Flexible circuit laminate for surface mount devices
    4.
    发明授权
    Flexible circuit laminate for surface mount devices 失效
    用于表面贴装器件的柔性电路层压板

    公开(公告)号:US4851613A

    公开(公告)日:1989-07-25

    申请号:US204113

    申请日:1988-06-08

    申请人: Roland Jacques

    发明人: Roland Jacques

    IPC分类号: H05K1/00 H05K1/03 H05K3/28

    摘要: The disclosed invention provides a flexible circuit board for use in surface mount technology. A polyaramid fiber reinforced resin provides a substrate for a copper cladding in which a circuit is formed. Overlaying the circuitry are a plurality of spaced insulating pads also reinforced with polyaramid fiber for dimensional stability. The spaces insulated pads define fold-lines along which the circuit may be folded, thereby providing a degree of flexibility required for flexible circuit applications.

    摘要翻译: 所公开的发明提供了一种用于表面贴装技术的柔性电路板。 聚芳酰胺纤维增强树脂提供了其中形成电路的铜包层的基底。 覆盖电路是多个间隔绝缘垫,其还用聚芳酰胺纤维增强,用于尺寸稳定性。 空间绝缘垫定义折叠线,电路可沿着折叠线折叠,从而提供柔性电路应用所需的一定程度的灵活性。