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    MELAMINE WIPES
    2.
    发明公开
    MELAMINE WIPES 审中-公开

    公开(公告)号：US20240181744A1

    公开(公告)日：2024-06-06

    申请号：US18441464

    申请日：2024-02-14

    Applicant: THE CLOROX COMPANY

    Inventor： Nikhil P. DANI

    IPC: B32B5/26 ,  B08B1/14 ,  B32B5/02 ,  B32B5/06 ,  C11D17/04

    CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B5/06 ,  C11D17/049 ,  B08B1/143 ,  B32B2250/20 ,  B32B2260/023 ,  B32B2262/0253 ,  B32B2262/14 ,  B32B2432/00

    Abstract: Methods for manufacturing wipes including melamine entangled into a nonwoven, and associated articles of manufacture. Such a method may include providing a melamine sheet (e.g., contiguous, rather than discrete melamine particles), providing first and second nonwoven sheets, and positioning the melamine sheet between the first and second nonwoven sheets. The sandwich structure is hydroentangled at high pressure to force the melamine material to become entangled into the nonwoven material, to a degree that a portion of the melamine is actually exposed on the exterior face(s) of the wipe, which are generally provided by the nonwoven sheets. Such a wipe exhibits the drapability of a wipe, with the scrubbing benefits (e.g., very effective cleaning of baseboards, crayon off walls, etc.) of melamine, with greater durability than existing melamine cleaning articles, which tend to quickly crumble during use.

    Substrate cleaning device and substrate cleaning method
    3.
    发明授权
    Substrate cleaning device and substrate cleaning method 有权

    公开(公告)号：US12002688B2

    公开(公告)日：2024-06-04

    申请号：US18328626

    申请日：2023-06-02

    Applicant: EBARA CORPORATION

    Inventor： Haiyang Xu ,  Mitsuhiko Inaba

    IPC: H01L21/67 ,  B08B1/14 ,  B08B1/32 ,  B24B37/04 ,  B24B37/34 ,  H01L21/02

    CPC classification number: H01L21/67046 ,  B08B1/143 ,  B08B1/145 ,  B08B1/32 ,  B24B37/04 ,  B24B37/34 ,  H01L21/02096 ,  H01L21/67219

    Abstract: A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.

    Pre-loaded floor wipes with improved pickup
    4.
    发明授权
    Pre-loaded floor wipes with improved pickup 有权

    公开(公告)号：US11975366B2

    公开(公告)日：2024-05-07

    申请号：US17987173

    申请日：2022-11-15

    Applicant: The Clorox Company

    Inventor： Ashish K. Jha ,  Nikhil P. Dani ,  David R. Scheuing ,  Nancy A. Falk ,  Bryan K. Parrish

    IPC: B08B1/14 ,  C11D17/04 ,  A47L13/20

    CPC classification number: B08B1/143 ,  C11D17/049 ,  A47L13/20

    Abstract: A pre-loaded cleaning substrate, and related systems and methods for picking up particles with an aspect ratio (L/D) greater than 300 (e.g., hair), or greater than 1200 (e.g., particularly long hairs). The substrate (e.g., a nonwoven) may include only a single layer of material. The pre-loaded substrate is loaded (e.g., during manufacture) with a cleaning composition. The fibers of the substrate may have an average diameter less than 15 μm, the substrate may have an air permeability of 35 ft3/min to 75 ft3/min, and the liquid cleaning composition may have a surface tension of less than about 50 dynes/cm. Together, the combination of the particular substrate and cleaning composition may facilitate markedly improved ability to pick up high L/D aspect ratio particle debris (e.g., such as hair), while retaining such particles (e.g., providing hair retention index values of at least 20).

    GOLF BALL WASHING DEVICE
    5.
    发明公开
    GOLF BALL WASHING DEVICE 审中-公开

    公开(公告)号：US20240342564A1

    公开(公告)日：2024-10-17

    申请号：US18298457

    申请日：2023-04-11

    Applicant: Dale Holtz

    Inventor： Dale Holtz

    IPC: A63B47/04 ,  B08B1/00

    CPC classification number: A63B47/04 ,  B08B1/143 ,  B08B1/30

    Abstract: A golf ball washing device operable to provide cleaning of the outer surface of a golf ball and be carried in a golf bag or secured to a golf cart. The present invention includes a housing having a lower portion and an upper portion that are releasably secured. The lower portion has in the interior volume thereof a first section of a golf ball receiving member. A first cleaning member is disposed on the first section of the golf ball receiving member. A second section of the golf ball receiving member is rotatably mounted within the interior volume of the upper portion of the housing. The second section of the golf ball receiving member includes a second cleaning member. The first section and second section of the golf ball receiving member are mateably half dome shaped so as to surroundably cover a golf ball ensuing assembly of the housing.

    WAFER BACK SURFACE CLEANING DEVICE
    10.
    发明公开
    WAFER BACK SURFACE CLEANING DEVICE 审中-公开

    公开(公告)号：US20240173750A1

    公开(公告)日：2024-05-30

    申请号：US18283186

    申请日：2021-12-14

    Applicant: TOKYO SEIMITSU CO., LTD.

    Inventor： Junichi FUKUSHIMA

    IPC: B08B1/14 ,  B08B1/32 ,  B08B3/02

    CPC classification number: B08B1/143 ,  B08B1/32 ,  B08B3/02

    Abstract: A wafer back surface cleaning device preventing foreign matter from re-adhering to front and back surfaces of a wafer W during and after cleaning. A hand H1 receives a wafer W that has been cleaned at a cleaning position and conveys the wafer W to a subsequent process, a hand H2 that conveys the wafer W before grinding to the cleaning position and transfers the wafer W that has been cleaned to hand H1 with a front surface of the wafer directed upward A cleaning pad 13 and a cleaning water supply nozzle 14 supplies cleaning water to the cleaning pad 13 and discharges the cleaning water to a back surface of the wafer W, at the cleaning position, the hand H2 brings the back surface of the wafer W conveyed to the cleaning position into contact with the cleaning pad 13 to perform scrub cleaning on the back surface of the wafer, and receives the cleaning water from the cleaning water supply nozzle 14 on the back surface of the wafer after scrub cleaning to perform rinse cleaning, and then transfers the wafer W to the hand H1.

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