摘要:
A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.
摘要:
According to one embodiment of the present invention, a magnetic bubble memory module comprising a flexible printed circuits substrate (FPC3), on which a magnetic bubble memory chip (CHI) is mounted and electrically connected, with interconnecting patterns(9a) electrically connecting the chip (CHI) with external connecting leads, terminals or pins as well as bias coil winding (BIC2) for applying bias field to the chip (CHI), thereby reducing the number of components as well as fabricating steps because of the formation of the bias coil (BIC2) with the printed circuits substrate (FPC3).
摘要:
According to one embodiment of the present invention, a magnetic bubble memory module comprising a flexible printed circuits substrate (FPC3), on which a magnetic bubble memory chip (CHI) is mounted and electrically connected, with interconnecting patterns (9a) electrically connecting the chip (CHI) with external connecting leads, terminals or pins as well as bias coil winding (BIC2) for applying bias field to the chip (CHI), thereby reducing the number of components as well as fabricating steps because of the formation of the bias coil (BIC2) with the printed circuits substrate (FPC3).
摘要:
A magnetic bubble memory chip is disposed at a position surrounded by a rectangular annular core having two pairs of opposite sides wound by a pair of wires, respectively, and is covered by a case for confining revolving magnetic field, thereby providing a revolving magnetic field to said chip. A bubble memory includes a permament magnet used as a holding magnetic field source, lying at a predetermined angle to the chip. An inclination between the chip and the magnet is provided on the revolving-magnetic-field confining case to be inserted between the chip and the magnet by having the case changed in plate thickness.
摘要:
In a magnetic bubble memory unit comprising two pairs of windings confronting in parallel each other, a printed circuit board having a magnetic bubble memory chip thereon surrounded by the windings for providing the rotating magnetic field, and a conductive shield case for covering the magnetic bubble memory chip on the printed circuit board, slitlike openings are provided on the side face of the conductive shield case so as to present connection between the printed circuit board and an external device.
摘要:
A magnetic bubble memory device comprises a cassette and a body. The cassette has a bias magnetic field generator adapted to generate a bias magnetic field for sustaining magnetic bubbles within a bubble memory chip and is removed of coils adapted to generate a rotating magnetic field for propagation of the magnetic bubbles. The body has a rotating magnetic field generator. The cassette is mounted to or dismounted from the body. When the cassette is dismounted from the cassette, information stored in the chip is held by the bias magnetic field generator and when the cassette is mounted to the body, information is read from or written into the chip by the rotating magnetic field generator.
摘要:
A magnetic bubble memory module having a rectangular core shaped like a picture frame providing windings on respective two pairs of opposite sides, at least one magnetic bubble memory chip disposed in an area surrounded by the core, a flexible substrate having a chip-loading section for loading the magnetic bubble memory chip thereon and having four corners for leading out lead wires connecting signal lines and driving lines of the chip. A revolving magnetic field-confining case accommodates the core, the chip and the flexible substrate and enables the lead wires of the flexible substrate at the corners of the chip-loading section to be drawn out therethrough.
摘要:
A litz wire comprises three or more insulated strands consisting essentially of an inner conductor and an outer insulating layer on said conductor. The strands are twisted symmetrically with respect to the center line of the wire, so that a current density distribution in the litz wire becomes uniform. Three or more such litz wires are twisted to form a composite litz wire. The composite litz wires are suitable for use in a high-frequency coil.
摘要:
A shielding method which utilizes a three dimensional structure and is effective to a source of the electromagnetic radiation noise, and a circuit board employing the same are obtained. Further, for the purpose of making the shielding function at an enclosure level unnecessary and realizing the recycling of enclosure materials by using this circuit board, in a circuit board structure having at least a signal layer, a power source layer and a ground layer, a signal line on the signal layer which is sandwiched between the two conductor layers made up of the power source layer and the ground layer, or the power source layers or the ground layers, is enclosed in a three dimensional manner with the conductor layers, thereby to form a single or double electrical closed loop current path or paths. By adopting this structure, there is obtained the effect that the electromagnetic radiation noise radiated from the circuit board is greatly reduced. In addition, as a result, there is obtained the effect that since the shielding processing required for the enclosure becomes unnecessary, the enclosure materials can be recycled.
摘要:
A magnetic bubble memory module comprises a shielding conductor case which encloses therein an annular rectangular parallelepiped core having windings and a magnetic bubble memory chip arranged in a space defined by the annular core. The central portion of the shielding conductor case is recessed so that it is brought near the bubble memory chip. The recess may be formed in one or each of the top and bottom surfaces of the shielding conductor case. A magnet plate is disposed in the recess of the shielding conductor case. The whole assembly is covered by a magnetic shielding case.