摘要:
The present invention relates to a process for producing a resin composition for an optical semiconductor from a powdery material and a liquid material using a kneader having a first supply port and a secondary supply port disposed at a downstream side of the first supply port, the process including: a step of supplying the powdery material into the kneader from the first supply port and delivering the powdery material to a second supply port side by the kneader at a temperature at which the powdery material is not melted; a step of melting the powdery material by heating and simultaneously supplying the liquid material from the second supply port under a pressure higher than a pressure in the kneader to knead a melted product of the powdery material and the liquid material; and a step of further kneading a kneaded product thereof while cooling.
摘要:
Methods and systems and components made according to the methods and systems, are disclosed relating to improved curing methods for epoxy resin-containing composite prepreg materials, wherein the composite prepreg materials are exposed to a flow of ammonia-containing compounds to fully cure the composite prepreg materials at substantially ambient temperatures and pressures.
摘要:
The invention relates to foams of high thermal stability, to the production thereof from organic polyisocyanates and polyepoxides, and to the use of the foams.
摘要:
Methods and systems and components made according to the methods and systems, are disclosed relating to improved curing methods for epoxy resin-containing composite prepreg materials, wherein the composite prepreg materials are exposed to a flow of ammonia-containing compounds to fully cure the composite prepreg materials at substantially ambient temperatures and pressures.
摘要:
The invention relates to foams of high thermal stability, to the production thereof from organic polyisocyanates and polyepoxides, and to the use of the foams.
摘要:
The present invention relates to a process for producing a resin composition for an optical semiconductor from a powdery material and a liquid material using a kneader having a first supply port and a secondary supply port disposed at a downstream side of the first supply port, the process including: a step of supplying the powdery material into the kneader from the first supply port and delivering the powdery material to a second supply port side by the kneader at a temperature at which the powdery material is not melted; a step of melting the powdery material by heating and simultaneously supplying the liquid material from the second supply port under a pressure higher than a pressure in the kneader to knead a melted product of the powdery material and the liquid material; and a step of further kneading a kneaded product thereof while cooling.