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    Singulation methods
    2.
    发明授权
    Singulation methods 失效
    唱歌方式

    公开(公告)号：US06047470A

    公开(公告)日：2000-04-11

    申请号：US915159

    申请日：1997-08-20

    申请人： Zane Drussel ,  Derek Hinkle

    发明人： Zane Drussel ,  Derek Hinkle

    IPC分类号： H01L21/48 ,  H01L23/13 ,  H05K3/00 ,  H05K3/02

    CPC分类号： H01L23/13 ,  H01L21/481 ,  H05K3/0052 ,  H01L2924/0002 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0195 ,  H05K2203/1536 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49789 ,  Y10T29/49794

    摘要： A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions. The first end portions of each opening lie along a first singulation axis of the substrate material parallel to the longitudinal axis and the second end portions of each opening lie along a second singulation axis of the substrate material parallel to the longitudinal axis. Removing interconnect material along the first singulation axis and second singulation axis provide for singulation of the circuit forming regions and any circuits thereof.

    摘要翻译： 电路板基板组件包括大致平面的电路板基板材料，其具有沿基板材料的长度在其第一端和第二端之间延伸的纵向轴线。 电路板基板材料还具有沿着电路板基板材料的长度在第一端和第二端之间延伸的第一边缘和第二边缘。 在基板材料中限定多个开口。 每个开口在距离电路板基板的第一边缘的第一距离和离开电路板基板的第二边缘的第二距离之间延伸。 此外，每个开口分开沿着纵向轴线的相邻的电路形成区域，并且具有第一和第二相对端部。 每个开口的第一端部沿着平行于纵向轴线的衬底材料的第一分割轴线，并且每个开口的第二端部沿着平行于纵向轴线的衬底材料的第二切割轴线。 沿着第一单个轴和第二单片轴移除互连材料提供电路形成区域的单个化及其任何电路。

    Singulation methods and substrates for use with same
    4.
    发明授权
    Singulation methods and substrates for use with same 有权
    单独使用方法和底物

    公开(公告)号：US06239380B1

    公开(公告)日：2001-05-29

    申请号：US09382304

    申请日：1999-08-24

    申请人： Zane Drussel ,  Derek Hinkle

    发明人： Zane Drussel ,  Derek Hinkle

    IPC分类号： H05K100

    CPC分类号： H01L23/13 ,  H01L21/481 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0195 ,  H05K2203/1536 ,  H05K2203/1545 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49789 ,  Y10T29/49794 ,  Y10T83/0505 ,  H01L2924/00

    摘要： A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions. The first end portions of each opening lie along a first singulation axis of the substrate material parallel to the longitudinal axis and the second end portions of each opening lie along a second singulation axis of the substrate material parallel to the longitudinal axis. Removing interconnect material along the first singulation axis and second singulation axis provide for singulation of the circuit forming regions and any circuits thereof.

    摘要翻译： 电路板基板组件包括大致平面的电路板基板材料，其具有沿基板材料的长度在其第一端和第二端之间延伸的纵向轴线。 电路板基板材料还具有沿着电路板基板材料的长度在第一端和第二端之间延伸的第一边缘和第二边缘。 在基板材料中限定多个开口。 每个开口在距离电路板基板的第一边缘的第一距离和离开电路板基板的第二边缘的第二距离之间延伸。 此外，每个开口分开沿着纵向轴线的相邻的电路形成区域，并且具有第一和第二相对端部。 每个开口的第一端部沿着平行于纵向轴线的衬底材料的第一分割轴线，并且每个开口的第二端部沿着平行于纵向轴线的衬底材料的第二切割轴线。 沿着第一单个轴和第二单片轴移除互连材料提供电路形成区域的单个化及其任何电路。