Semiconductor device and method for fabricating the same
    2.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07187014B2

    公开(公告)日:2007-03-06

    申请号:US10862452

    申请日:2004-06-08

    IPC分类号: H01L29/772

    CPC分类号: H01L29/7787 H01L29/2003

    摘要: A semiconductor device has a sapphire substrate, a semiconductor layer made of GaN provided on the sapphire substrate, a multilayer film provided on the semiconductor layer, and an electrode in ohmic contact with the multilayer film. The multilayer film has been formed by alternately stacking two types of semiconductor layers having different amounts of piezopolarization or different amounts of spontaneous polarization and each containing an n-type impurity so that electrons are induced at the interface between the two types of semiconductor layers. This allows the contact resistance between the electrode and the multilayer film and a parasitic resistance in a current transmission path to be reduced to values lower than in a conventional semiconductor device.

    摘要翻译: 半导体器件具有蓝宝石衬底,设置在蓝宝石衬底上的由GaN制成的半导体层,设置在半导体层上的多层膜和与该多层膜欧姆接触的电极。 已经通过交替地堆叠具有不同量的极化或不同量的自发极化的两种类型的半导体层,并且每个含有n型杂质,以便在两种类型的半导体层之间的界面处诱导电子而形成多层膜。 这允许电极和多层膜之间的接触电阻和电流传输路径中的寄生电阻降低到比常规半导体器件中的值更低的值。

    Semiconductor device and method for fabricating the same
    4.
    发明申请
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US20050082568A1

    公开(公告)日:2005-04-21

    申请号:US10862452

    申请日:2004-06-08

    CPC分类号: H01L29/7787 H01L29/2003

    摘要: A semiconductor device has a sapphire substrate, a semiconductor layer made of GaN provided on the sapphire substrate, a multilayer film provided on the semiconductor layer, and an electrode in ohmic contact with the multilayer film. The multilayer film has been formed by alternately stacking two types of semiconductor layers having different amounts of piezopolarization or different amounts of spontaneous polarization and each containing an n-type impurity so that electrons are induced at the interface between the two types of semiconductor layers. This allows the contact resistance between the electrode and the multilayer film and a parasitic resistance in a current transmission path to be reduced to values lower than in a conventional semiconductor device.

    摘要翻译: 半导体器件具有蓝宝石衬底,设置在蓝宝石衬底上的由GaN制成的半导体层,设置在半导体层上的多层膜和与该多层膜欧姆接触的电极。 已经通过交替地堆叠具有不同量的极化或不同量的自发极化的两种类型的半导体层,并且每个含有n型杂质,以便在两种类型的半导体层之间的界面处诱导电子而形成多层膜。 这允许电极和多层膜之间的接触电阻和电流传输路径中的寄生电阻降低到比常规半导体器件中的值更低的值。

    Semiconductor device
    7.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US07217960B2

    公开(公告)日:2007-05-15

    申请号:US11325340

    申请日:2006-01-05

    IPC分类号: H01L33/00

    CPC分类号: H01L29/7786 H01L29/2003

    摘要: It is an object of the present invention to provide a semiconductor device, which can simultaneously achieve a normally-off mode of HFET and an improvement in Imax, and further achieve an improvement in gm and a reduction in gate leakage current. In order to keep a thin barrier layer 13 on an operation layer 12 of a substrate 11 directly under a gate electrode for mostly contributing to achieve the normally-off mode and also implement the high Imax, it is configured in such a way that a thickness of the barrier layer 13 can be increased by the semiconductor layer 17 between gate and source regions and between gate and drain regions. It is therefore possible to achieve the normally-off mode and an improvement in Imax as compared with an FET in which a thickness of the barrier layer is designed so as to be uniform. An insulating film 18 with a dielectric constant higher than that of the barrier layer is further inserted between a gate electrode 16 and the barrier layers 13, so that an improvement in gm and a reduction in gate leakage current can be achieved.

    摘要翻译: 本发明的一个目的是提供一种半导体器件,其可以同时实现HFET的常闭模式和改进的最大值,并进一步实现gm的改善 和栅极漏电流的减小。 为了在栅电极正下方的基板11的操作层12上保持薄势垒层13,主要用于实现常关模式并且还实现高I max, 配置成使得栅极和源极区域之间以及栅极和漏极区域之间的半导体层17可以增加阻挡层13的厚度。 因此与阻挡层的厚度被设计为均匀的FET相比,可以实现常关模式和I 的改善。 介电常数高于阻挡层的绝缘膜18进一步插入在栅电极16和阻挡层13之间,从而改善gm和栅极漏电流的减小 可以实现。

    Method for manufacturing a semiconductor device having a III-V nitride semiconductor
    8.
    发明授权
    Method for manufacturing a semiconductor device having a III-V nitride semiconductor 有权
    具有III-V族氮化物半导体的半导体器件的制造方法

    公开(公告)号:US07910464B2

    公开(公告)日:2011-03-22

    申请号:US12695759

    申请日:2010-01-28

    IPC分类号: H01L21/20 H01L21/36

    摘要: A semiconductor device of the present invention includes: a III-V nitride semiconductor layer including a channel region in which carriers travel; a concave portion provided in an upper portion of the channel region in the III-V nitride semiconductor layer; and a Schottky electrode consisting of a conductive material forming a Schottky junction with the semiconductor layer, and formed on a semiconductor layer, which spreads over the concave portion and peripheral portions of the concave portion, on the III-V nitride semiconductor layer. A dimension of the concave portion in a depth direction is set so that a portion of the Schottky electrode provided in the concave portion can adjust a quantity of the carriers traveling in the channel region.

    摘要翻译: 本发明的半导体器件包括:III-V族氮化物半导体层,其包括载流子行进的沟道区; 设置在III-V族氮化物半导体层中的沟道区的上部的凹部; 和由形成与半导体层形成肖特基结的导电材料构成的肖特基电极,形成在III-V族氮化物半导体层上的在凹部的凹部和周边部分上方扩散的半导体层上。 深度方向上的凹部的尺寸被设定为使得设置在凹部中的肖特基电极的一部分可以调节在沟道区域中行进的载流子的量。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    9.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20090050937A1

    公开(公告)日:2009-02-26

    申请号:US12257807

    申请日:2008-10-24

    IPC分类号: H01L29/778

    摘要: A semiconductor device of the present invention includes: a III-V nitride semiconductor layer including a channel region in which carriers travel; a concave portion provided in an upper portion of the channel region in the III-V nitride semiconductor layer; and a Schottky electrode consisting of a conductive material forming a Schottky junction with the semiconductor layer, and formed on a semiconductor layer, which spreads over the concave portion and peripheral portions of the concave portion, on the III-V nitride semiconductor layer. A dimension of the concave portion in a depth direction is set so that a portion of the Schottky electrode provided in the concave portion can adjust a quantity of the carriers traveling in the channel region.

    摘要翻译: 本发明的半导体器件包括:III-V族氮化物半导体层,其包括载流子行进的沟道区; 设置在III-V族氮化物半导体层中的沟道区的上部的凹部; 和由形成与半导体层形成肖特基结的导电材料构成的肖特基电极,形成在III-V族氮化物半导体层上的在凹部的凹部和周边部分上方扩散的半导体层上。 深度方向上的凹部的尺寸被设定为使得设置在凹部中的肖特基电极的一部分可以调节在沟道区域中行进的载流子的量。

    Semiconductor device and method for fabricating the same
    10.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07247891B2

    公开(公告)日:2007-07-24

    申请号:US10970026

    申请日:2004-10-22

    IPC分类号: H01L29/739

    摘要: A semiconductor device has a first nitride semiconductor layer, a second nitride semiconductor layer formed on the first nitride semiconductor layer and having such a composition as to generate a 2-dimensional electron gas layer in the upper portion of the first nitride semiconductor layer, and an electrode having an ohmic property and formed selectively on the second nitride semiconductor layer. The second nitride semiconductor layer includes a contact area having at least one inclined portion with a bottom or wall surface thereof being inclined toward the upper surface of the first nitride semiconductor layer and defining a depressed cross-sectional configuration. The electrode is formed on the contact area.

    摘要翻译: 半导体器件具有第一氮化物半导体层,形成在第一氮化物半导体层上的第二氮化物半导体层,并具有在第一氮化物半导体层的上部产生二维电子气层的组成, 电极,其选择性地形成在第二氮化物半导体层上。 第二氮化物半导体层包括具有至少一个倾斜部分的接触区域,其底部或壁表面朝向第一氮化物半导体层的上表面倾斜并且限定凹陷的横截面构型。 电极形成在接触区域上。