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公开(公告)号：US20240116752A1
公开(公告)日：2024-04-11
申请号：US18377419
申请日：2023-10-06
发明人： Xianming CHEN , Lei FENG , Jiangjiang ZHAO , Benxia HUANG , Gao HUANG , Yejie HONG
CPC分类号： B81C1/00301 , B81B7/0061 , B81C1/00309 , B81B2207/092 , B81C2203/0118
摘要： A packaged cavity structure includes an embedded packaging frame having a first cavity and a first conductive post respectively penetrating an insulation layer in a height direction, a chipset within the first cavity, a first circuit layer on an upper surface of the embedded packaging frame, a first dielectric layer on the first circuit layer, a second circuit layer on the first dielectric layer, a through-hole penetrating the first dielectric layer and the insulation layer, a third circuit layer on a lower surface of the embedded packaging frame, a support post enclosure on the third circuit layer, and a packaging layer formed along the outside of the support post enclosure. A second cavity communicating with the through-hole is formed between the packaging layer and the lower surface of the embedded packaging frame, and the chipset includes a first chip and a second chip provided in a back-to-back stack.
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公开(公告)号：US20230199957A1
公开(公告)日：2023-06-22
申请号：US17906853
申请日：2020-07-24
发明人： Xianming CHEN , Lei FENG , Benxia HUANG , Yejie HONG
CPC分类号： H05K1/115 , H05K3/0047 , H05K3/0076 , H05K3/188 , H05K3/4658 , H05K2201/096 , H05K2201/09545 , H05K2203/061 , H05K2203/0723 , H05K2203/167
摘要： A multilayer substrate and a manufacturing method thereof are disclosed. The multilayer substrate includes two or more dielectric layers laminated in sequence; a public line disposed at a top or bottom dielectric layer of the two or more dielectric layers; and two or more first through hole pillars respectively each embedded in a respective one of the dielectric layers, and the first through hole pillars are connected in cascade and then connected with the public line.
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3.发明公开公开(公告)号：US20230197739A1
公开(公告)日：2023-06-22
申请号：US17998159
申请日：2020-07-24
发明人： Xianming CHEN , Lei FENG , Weiyuan YANG , Benxia HUANG , Yejie HONG
IPC分类号： H01L27/13
摘要： A capacitor and inductor embedded structure and a manufacturing method therefor, and a substrate are disclosed. The method includes: providing a metal plate; sequentially depositing and etching a first protective layer, a thin film dielectric layer, a second protective layer, and an upper electrode layer on an upper surface of the metal plate to form a thin film capacitor and a capacitor upper electrode; pressing an upper dielectric layer to the upper surface of the metal plate, covering the thin film capacitor and the capacitor upper electrode, and etching the metal plate to form a capacitor lower electrode; pressing a lower dielectric layer to a lower surface of the metal plate, and performing drilling on the upper dielectric layer and the lower dielectric layer to form inductor through holes and capacitor electrode through holes; electroplating metal to form an inductor and circuit layers.
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公开(公告)号：US20230051730A1
公开(公告)日：2023-02-16
申请号：US17976228
申请日：2022-10-28
发明人： Xianming CHEN , Yejie HONG , Benxia HUANG , Lei FENG
IPC分类号： H01L23/538 , H01L21/50 , H01L21/768 , H01L23/15 , H01L23/00
摘要： A package substrate includes: a glass frame having a through hole and a chip embedding cavity; an electronic component arranged in the chip embedding cavity; a dielectric layer filled on an upper surface of the glass frame and in the chip embedding cavity; a metal pillar passing through the through hole; a circuit layer arranged on the upper surface and/or a lower surface of the glass frame and connected to the electronic component and the metal pillar; and a solder mask arranged on a surface of the circuit layer and having a pad which is connected to the circuit layer.
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公开(公告)号：US20210410297A1
公开(公告)日：2021-12-30
申请号：US17038898
申请日：2020-09-30
发明人： Xianming CHEN , Jian PENG , Jida ZHANG , Benxia HUANG , Lei FENG , Bingsen XIE , Jun GAO
IPC分类号： H05K3/46
摘要： A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.
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公开(公告)号：US20210391213A1
公开(公告)日：2021-12-16
申请号：US17073968
申请日：2020-10-19
发明人： Xianming CHEN , Min GU , Benxia HUANG , Lei FENG , Bingsen XIE
IPC分类号： H01L21/768 , H01L23/532 , H01L21/48 , H01L23/48 , H01L23/14
摘要： A method for manufacturing an interposer board without a feature layer structure according to an embodiment of the present invention may include preparing a temporary carrier; forming an edge seal for the temporary carrier; laminating an insulating material onto upper and lower surfaces of the temporary carrier to form an insulating layer; forming a via on the insulating layer, filling the via with a metal; and removing the edge seal and removing the temporary carrier. An interposer board without a feature layer structure according to an embodiment of the present invention may include an insulating layer and a via-post layer embedded in the insulating layer, wherein the via-post has an end used as a pad.
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公开(公告)号：US20240063055A1
公开(公告)日：2024-02-22
申请号：US18221004
申请日：2023-07-12
发明人： Xianming CHEN , Benxia HUANG , Lei FENG , Jindong FENG , Yejie HONG
IPC分类号： H01L21/768 , H01L21/3213 , H01L21/02 , H01L21/47
CPC分类号： H01L21/76805 , H01L21/76832 , H01L21/32139 , H01L21/0234 , H01L21/76865 , H01L21/76873 , H01L21/76874 , H01L21/02645 , H01L21/47
摘要： A method for manufacturing a device embedded packaging structure include laminating a first dielectric material on a copper foil to form a first dielectric layer, and forming a first feature pattern in the first dielectric layer to expose the copper foil, etching the exposed copper foil to form a device opening frame and a via post opening frame to obtain a metal frame, applying an adhesive layer on the metal frame, and mounting a device to the adhesive layer in the device opening frame, laminating a second dielectric material to form a second dielectric layer covering the metal frame and filling the device opening frame and the via post opening frame, forming a via post in the via post opening frame, and forming a first wiring layer and a second wiring layer conductively connected by the via post on the upper and lower surfaces of the second dielectric layer.
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公开(公告)号：US20240021740A1
公开(公告)日：2024-01-18
申请号：US18220877
申请日：2023-07-12
发明人： Xianming CHEN , Lei FENG , Benxia HUANG , Jiangjiang ZHAO , Zhijun ZHANG
IPC分类号： H01L31/0203 , H01L31/0232 , H01L31/024 , H01L31/12 , H01L31/18
CPC分类号： H01L31/0203 , H01L31/02325 , H01L31/024 , H01L31/125 , H01L31/18
摘要： A method for manufacturing a light-emitting photosensitive sensor structure includes preparing a package substrate, wherein the package substrate has a cavity formed by a light-shield frame performing enclosing, and the bottom of the cavity is provided with a first line layer, forming a light transmission channel on the light-shield frame, mounting a light-emitting photosensitive sensor in the cavity of the package substrate so that the photosensitive luminescent device is electrically connected to the first line layer, filling the cavity and the light transmission channel with a transparent encapsulating material to form a transparent packaging layer on the photosensitive luminescent device, forming a light-shield layer on the transparent packaging layer, and performing cutting along a cutting line of the light-shield frame to obtain a light-emitting photosensitive sensor structure having a directional light transmission channel.
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公开(公告)号：US20230092164A1
公开(公告)日：2023-03-23
申请号：US17945200
申请日：2022-09-15
发明人： Xianming CHEN , Lei FENG , Benxia HUANG , Yejie HONG
IPC分类号： H01L23/31 , H01L23/00 , H01L21/56 , H01L23/498 , H01L23/495
摘要： A package substrate based on a molding process may include an encapsulation layer, a support frame located in the encapsulation layer, a base, a device located on an upper surface of the base, a copper boss located on a lower surface of the base, a conductive copper pillar layer penetrating the encapsulation layer in the height direction, and a first circuit layer and a second circuit layer over and under the encapsulation layer. The second circuit layer includes a second conductive circuit and a heat dissipation circuit, the first circuit layer and the second conductive circuit are connected conductively through the conductive copper pillar layer, the heat dissipation circuit is connected to one side of the device through the copper boss and the base, and the first circuit layer is connected to the other side of the device.
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10.发明申请公开(公告)号：US20220285088A1
公开(公告)日：2022-09-08
申请号：US17683697
申请日：2022-03-01
发明人： Xianming CHEN , Wenshi WANG , Lei FENG , Benxia HUANG
摘要： An inductor-integrating embedded support frame according to an embodiment of the present disclosure includes a core dielectric layer, a through-opening penetrating through the core dielectric layer, wherein the through-opening is used for embedding and installing a device, and an inductor, wherein the inductor includes a magnetic core embedded in the core dielectric layer and an inductance coil wound around the magnetic core, wherein at least one conductive copper pillar penetrating through the core dielectric layer is provided at the periphery of the through-opening and the inductor.
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