摘要:
A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force comprises a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the holder arm to the carrier device. The holder arm and fastening arm are connected to one another by a parallel guide whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented making it easier for the probe needle to carry out a vertical yielding movement, with almost no rotation of the probe needle about a horizontal axis.
摘要:
In a method for calibration of a measurement unit for determination of electrical properties of electronic components using at least one planar calibration standard, an electrical measurement quantity is measured at two different temperatures. The electrical property of the calibration standard is known at at least one temperature or is to be determined by calculation. A temperature coefficient is determined from both measured quantities, which describes the relative change of the electrical property of the calibration standard accompanying the temperature change and with which the electrical property of the calibration standard is determined at a measurement temperature. From the change in electrical property, an error coefficient of the measurement unit is determined. A method is also provided for determination of an electrical property of an electronic component, using the calibration method.
摘要:
A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
摘要:
A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
摘要:
In a device and a method for positioning an object, a drive of a movement device is controlled. To this end, a visual joystick is actuated, as a result of which a moveable actuator is moved, at least linearly by means of a display of a control unit of the movement device, into a position, in which a direction of movement, which can be implemented with the drive, is displayed symbolically. The drive for the movement of the object in the displayed direction of movement is initiated by means of a switching function of the actuator.
摘要:
A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element. A chuck for very low current measurements which can be used to prevent the occurrence of leakage currents and a triboelectric charge and which is configured favourably in terms of production, is achieved because at least one of the electrically conductive surface elements is mechanically connected to at least one insulation element and has an elasticity that compensates for an expansion difference resulting from differences in different coefficients of expansion between a respective surface element and an adjoining insulation element.
摘要:
A test probe for executing high-frequency measurements comprises: a coaxial high-frequency wave guide containing an inner conductor and an outer conductor for delivering a primary electrical potential and a secondary electrical potential, respectively, a supporting structure conductively connected to at least the outer conductor and to at least two contact elements for creating a contact with an electronic circuit to be tested. The support structure is provided with conductive paths for the transmission respectively of a high-frequency signal from the inner conductor and a high-frequency ground potential from the outer conductor to at least one contact element and each conductive path is conductively connected to the inner or outer conductor. The support structure has at least one U-shaped cut-out with a width essentially equivalent to an outer diameter of the wave guide and sides of the U-shaped cut-out are connected to the outer conductor.
摘要:
A device for testing thin elements, such as wafers or individual substrates, while at the same time offering a facility for inspecting the reverse side of the thin elements is provided in which any deflection of the substrate as a consequence of high contact power of the probe card is avoided and which is also suitable for substrate diameters of 200 mm and above. The device includes a stable plate with a central opening positioned on the basic construction, a frame which can be moved and/or turned on the plate in an x/y direction and, if required, in a theta direction, a highly-rigid substrate support which can be mounted in the frame, and substrates which can be mounted on the substrate support, wherein the mounting is effected through a vacuum, using mechanical elements (clamping ring, clamping foil or other suitable clamping elements), gel pack pads, or adhesive etc.
摘要:
A probe station allows for effective EMI shielding of the passage of the probe through the wall of the housing of such probe station. The probe is freely movable in the X, Y and Z directions. The probe station comprises a housing having at least one aperture through which a probe can extend, a chuck for supporting a test device, the chuck being arranged inside the housing, at least one probe support for supporting a probe, the probe support being arranged relative to the housing such that a first portion of the probe extends into the housing through one of said apertures, at least one positioning mechanism enabling at least one of said probe and said chuck to move relative to the other, and is characterized in that at least one electrically conductive, elastic bellows is attached to the edge of an aperture which provides a variable passage for the probe.
摘要:
A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.