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公开(公告)号：US20250016950A1
公开(公告)日：2025-01-09
申请号：US18660724
申请日：2024-05-10
Applicant: Zonit Structured Solutions, LLC
Inventor： Steve Chapel , William Pachoud
Abstract: A modular arrangement is provided for housing electronic equipment and associated cooling structure in a data center environment. The modular units provide cooling air on an as—needed basis to individual pieces of equipment by way of individual plenums and associated valves. The units can be interconnected by vertical stacking, in side-to-side arrangements, and back-to-back arrangements. A number of units can be interconnected to form a cell. The cells can be interconnected to form larger units. In this manner, data centers can be configured in any desired arrangement without requiring complicated cooling design.
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公开(公告)号：US20240155801A1
公开(公告)日：2024-05-09
申请号：US18207032
申请日：2023-06-07
Applicant: Zonit Structured Solutions, LLC
Inventor： William Pachoud , Steve Chapel
CPC classification number: H05K7/1492 , G06F1/26 , H01R24/20 , H02G15/113 , H02J1/001 , H02J1/14 , H02J9/061 , H05K7/1491 , H01R13/20
Abstract: Systems and methods are provided for reliable redundant power distribution. Some embodiments include micro Automatic Transfer Switches (micro-ATSs), including various components and techniques for facilitating reliable auto-switching functionality in a small footprint (e.g., less than ten cubic inches, with at least one dimension being less than a standard NEMA rack height). Other embodiments include systems and techniques for integrating a number of micro-ATSs into a parallel auto-switching module for redundant power delivery to a number of devices. Implementations of the parallel auto-switching module are configured to be mounted in, on top of, or on the side of standard equipment racks. Still other embodiments provide power distribution topologies that exploit functionality of the micro-ATSs and/or the parallel micro-ATS modules.
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公开(公告)号：US11804682B2
公开(公告)日：2023-10-31
申请号：US17655723
申请日：2022-03-21
Applicant: Zonit Structured Solutions, LLC
Inventor： Steve Chapel , William Pachoud
CPC classification number: H01R25/006 , H05K7/1492 , H01R2201/04
Abstract: A method and apparatus (“utility”) for facilitating connection of rack-mounted data devices (50) to a data network is provided. The utility includes a distribution strip (42) and a number of network ports (44), disposed on the distribution strip (42), for use in connecting the rack-mounted data devices (50) to the network. The distribution strip (42) has a longitudinal axis, and is disposed on a rack (40) such that a length of the distribution strip (42), defined relative to the longitudinal axis, extends primarily or exclusively along a vertical axis of the rack (40). The distribution strip may further include a data network switch device. A utility is also provided that provides improved redundancy with regard to connections of rack-mounted data devices by including a distribution strip (42) that includes first and second ports (46) for connecting the distribution strip (42) to a network device (56).
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公开(公告)号：US20230283274A1
公开(公告)日：2023-09-07
申请号：US18062429
申请日：2022-12-06
Applicant: Zonit Structured Solutions, LLC
Inventor： Steve Chapel , William Pachoud
IPC: H03K17/13 , H03K17/687 , H05K1/02
CPC classification number: H03K17/133 , H03K17/687 , H05K1/0204 , H05K2201/066 , Y10T29/4913 , H05K3/306
Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.
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公开(公告)号：US11721505B2
公开(公告)日：2023-08-08
申请号：US17397283
申请日：2021-08-09
Applicant: Zonit Structured Solutions, LLC
Inventor： Steve Chapel , William Pachoud
CPC classification number: H01H47/02 , H01H50/24 , H01H50/42 , H01H50/60 , H01H47/00 , H01H47/22 , H01H50/16 , H01H50/18
Abstract: An electrical relay (2) includes an electromagnetic drive system for providing bi-directional drive. The electrical relay (2) includes a first a coil (212) and a second coil (213). A current is supplied to the coils (212) and (213) in opposite directions. The two coils (212) and (213) can be used to accelerate the armature in either direction in relation to the two contacts. This can be used to drive the armature to either one of the contacts and to accelerate and decelerate the armature during a single transit. In the latter regard, the armature can be accelerated and decelerated to shorten the transit time, reduce bounce, reduce wear on the contacts, and allow for different contact material options.
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Patent Agency Ranking
公开(公告)号：US20230132380A9
公开(公告)日：2023-04-27
申请号：US17010631
申请日：2020-09-02
Applicant: ZONIT STRUCTURED SOLUTIONS, LLC
Inventor： Steve Chapel , William Pachoud
Abstract: The invention addresses the needs associated with the entire data center power distribution lifecycle—design, build, operation and upgrades. The design and construction is facilitated by a system for prefabricating power whips that accommodate changing data center needs. The invention also allows for upgrading power supply components without powering down critical equipment. Improved power and network strips and associated logic further facilitate data center operation.
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公开(公告)号：US20220071046A1
公开(公告)日：2022-03-03
申请号：US17010631
申请日：2020-09-02
Applicant: ZONIT STRUCTURED SOLUTIONS, LLC
Inventor： Steve Chapel , William Pachoud
Abstract: The invention addresses the needs associated with the entire data center power distribution lifecycle—design, build, operation and upgrades. The design and construction is facilitated by a system for prefabricating power whips that accommodate changing data center needs. The invention also allows for upgrading power supply components without powering down critical equipment. Improved power and network strips and associated logic further facilitate data center operation.
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公开(公告)号：US20220028642A1
公开(公告)日：2022-01-27
申请号：US17397283
申请日：2021-08-09
Applicant: Zonit Structured Solutions, LLC
Inventor： Steve Chapel , William Pachoud
Abstract: An electrical relay (2) includes an electromagnetic drive system for providing bi-directional drive. The electrical relay (2) includes a first a coil (212) and a second coil (213). A current is supplied to the coils (212) and (213) in opposite directions. The two coils (212) and (213) can be used to accelerate the armature in either direction in relation to the two contacts. This can be used to drive the armature to either one of the contacts and to accelerate and decelerate the armature during a single transit. In the latter regard, the armature can be accelerated and decelerated to shorten the transit time, reduce bounce, reduce wear on the contacts, and allow for different contact material options.
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公开(公告)号：US20210021261A1
公开(公告)日：2021-01-21
申请号：US16889444
申请日：2020-06-01
Applicant: Zonit Structured Solutions, LLC
Inventor： Steve Chapel , William Pachoud
IPC: H03K17/13 , H03K17/687 , H05K1/02
Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.
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公开(公告)号：US10673429B2
公开(公告)日：2020-06-02
申请号：US15706368
申请日：2017-09-15
Applicant: Zonit Structured Solutions, LLC
Inventor： Steve Chapel , William Pachoud
IPC: H03K17/13 , H05K1/02 , H03K17/687 , H05K3/30
Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.
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