Preparation of hyperbranched poly(triazole)s by in situ click polymerization and adhesive containing the same
    2.
    发明授权
    Preparation of hyperbranched poly(triazole)s by in situ click polymerization and adhesive containing the same 有权
    通过原位点击聚合制备超支化聚(三唑),并含有它们的粘合剂

    公开(公告)号:US08524858B2

    公开(公告)日:2013-09-03

    申请号:US12984886

    申请日:2011-01-05

    IPC分类号: C08G73/06 C08G73/00

    摘要: Provided is a high temperature-resistant metal adhesive containing hyperbranched poly(triazole)s synthesized by in situ azide/alkyne click polymerization. Also provided is a method for preparing the same adhesives by in situ click polymerization of azide and alkyne monomers on metal substrates. The method is optimized to get high adhesive strength at room temperature or elevated temperatures by analyzing the effects of monomer ratio, curing temperature and time, and annealing temperature and time. The hyberbranched poly(triazole)s adhesive has comparable or better temperature resistance compared with known high temperature epoxy metal adhesives, and it is the first high temperature metal adhesive using hyperbranched poly(triazole)s prepared by in situ azide/alkyne click polymerization.

    摘要翻译: 提供含有通过原位叠氮化物/炔烃聚合合成的超支化聚(三唑)的耐高温金属粘合剂。 还提供了通过在金属基底上原位点击叠氮化物和炔单体来制备相同粘合剂的方法。 该方法通过分析单体比例,固化温度和时间以及退火温度和时间的影响,在室温或高温下得到高粘合强度。 与已知的高温环氧金属粘合剂相比,支链聚(三唑)粘合剂具有相当或更好的耐温性,并且是使用通过原位叠氮化物/炔烃聚合制备的超支化聚(三唑)的第一种高温金属粘合剂。

    Use of polybenzoxazoles (PBOS) for adhesion
    3.
    发明申请
    Use of polybenzoxazoles (PBOS) for adhesion 有权
    使用聚苯并恶唑(PBOS)粘附

    公开(公告)号:US20030149207A1

    公开(公告)日:2003-08-07

    申请号:US10208397

    申请日:2002-07-30

    IPC分类号: C08F026/06 C08F032/08

    CPC分类号: C09J179/06

    摘要: The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).

    摘要翻译: 本发明描述了使用聚苯并恶唑(PBO)粘合制品或材料,特别是半导体工业中用于芯片和晶片的部件,用于粘合材料,特别是芯片和晶片,芯片和/或晶片叠层 以及包含式(I)的聚苯并恶唑的粘合剂组合物。

    PREPARATION OF HYPERBRANCHED POLY(TRIAZOLE)S BY IN SITU CLICK POLYMERIZATION AND ADHESIVE CONTAINING THE SAME
    5.
    发明申请
    PREPARATION OF HYPERBRANCHED POLY(TRIAZOLE)S BY IN SITU CLICK POLYMERIZATION AND ADHESIVE CONTAINING THE SAME 有权
    通过本发明的单一聚合和粘合剂制备超支化聚(三唑)

    公开(公告)号:US20110171448A1

    公开(公告)日:2011-07-14

    申请号:US12984886

    申请日:2011-01-05

    IPC分类号: C08G73/08 B05D3/10

    摘要: Provided is a high temperature-resistant metal adhesive containing hyperbranched poly(triazole)s synthesized by in situ azide/alkyne click polymerization. Also provided is a method for preparing the same adhesives by in situ click polymerization of azide and alkyne monomers on metal substrates. The method is optimized to get high adhesive strength at room temperature or elevated temperatures by analyzing the effects of monomer ratio, curing temperature and time, and annealing temperature and time. The hyberbranched poly(triazole)s adhesive has comparable or better temperature resistance compared with known high temperature epoxy metal adhesives, and it is the first high temperature metal adhesive using hyperbranched poly(triazole)s prepared by in situ azide/alkyne click polymerization.

    摘要翻译: 提供含有通过原位叠氮化物/炔烃聚合合成的超支化聚(三唑)的耐高温金属粘合剂。 还提供了通过在金属基底上原位点击叠氮化物和炔单体来制备相同粘合剂的方法。 该方法通过分析单体比例,固化温度和时间以及退火温度和时间的影响,在室温或高温下得到高粘合强度。 与已知的高温环氧金属粘合剂相比,支链聚(三唑)粘合剂具有相当或更好的耐温性,并且是使用通过原位叠氮化物/炔烃聚合制备的超支化聚(三唑)的第一种高温金属粘合剂。

    Use of polybenzoxazoles (PBOS) for adhesion

    公开(公告)号:US07052936B2

    公开(公告)日:2006-05-30

    申请号:US10208397

    申请日:2002-07-30

    IPC分类号: H01L21/44 H01L21/48 H01L21/50

    CPC分类号: C09J179/06

    摘要: The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).