DUAL MODE INSPECTOR
    1.
    发明申请

    公开(公告)号:US20180005364A1

    公开(公告)日:2018-01-04

    申请号:US15200586

    申请日:2016-07-01

    Abstract: A dual mode inspector includes an optical inspector configured to detect a defect located at a first location on a sample, a microscope configured to capture an image of the defect at the first location on the sample, and a platform that is configured to support the sample. The sample is not removed from the platform between the detecting of the defect located at the first location on the sample and the capturing of the image of the defect at the first location on the sample. The dual mode optical inspector also includes a controller that causes the optical inspector to detect the defect located at the first location on the sample and causes the microscope to capture the image of the defect at the first location on the sample. The dual mode inspector also performs scanning lens distortion correction to improve the capturing of defect images.

    METHOD AND APPARATUS TO DETECT DEFECTS IN TRANSPARENT SOLIDS

    公开(公告)号:US20170261440A1

    公开(公告)日:2017-09-14

    申请号:US15607648

    申请日:2017-05-29

    Abstract: A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.

    Dual mode inspector
    4.
    发明授权

    公开(公告)号:US10769769B2

    公开(公告)日:2020-09-08

    申请号:US15200586

    申请日:2016-07-01

    Abstract: A dual mode inspector includes an optical inspector configured to detect a defect located at a first location on a sample, a microscope configured to capture an image of the defect at the first location on the sample, and a platform that is configured to support the sample. The sample is not removed from the platform between the detecting of the defect located at the first location on the sample and the capturing of the image of the defect at the first location on the sample. The dual mode optical inspector also includes a controller that causes the optical inspector to detect the defect located at the first location on the sample and causes the microscope to capture the image of the defect at the first location on the sample. The dual mode inspector also performs scanning lens distortion correction to improve the capturing of defect images.

    Optical measurement of step size and plated metal thickness

    公开(公告)号:US10359613B2

    公开(公告)日:2019-07-23

    申请号:US15346594

    申请日:2016-11-08

    Abstract: A method of generating 3D information includes: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps, capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across all pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of the sample is present at each pre-determined step; determining a first captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image; determining a second captured image that is focused on a second surface of the sample based on the characteristic value of each pixel in each captured image; and determining a first distance between the first surface and the second surface.

    Multi-surface specular reflection inspector

    公开(公告)号:US10094787B2

    公开(公告)日:2018-10-09

    申请号:US15159626

    申请日:2016-05-19

    Abstract: An optical inspector includes a time varying beam reflector, a radiating source that irradiates the time varying beam reflector, a telecentric scan lens configured to direct the radiation reflected by the time varying beam reflector onto a first surface of a transparent sample, a first detector that receives at least a portion of top surface specular reflection, a second detector that receives at least a portion of the bottom surface specular reflection. A turning mirror may also be included. The turning mirror is a switchable mirror that can be adjusted to a first position where the turning mirror reflects the top and bottom surface specular reflection, and can be adjusted to a second position where the turning mirror does not reflect the top or the bottom surface specular reflection. A first and second polarizing element may also be included to detect additional types of defects on either surface.

    OPTICAL MEASUREMENT OF BUMP HIEGHT
    8.
    发明申请

    公开(公告)号:US20180045947A1

    公开(公告)日:2018-02-15

    申请号:US15346607

    申请日:2016-11-08

    CPC classification number: G02B21/244 G02B21/0016 G02B21/367

    Abstract: A method of generating 3D information including: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps; capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across a first portion of pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of the sample is present at each pre-determined step; determining a first captured image that is focused on an apex of a bump of the sample; determining a second captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image; and determining a first distance between the apex of the bump and the first surface.

    Dual mode inspector
    9.
    发明授权

    公开(公告)号:US10475173B2

    公开(公告)日:2019-11-12

    申请号:US15200586

    申请日:2016-07-01

    Abstract: A dual mode inspector includes an optical inspector configured to detect a defect located at a first location on a sample, a microscope configured to capture an image of the defect at the first location on the sample, and a platform that is configured to support the sample. The sample is not removed from the platform between the detecting of the defect located at the first location on the sample and the capturing of the image of the defect at the first location on the sample. The dual mode optical inspector also includes a controller that causes the optical inspector to detect the defect located at the first location on the sample and causes the microscope to capture the image of the defect at the first location on the sample. The dual mode inspector also performs scanning lens distortion correction to improve the capturing of defect images.

    Optical measurement of bump hieght
    10.
    发明授权

    公开(公告)号:US10168524B2

    公开(公告)日:2019-01-01

    申请号:US15346607

    申请日:2016-11-08

    Abstract: A method of generating 3D information including: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps; capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across a first portion of pixels in the captured image; comparing the greatest characteristic value for each captured image to determine if a surface of the sample is present at each pre-determined step; determining a first captured image that is focused on an apex of a bump of the sample; determining a second captured image that is focused on a first surface of the sample based on the characteristic value of each pixel in each captured image; and determining a first distance between the apex of the bump and the first surface.

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