摘要:
Adhesive formulations and methods for making adhesive formulations are provided. An adhesive formulation includes at least one oxazoline polymer and casein. Methods of making adhesive formulations include combining at least one oxazoline polymer and casein to form the adhesive formulation. Glue sticks made using these adhesive formulations and methods are also provided.
摘要:
Provided is a high temperature-resistant metal adhesive containing hyperbranched poly(triazole)s synthesized by in situ azide/alkyne click polymerization. Also provided is a method for preparing the same adhesives by in situ click polymerization of azide and alkyne monomers on metal substrates. The method is optimized to get high adhesive strength at room temperature or elevated temperatures by analyzing the effects of monomer ratio, curing temperature and time, and annealing temperature and time. The hyberbranched poly(triazole)s adhesive has comparable or better temperature resistance compared with known high temperature epoxy metal adhesives, and it is the first high temperature metal adhesive using hyperbranched poly(triazole)s prepared by in situ azide/alkyne click polymerization.
摘要:
The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).
摘要:
A method to produce a panel. The method includes providing a core having a first surface, providing a surface layer including a substantially uncured amino resin, applying an hydrolysable adhesive on the first surface of the core and/or on a surface of the surface layer adapted to face the core, arranging the surface layer on the first surface of the core, pressing the surface layer to the core to form a panel by applying heat and pressure in a press, thereby adhering the surface layer to the core by the hydrolysable adhesive and curing the amino resin of the surface layer. Also such a panel.
摘要:
Provided is a high temperature-resistant metal adhesive containing hyperbranched poly(triazole)s synthesized by in situ azide/alkyne click polymerization. Also provided is a method for preparing the same adhesives by in situ click polymerization of azide and alkyne monomers on metal substrates. The method is optimized to get high adhesive strength at room temperature or elevated temperatures by analyzing the effects of monomer ratio, curing temperature and time, and annealing temperature and time. The hyberbranched poly(triazole)s adhesive has comparable or better temperature resistance compared with known high temperature epoxy metal adhesives, and it is the first high temperature metal adhesive using hyperbranched poly(triazole)s prepared by in situ azide/alkyne click polymerization.
摘要:
The present invention describes the use of polybenzoxazoles (PBOs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the polybenzoxazoles of the formula (I).