摘要:
A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.
摘要:
A camera module includes an image sensor, a lens module and a circuit board. The lens module is disposed at an object side of the image sensor and has a plurality of electrical connection points thereon. The circuit board includes a main body and a bent portion electrically connecting with the main body. The image sensor is mounted on the main body and received between the lens module and the main body. The bent portion extends from a side surface of the main body and a plurality of electrical connection points is formed on the bent portion corresponding to the electrical connection points of the lens module. The electrical connection points of the bent portion are configured for connecting with the electrical connection points of the lens module to supply power to the lens module.
摘要:
An exemplary objective holder for engaging with a PCB substrate having an image sensor and several passive components arranged thereon, includes a base and several continuously connected walls extending from the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components.
摘要:
An exemplary objective holder engages with a PCB substrate having an image sensor and several passive components arranged thereon. The passive components surround the image sensor. The objective includes a lens barrel extending from a side of a base, and a plurality of walls extending from an opposite side of the base. The walls enclose a chamber thereamong for receiving the image sensor and define notches therein for receiving the passive components therein. A transparent cover is received in the objective holder between the lens barrel and the chamber. An adhesive is used to connect the objective holder to the PCB substrate. The PCB substrate is rested on the walls. At least one of the notches communicates the chamber to an exterior for outgassing and is sealed by a mass of sealing material after a heating process of the adhesive.
摘要:
A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module.
摘要:
The present invention relates to a stabilized monomer dispersion containing inorganic oxide nanoparticles with high refractive index in which the refractive index of the inorganic oxide nanoparticles is greater than 1.65 and the average particle size of the high refractive inorganic oxide nanoparticles ranges from 1 to 100 nm and its content is in a range of from 1.0% by weight to 10.0% by weight based on the total weight of the monomer dispersion. The present invention also relates to a process for preparing the stabilized monomer dispersion containing high refractive inorganic oxide nanoparticles.
摘要:
An exemplary electrical device manufacturing method includes the following steps. First, a first electronic module is provided. Second, one or more functions of the electronic module are verified. Third, a support module is provided. Fourth, one or more functions of the support module are verified. Fifth, the first electronic module is attached to the support module so as to form a first integrated module. Sixth, one or more functions of the first integrated module are verified.
摘要:
A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)4-x to allow the silica moiety to carry a photo-polymerizable unsaturated group; adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9 and x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.
摘要:
The present invention relates to polyimide-titania hybrid thin film, which possesses relatively good surface planarization, excellent thermal properties (400
摘要:
The present invention relates to a process for preparing an optical waveguide component from acrylate/titanium alkoxide composite material, which is characterized by using an acid-free sol-gel process to prepare a precursor solution of acrylate/titanium alkoxide composite film, then coating the precursor solution on a silicon wafer then drying, and producing the optical waveguide component having channels by using a lithography process. The present invention also relates to an optical waveguide component of acrylate/titanium alkoxide composite material, the material has excellent transparency and its refractive index varies with the amount of titanium alkoxide contained therein. When an optical waveguide component is prepared from the composite the reduction of near-infrared ray is less than 0.7 dB/cm and therefore the waveguide component is advantageous for use as an optical communication element.