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公开(公告)号：US20090021275A1
公开(公告)日：2009-01-22
申请号：US11947129
申请日：2007-11-29
CPC分类号： G01R31/2891 , G01R31/2887
摘要： A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
摘要翻译： 一种用于相对于测试基板垂直定位探针卡的方法，包括将在第一定位步骤中接近的分离位置存储为探针卡的针尖与基底之间的距离，存储在第二定位中接近的接触位置 一直到探针卡接触基板，并显示针尖的图像。 为了避免在探针卡改变之后的错误操作，当成像针尖时，存储的接触位置成像并改变，直到该接触位置的呈现对应于适合于相应探针卡的尖端的实际高度，并且该设置为 然后存储为新的联系人位置。 显示装置呈现针尖和存储的接触位置，并且连接到存储器，记录装置和改变接触位置的输入装置。
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公开(公告)号：US20050007135A1
公开(公告)日：2005-01-13
申请号：US10879622
申请日：2004-06-29
申请人： Stefan Schneidewind , Claus Dietrich , Jorg Kiesewetter , Stojan Kanev , Stefan Kreissig , Frank Fehrmann , Hans-Jurgen Fleischer
发明人： Stefan Schneidewind , Claus Dietrich , Jorg Kiesewetter , Stojan Kanev , Stefan Kreissig , Frank Fehrmann , Hans-Jurgen Fleischer
CPC分类号： G01R31/2886
摘要： A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.
摘要翻译： 接触区域与探针中的接触针尖（接触尖端）接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的 接触小尺寸接触垫时的接触面和接触面积。 探测器基本上包括具有移动装置的基架，该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。 接触尖端的接触最初需要半导体晶片的水平定位，使得接触面和接触尖端彼此之间并且彼此间隔一定距离，随后沿接触尖端的方向垂直移动， 直到接触尖端与接触区域的接触被建立。 该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的，为此目的，观察装置以这样的方式布置，使得观察轴以间隔 在自由晶片表面上方。
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3.发明授权公开(公告)号：US07652491B2
公开(公告)日：2010-01-26
申请号：US11940354
申请日：2007-11-15
申请人： Stojan Kanev , Hans-Jurgen Fleischer , Stefan Kreissig , Karsten Stoll , Axel Schmidt , Andreas Kittlaus
发明人： Stojan Kanev , Hans-Jurgen Fleischer , Stefan Kreissig , Karsten Stoll , Axel Schmidt , Andreas Kittlaus
IPC分类号： G10R31/28
CPC分类号： G01R31/2889 , G01R1/07342
摘要： A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes comprises a probe card holder, a probe card, and a probe card adapter, The probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed such that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from the holder. For testing test substrates their positioning with respect to the probes held in this manner is done by angular alignment of the contact surfaces of the test substrates to the sensor tips and the movement of the test substrates along a path which starts from a first reference position and is composed up to the first, and each additional, contact position of an x-component and a y-component.
摘要翻译： 用于保持探头的探针支架用于探测器中的测试基板的电接触以用于测试目的包括探针卡夹，探针卡和探针卡适配器。探针卡和探针卡适配器彼此电连接为 以及导电材料的屏蔽件，并且被布置成使得探针卡位于屏蔽件的通道中。 屏蔽件设置在测试基板和探针卡座之间并且与保持器电绝缘。 为了测试测试基板，它们相对于以这种方式保持的探针的定位是通过将测试基板的接触表面与传感器尖端角度对准并沿着从第一参考位置开始的路径移动测试基板来进行的， 由x分量和y分量组成直到第一个和每个附加的接触位置。
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公开(公告)号：US07733108B2
公开(公告)日：2010-06-08
申请号：US12329968
申请日：2008-12-08
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R31/2887
摘要： A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
摘要翻译： 一种用于相对于测试基板垂直定位探针卡的方法，包括将在第一定位步骤中接近的分离位置存储为探针卡的针尖与基底之间的距离，存储在第二定位中接近的接触位置 一直到探针卡接触基板，并显示针尖的图像。 为了避免在探针卡改变之后的错误操作，当成像针尖时，存储的接触位置成像并改变，直到该接触位置的呈现对应于适合于相应探针卡的尖端的实际高度，并且该设置为 然后存储为新的联系人位置。 显示装置呈现针尖和存储的接触位置，并且连接到存储器，记录装置和改变接触位置的输入装置。
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5.发明授权Probe station for testing semiconductor substrates and comprising EMI shielding 有权用于测试半导体衬底并包含EMI屏蔽的探头站公开(公告)号：US08278951B2
公开(公告)日：2012-10-02
申请号：US11940355
申请日：2007-11-15
申请人： Stojan Kanev , Hans-Jurgen Fleischer , Stefan Kreissig , Karsten Stoll , Axel Schmidt , Andreas Kittlaus
发明人： Stojan Kanev , Hans-Jurgen Fleischer , Stefan Kreissig , Karsten Stoll , Axel Schmidt , Andreas Kittlaus
IPC分类号： G01R31/00
CPC分类号： G01R31/2886 , G01R1/18
摘要： A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.
摘要翻译： 适用于进行低电流和低电压测量的半导体衬底（即晶片和其他电子半导体元件）的探测台包括屏蔽，半导体衬底测量的电磁影响（EMI）可以是 最小化，并且还包括用于准备测试信号的装置。 此外，探针台的外壳可以提供探针台的各个组件或组件组的可访问性的不同可能性。
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6.发明申请PROBE SUPPORT AND PROCESS FOR THE EXAMINATION OF TEST SUBSTRATES UNDER USE OF PROBE SUPPORTS 有权在使用探测支持下检测测试基板的探测支持和过程公开(公告)号：US20080116917A1
公开(公告)日：2008-05-22
申请号：US11940354
申请日：2007-11-15
申请人： Stojan Kanev , Hans-Jurgen Fleischer , Stefan Kreissig , Karsten Stoll , Axel Schmidt , Andreas Kittlaus
发明人： Stojan Kanev , Hans-Jurgen Fleischer , Stefan Kreissig , Karsten Stoll , Axel Schmidt , Andreas Kittlaus
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/07342
摘要： A probe support for holding probes which serve for electrical contacting of test substrates in a prober for testing purposes is specified. A process for testing test substrates in such a prober is also specified. The probe support comprises a probe card holder, a probe card, and a probe card adapter, where the probe card and probe card adapter are electrically connected to one another as well as to a shield of electrically conductive material and are disposed in such a manner that the probe card lies in a passageway of a shield. The shield is disposed between the test substrates and the probe card holder and is electrically insulated from it. For testing test substrates their positioning with respect to the probes held in this manner is done by angular alignment of the contact surfaces of the test substrates to the sensor tips and the movement of the test substrates along a path which starts from a first reference position and is composed up to the first, and each additional, contact position of an x-component and a y-component (FIG. 2).
摘要翻译： 规定了用于保持探头的探针支架，用于检测探针中的测试基板的电接触用于测试目的。 还规定了用于在这种探测器中测试测试底物的方法。 探针支架包括探针卡夹，探针卡和探针卡适配器，其中探针卡和探针卡适配器彼此电连接以及导电材料的屏蔽，并以这种方式设置 探针卡位于屏蔽的通道中。 屏蔽件设置在测试基板和探针卡保持器之间并且与其电绝缘。 为了测试测试基板，它们相对于以这种方式保持的探针的定位是通过将测试基板的接触表面与传感器尖端角度对准并沿着从第一参考位置开始的路径移动测试基板来进行的， 由x分量和y分量（图2）组成直到第一个和每个附加的接触位置。
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7.发明申请METHOD FOR VERIFYING A TEST SUBSTRATE IN A PROBER UNDER DEFINED THERMAL CONDITIONS 有权用于在定义的热条件下在探测器中验证测试基板的方法公开(公告)号：US20110241711A1
公开(公告)日：2011-10-06
申请号：US13119145
申请日：2009-07-31
IPC分类号： G01R31/00
CPC分类号： G01R1/0408 , G01R31/2855 , G01R31/2874 , G01R31/2875 , G01R31/2886
摘要： A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.
摘要翻译： 一种用于在确定的热条件下在探测器中验证或测试测试基板，即晶片和其它电子半导体部件的方法和装置。 这种本领域技术人员已知的探测器的验证装置具有壳体，该壳体具有至少两个壳体部分，在其一个壳体部分中，下文称为测试室，待验证的测试基板由 卡盘并设定在限定的温度，并且在其另一个壳体部分中，下文称为探针室，探针被保持。 为了验证目的，测试基板和探针通过至少一个定位装置相对于彼此定位，并且探头随后与测试基板接触。
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8.发明授权Probe receptacle for mounting a probe for testing semiconductor components, probe holder arm and test apparatus 失效用于安装用于测试半导体元件，探头支架臂和测试设备的探头的探针插座公开(公告)号：US07560942B2
公开(公告)日：2009-07-14
申请号：US11674208
申请日：2007-02-13
申请人： Hans-Jurgen Fleischer , Axel Schmidt , Stojan Kanev , Axel Becker
发明人： Hans-Jurgen Fleischer , Axel Schmidt , Stojan Kanev , Axel Becker
IPC分类号： G01R1/067
CPC分类号： G01R31/2891 , G01R31/2874
摘要： To arrange a probe needle in a reproducible manner, ensure reliable contact-connection of the probe needle and ensure that the probe needle is held securely even at high temperatures or test forces, a probe receptacle is provided for mounting a probe for testing semiconductor components. The probe has a probe needle and an essentially prismatic probe shaft. The probe receptacle comprises a base having a socket opening to receive the prismatic probe shaft, surrounded by a base wall. The base wall comprises at least two base wall segments which can be moved toward one another. A probe holder arm having such a probe receptacle, and test apparatus having at least one probe which has such a probe receptacle are also provided.
摘要翻译： 为了以可重复的方式布置探针，确保探头针头的可靠接触连接，并确保即使在高温或测试力下也能牢固地固定探头针头，提供探头插座，用于安装用于测试半导体部件的探头。 探针具有探针和基本上棱柱形的探针轴。 探针插座包括具有插座开口的基座，以容纳棱柱形探针轴，被基壁包围。 底壁包括至少两个可以朝向彼此移动的底壁段。 还提供了具有这种探针插座的探针支架臂和具有至少一个具有这种探针插座的探头的测试装置。
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9.发明授权Method for verifying a test substrate in a prober under defined thermal conditions 有权用于在确定的热条件下验证探测器中的测试基板的方法公开(公告)号：US08692567B2
公开(公告)日：2014-04-08
申请号：US13119145
申请日：2009-07-31
CPC分类号： G01R1/0408 , G01R31/2855 , G01R31/2874 , G01R31/2875 , G01R31/2886
摘要： A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.
摘要翻译： 一种用于在确定的热条件下在探测器中验证或测试测试基板，即晶片和其它电子半导体部件的方法和装置。 这种本领域技术人员已知的探测器的验证装置具有壳体，该壳体具有至少两个壳体部分，在其一个壳体部分中，下文称为测试室，待验证的测试基板由 卡盘并设定在限定的温度，并且在其另一个壳体部分中，下文称为探针室，探针被保持。 为了验证目的，测试基板和探针通过至少一个定位装置相对于彼此定位，并且探头随后与测试基板接触。
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