公开(公告)号：US20190055378A1

公开(公告)日：2019-02-21

申请号：US15826615

申请日：2017-11-29

申请人： Zhen Ding Technology Co., Ltd.

发明人： KUO-SHENG LIANG ,  SHOU-JUI HSIANG ,  MAO-FENG HSU ,  HONG-PING LIN

IPC分类号： C08K7/26 ,  C08K9/06 ,  C04B35/14 ,  C04B35/447 ,  B28B1/30 ,  B28B7/34

摘要： An inorganic shell is ball-shaped and hollow, and includes silica and crystalline inorganic powder sintered together. A resin composition has the inorganic shells and the resin composition has certain dieletric characteristics. A method for making the inorganic shell is also provided.

公开(公告)号：US20170369747A1

公开(公告)日：2017-12-28

申请号：US15231723

申请日：2016-08-08

申请人： Zhen Ding Technology Co., Ltd.

发明人： SZU-HSIANG SU ,  KUO-SHENG LIANG ,  SHOU-JUI HSIANG ,  HONG-PING LIN

IPC分类号： C09J109/06 ,  B32B27/30 ,  B32B27/18 ,  C09J1/00 ,  C09J7/02 ,  H05K1/03 ,  C08L9/06

CPC分类号： C09J109/06 ,  B32B27/18 ,  B32B27/302 ,  B32B2264/102 ,  B32B2405/00 ,  B32B2457/08 ,  C08L9/06 ,  C08L53/02 ,  C08L2201/02 ,  C08L2203/162 ,  C08L2203/206 ,  C08L2207/324 ,  C09J1/00 ,  C09J153/02 ,  C09J2203/326 ,  C09J2205/114 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0209 ,  C08L9/00 ,  C08K5/541

摘要： A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

公开(公告)号：US20170079136A1

公开(公告)日：2017-03-16

申请号：US14920634

申请日：2015-10-22

申请人： FuKui Precision Component (Shenzhen) Co., Ltd. ,  HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  Zhen Ding Technology Co., Ltd.

发明人： SZU-HSIANG SU ,  KUO-SHENG LIANG ,  SHOU-JUI HSIANG

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K1/03

CPC分类号： H05K3/4626 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0133 ,  H05K2201/0195

摘要： A circuit board includes at least two substrates and an adhesive film sandwiched between the two substrates. Each substrate includes a base board. The base board includes conductive wires. Each base board is connected to the other base board by the adhesive film. The adhesive film includes two first adhesive layers and a second adhesive layer. The second adhesive layer is sandwiched between the two first adhesive layers. An adhesion force of the first adhesive layer is greater than an adhesion force of the second adhesive layer. A major composition of the second adhesive layer is rubber. The rubber is selected from a group consisting of isoprene rubber, styrene butadiene rubber, ethylene propylene rubber, butyl rubber, acrylic rubber, and polybutadiene rubber, and mixtures thereof.

摘要翻译： 电路板包括至少两个基板和夹在两个基板之间的粘合膜。 每个基板包括基板。 基板包括导线。 每个基板通过粘合膜连接到另一个基板。 粘合剂膜包括两个第一粘合剂层和第二粘合剂层。 第二粘合剂层夹在两个第一粘合剂层之间。 第一粘合剂层的粘附力大于第二粘合剂层的粘附力。 第二粘合剂层的主要组成是橡胶。 橡胶选自异戊二烯橡胶，苯乙烯丁二烯橡胶，乙丙橡胶，丁基橡胶，丙烯酸橡胶和聚丁二烯橡胶，以及它们的混合物。