

    公开(公告)号:US07929052B2

    公开(公告)日:2011-04-19

    申请号:US12061883

    申请日:2008-04-03

    IPC分类号: H04N5/225

    摘要: A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module.

    摘要翻译: 相机模块包括透镜模块,图像传感器和电路板。 图像传感器模块设置在透镜模块的图像侧。 电路板与图像传感器模块电连接。 电路板包括限定在其中的接收室。 接收室接收图像传感器模块。 透镜模块安装在电路板上并覆盖接收室。 图像传感器模块固定在电路板中限定的接收室中。 因此,相机模块沿相机模块的轴线的厚度减小,并且相机模块的体积相对于传统相机模块变薄。

    Electrical device manufacturing method
    7.
    发明授权
    Electrical device manufacturing method 有权
    电气元件制造方法

    公开(公告)号:US08250731B2

    公开(公告)日:2012-08-28

    申请号:US12894160

    申请日:2010-09-30

    IPC分类号: H05K13/04 H05K13/00 G01R31/28

    摘要: An exemplary electrical device manufacturing method includes the following steps. First, a first electronic module is provided. Second, one or more functions of the electronic module are verified. Third, a support module is provided. Fourth, one or more functions of the support module are verified. Fifth, the first electronic module is attached to the support module so as to form a first integrated module. Sixth, one or more functions of the first integrated module are verified.

    摘要翻译: 一种示例性电气装置制造方法包括以下步骤。 首先,提供第一电子模块。 其次,验证电子模块的一个或多个功能。 第三,提供支持模块。 第四,验证支持模块的一个或多个功能。 第五,第一电子模块附接到支撑模块,以形成第一集成模块。 第六,验证第一集成模块的一个或多个功能。

    PROCESS FOR PREPARING AN OPTICAL WAVEGUIDE COMPONENT FROM ACRYLATE/TITANIUM ALKOXIDE COMPOSITE MATERIAL AND THE PREPARED OPTICAL WAVEGUIDE COMPONENT
    10.
    发明申请
    PROCESS FOR PREPARING AN OPTICAL WAVEGUIDE COMPONENT FROM ACRYLATE/TITANIUM ALKOXIDE COMPOSITE MATERIAL AND THE PREPARED OPTICAL WAVEGUIDE COMPONENT 失效
    从丙烯酸酯/烷基氧化铝复合材料制备光学波长成分的方法和准备好的光波长成分

    公开(公告)号:US20050048200A1

    公开(公告)日:2005-03-03

    申请号:US10649676

    申请日:2003-08-28

    IPC分类号: G02B6/122 B05D5/06

    CPC分类号: G02B6/1221

    摘要: The present invention relates to a process for preparing an optical waveguide component from acrylate/titanium alkoxide composite material, which is characterized by using an acid-free sol-gel process to prepare a precursor solution of acrylate/titanium alkoxide composite film, then coating the precursor solution on a silicon wafer then drying, and producing the optical waveguide component having channels by using a lithography process. The present invention also relates to an optical waveguide component of acrylate/titanium alkoxide composite material, the material has excellent transparency and its refractive index varies with the amount of titanium alkoxide contained therein. When an optical waveguide component is prepared from the composite the reduction of near-infrared ray is less than 0.7 dB/cm and therefore the waveguide component is advantageous for use as an optical communication element.

    摘要翻译: 本发明涉及一种由丙烯酸酯/钛醇盐复合材料制备光波导部件的方法,其特征在于使用无酸溶胶 - 凝胶法制备丙烯酸酯/钛醇盐复合膜的前体溶液,然后涂布 然后干燥,并通过使用光刻工艺制造具有通道的光波导部件。 本发明还涉及丙烯酸酯/钛醇盐复合材料的光波导部件,该材料具有优异的透明度,其折射率随其中所含的烷氧基钛的量而变化。 当从复合材料制备光波导部件时,近红外线的减少小于0.7dB / cm,因此波导部件有利于用作光通信元件。