Abstract:
A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); a radiation-sensitive acid generator; and a solvent. R1 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; L1 represents a single bond or —COO-L-; L represents a substituted or unsubstituted alkanediyl group; R2 represents a monovalent hydrocarbon group having 1 to 20 carbon atoms; L2 represents a single bond or a divalent linking group; and Ar represents a group obtained by removing (n+1) hydrogen atoms from an aromatic ring. R3 is independently a halogen atom, a halogenated hydrocarbon group, a hydroxy group, a monovalent hydrocarbon group having 1 to 10 carbon atoms, or a monovalent alkyl ether group having 1 to 10 carbon atoms, and at least one R3 is a halogen atom or a halogenated hydrocarbon group.
Abstract:
The present invention provides methods for surface-modifying a rubber vulcanizate or a thermoplastic elastomer, which can cost-effectively provide a variety of functions, such as sliding properties, according to the application. The present invention relates to a method for surface-modifying a rubber vulcanizate or a thermoplastic elastomer as a target for modification, the method including: step 1 of forming polymerization initiation points on a surface of the modification target; and step 2 of radically polymerizing a non-functional monomer, starting from the polymerization initiation points, to grow non-functional polymer chains, and then radically polymerizing a fluoropolyether segment-containing functional monomer to grow functional polymer chains.
Abstract:
To provide a composition which comprises a fluorinated polymer having an alicyclic ring, from which a film having excellent in-plane uniformity and small surface roughness can be formed by an electrospraying apparatus, and a method for producing a film-provided substrate using the composition. A composition comprising a fluorinated polymer having an alicyclic ring and a solvent, wherein the solvent contains at least one high boiling point solvent having a boiling point of at least 150° C., and the solvent has a dielectric constant of at least 5. And, a method for producing a film-provided substrate, which comprises applying the composition to a substrate by an electrospraying apparatus to form a film containing the fluorinated polymer.
Abstract:
A POLYPERFLUOROBUTADIENE WHICH IS A COPOLYMER OF PERFLUORO-1,2- AND 1,4-BUTADIENE. ONE METHOD OF INITIATING THE POLYMERIZATION OF THE PERFLUOROBUTADIENE UTILIZE DIISOPROPL PEROXYDICARBONATE.
Abstract:
The present invention provides methods for surface-modifying a rubber vulcanizate or a thermoplastic elastomer, which can cost-effectively provide a variety of functions, such as sliding properties, according to the application. The present invention relates to a method for surface-modifying a rubber vulcanizate or a thermoplastic elastomer as a target for modification, the method including: step 1 of forming polymerization initiation points on a surface of the modification target; and step 2 of radically polymerizing a non-functional monomer, starting from the polymerization initiation points, to grow non-functional polymer chains, and then radically polymerizing a fluoropolyether segment-containing functional monomer to grow functional polymer chains.
Abstract:
According to the present invention, there is provided a resin composition which can provide an insulating resin having excellent heat resistance and flame retardance after curing and showing a low dielectric constant.A fluorine-containing photo-setting resin composition comprising a polymer containing fluorine or a fluorine-containing group represented by general formula [II]: ##STR1## wherein R.sup.1 and R.sup.2 are selected from the group consisting of H, F, CH.sub.3 and CF.sub.3 ; R.sup.3 and R.sup.4 are selected from the group consisting of CH.sub.2 and CF.sub.2 ; x and y show 0 to 4 and m shows 30 to 1000, and a photopolymerization initiator, which is a solid at ambient temperature, melts between 100.degree. and 150.degree. C., has a melt viscosity of not greater than 10.sup.6 poise and is photocurable.