摘要:
A side mirror includes a mount seat mounted to a front cowl that covers a portion of the front of a vehicle body, a mirror stay supported on the mount seat with a basal end thereof supported in a turnable manner, and a mirror provided at a tip end of the mirror stay. The mount seat includes a base portion 41a extended in one direction and mounted to the front cowl, and a support portion provided on the base portion 41a to support the basal end of the mirror stay so that a direction Dp in which a turning shaft of the mirror stay extends is inclined to a length direction DL of the base portion. With this structure, a side mirror increased in degree of freedom in selecting a mount position on a front cowl can be provided.
摘要:
A side mirror includes a mount seat mounted to a front cowl that covers a portion of the front of a vehicle body, a mirror stay supported on the mount seat with a basal end thereof supported in a turnable manner, and a mirror provided at a tip end of the mirror stay. The mount seat includes a base portion 41a extended in one direction and mounted to the front cowl, and a support portion provided on the base portion 41a to support the basal end of the mirror stay so that a direction Dp in which a turning shaft of the mirror stay extends is inclined to a length direction DL of the base portion. With this structure, a side mirror increased in degree of freedom in selecting a mount position on a front cowl can be provided.
摘要:
A side mirror includes a mount seat mounted to a front cowl that covers a portion of the front of a vehicle body, a mirror stay supported on the mount seat with a basal end thereof supported in a turnable manner, and a mirror provided at a tip end of the mirror stay. The mount seat includes a base portion 41a extended in one direction and mounted to the front cowl, and a support portion provided on the base portion 41a to support the basal end of the mirror stay so that a direction Dp in which a turning shaft of the mirror stay extends is inclined to a length direction DL of the base portion. With this structure, a side mirror increased in degree of freedom in selecting a mount position on a front cowl can be provided.
摘要:
A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate is caused to slide while pushing up a dicing sheet and the semiconductor die, and subsequently a rear end of the cover plate is caused to extend from the contact surface such that an upper surface of the cover plate is substantially in parallel with the contact surface, the cover plate is caused to slide while pushing the dicing sheet and the semiconductor die with the upper surface of the cover plate such that the suction opening is opened, and the dicing sheet is suctioned into the opened suction opening, thereby separating the dicing sheet.
摘要:
A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.
摘要:
So as to achieve accurate detection of the bonding tool position in, for instance, a wire bonding apparatus, the positional relationship between a position detection camera and a reference hole formed in, for instance, a clamper is measured by imaging the reference hole by the position detection camera. The position detection camera and a bonding tool are moved by an XY table, and the tip end of the bonding tool is inserted into the reference hole. Then, the bonding tool is moved in the X and Y directions, and the contact of the bonding tool to an edge of the reference hole is detected based upon changes in the waveform of the ultrasonic vibrations applied to the bonding tool, thus measuring the positional relationship between the tool and the reference hole. The offset amount between the position detection camera and the bonding tool is then determined based upon the measured values and the amounts of movement of the bonding tool between the locations for such measured values.
摘要:
In method for forming a ball on a bonding wire, the tip end of the bonding wire that extends from a capillary is bent toward a discharge electrode, and the capillary is moved obliquely so that the tip end of the tail of the bonding wire faces the discharge electrode, and then an electric discharge is performed between the discharge electrode and the tip end of the wire, thus forming a ball on the tip end of the wire.
摘要:
According to the present invention there are provided method and apparatus for producing a simple printing plate having open cells, which method and apparatus area simple in construction and permit accurate and continuous production of the printing plate. More specifically, as the method there is provided a method of producing a simple printing plate having open cells by pressing both an embossing member having a relief image and a to-be-embossed member which is a sheet having open cells, in a heated state of the embossing member, allowing the relief image to be transferred to the to-be-embossed member, characterized in that the embossing member is attached to an embossing cylinder, the to-be-embossed member is attached to a to-be-embossed cylinder, one or both of the embossing cylinder and the to-be-embossed cylinder being in an arcuate form, and both cylinders are rotated in synchronism with each other, thereby pressing the embossing member and the to-be-embossed member in a rolling fashion.
摘要:
In bonding machines such as a wire bonding machine, a lock which makes the changing of bonding data impossible is placed on specific data setting mode items, which are stored in a memory, via a data setting mode locking circuit. The changing of data in such locked data setting modes is made possible only if a password inputted is the same as a previously set-in password.
摘要:
An ultrasonic wire bonding method that uses an ultrasonic oscillation output from a non-rotatable form, wherein the ultrasonic oscillation output used for bonding the leads that extend in an X-direction which is perpendicular to the axial direction of a horn is set to be larger than the ultrasonic oscillation output used for bonding the leads extending in a Y-direction which coincides with the axial direction of the horn.