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    Microcircuit forming method and etching fluid composition
    2.
    发明授权
    Microcircuit forming method and etching fluid composition 有权

    公开(公告)号：US11089691B2

    公开(公告)日：2021-08-10

    申请号：US16489361

    申请日：2018-02-27

    Applicant: InkTec Co., Ltd.

    Inventor： Su Han Kim ,  Kwang-Choon Chung ,  Jung Yoon Moon ,  Sung In Ha ,  Byung Woong Moon

    IPC: H05K3/06 ,  C09K13/00 ,  H05K3/24 ,  H05K3/12 ,  H05K3/18 ,  H05K3/38 ,  H05K3/10

    Abstract: The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

    Etching solutions
    4.
    发明授权
    Etching solutions 有权
    蚀刻解决方案

    公开(公告)号：US09365935B2

    公开(公告)日：2016-06-14

    申请号：US14293388

    申请日：2014-06-02

    Applicant: Inktec Co., Ltd.

    Inventor： Kwang Choon Chung ,  Hyun-Nam Cho ,  Young-Kwan Seo

    IPC: C23F1/30 ,  C09K13/00 ,  C23F1/14 ,  C09K13/06

    CPC classification number: C23F1/30 ,  C09K13/00 ,  C09K13/06 ,  C23F1/14

    Abstract: The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant: wherein each of the variables is as defined herein.

    Abstract translation: 本发明提供一种用于银或银合金的蚀刻溶液，其包含至少一种由下式（1），（2）或（3）表示的铵化合物和氧化剂：其中每个变量如本文所定义。

    Method for manufacturing electromagnetic interference shielding film
    5.
    发明授权
    Method for manufacturing electromagnetic interference shielding film 有权
    制造电磁干扰屏蔽膜的方法

    公开(公告)号：US09167735B2

    公开(公告)日：2015-10-20

    申请号：US13805843

    申请日：2010-11-12

    Applicant: Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

    Inventor： Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

    IPC: H05K9/00

    CPC classification number: H05K9/0088 ,  Y10T156/10

    Abstract: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.

    Abstract translation: 提供一种制造电磁干扰（EMI）屏蔽膜的方法，包括：（a）在第一保护膜上提供单个绝缘层，所述绝缘层由绝缘层组合物制成，所述绝缘层组合物包括至少一种选自热塑性塑料 树脂和热固性树脂以及选自阻燃填料和耐磨填料的至少一种填料; （b）在绝缘层上设置金属层; （c）在金属层上设置导电粘合剂层，导电粘合剂层由包含至少一种选自热塑性树脂和热固性树脂的树脂和导电填料的导电粘合剂层组合物制成; 和（d）在导电粘合剂层上提供第二保护膜，以及通过该方法制造的EMI屏蔽膜。

    Method for manufacturing metal flakes
    6.
    发明授权
    Method for manufacturing metal flakes 有权
    制造金属薄片的方法

    公开(公告)号：US08979972B2

    公开(公告)日：2015-03-17

    申请号：US13060857

    申请日：2009-08-24

    Applicant: Kwang Choon Chung ,  Hyun Nam Cho ,  Dong Rip Kim ,  Ji Hoon Yoo

    Inventor： Kwang Choon Chung ,  Hyun Nam Cho ,  Dong Rip Kim ,  Ji Hoon Yoo

    IPC: B22F9/04 ,  B22F9/30 ,  B22F1/00

    CPC classification number: B22F9/30 ,  B22F1/0055 ,  B22F9/04

    Abstract: Disclosed herein is a method of manufacturing a metal flake, including the steps of: applying metal ink containing an organic metal compound onto a substrate; calcining the metal ink applied on the substrate to form a thin metal film; separating the formed thin metal film from the substrate; and pulverizing the separated thin metal film. The method of manufacturing a metal flake is characterized in that the thickness and size of metal flakes can be easily adjusted, metal flakes having excellent conductivity and gloss can be obtained, and metal flakes can be mass-produced using environmentally friendly and economical methods.

    Abstract translation: 本文公开了一种制造金属薄片的方法，包括以下步骤：将含有有机金属化合物的金属墨施加到基底上; 煅烧施加在基板上的金属油墨以形成薄金属膜; 将形成的薄金属膜与基板分离; 并粉碎分离的金属薄膜。 金属薄片的制造方法的特征在于，可以容易地调整金属薄片的厚度和尺寸，可以获得具有优异的导电性和光泽的金属薄片，并且可以使用环保且经济的方法大量生产金属薄片。

    PROCESS FOR PREPARATION OF SILVER OXIDE
    8.
    发明申请
    PROCESS FOR PREPARATION OF SILVER OXIDE 有权
    制备银氧化物的方法

    公开(公告)号：US20130156684A1

    公开(公告)日：2013-06-20

    申请号：US13755101

    申请日：2013-01-31

    Applicant: Inktec Co., Ltd.

    Inventor： Kwang Choon CHUNG ,  Hyun Nam CHO ,  Ji Hoon YOO ,  Kee In SON

    IPC: C01G5/00

    CPC classification number: C01G5/00 ,  B82Y30/00 ,  C01P2004/03 ,  C01P2004/62 ,  C01P2004/64

    Abstract: A process for preparation of silver oxide with various shape and size using a silver complex compound having a special structure, includes 1) step of preparing a precursor solution including a silver complex compound obtained by reacting a silver compound with one or more mixture selected from the group consisting of an ammonium carbamate-based compound, an ammonium carbonate-based compound or an ammonium bicarbonate-based compound in the presence of a solvent; and 2) step of preparing silver oxide by reacting the precursor solution including the silver complex compound of step 1) with an oxidant. The shape and particle size of the silver oxide prepared according to the preparation process can be changed.

    Abstract translation: 使用具有特殊结构的银络合物制备具有各种形状和大小的氧化银的方法包括：1）制备包含银络合物的前体溶液的步骤，所述前体溶液是通过使银化合物与一种或多种选自 在溶剂存在下由氨基甲酸铵类化合物，碳酸铵类化合物或碳酸氢铵类化合物组成的组; 和2）通过使包含步骤1）的络合物的前体溶液与氧化剂反应来制备氧化银的步骤。 根据制备方法制备的氧化银的形状和粒径可以改变。

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