公开(公告)号：US09333619B2

公开(公告)日：2016-05-10

申请号：US13758658

申请日：2013-02-04

Applicant: Chu-An Lee ,  Hui-Chi Huang ,  Peng-Chung Jangjian

Inventor： Chu-An Lee ,  Hui-Chi Huang ,  Peng-Chung Jangjian

IPC: H01L21/465 ,  B24B37/20 ,  B24B37/013 ,  B24B49/12 ,  H01J37/32 ,  H01L21/66 ,  H01L21/321

CPC classification number: B24B37/20 ,  B24B37/013 ,  B24B37/205 ,  B24B49/12 ,  G05B2219/49085 ,  H01J37/32963 ,  H01L21/3212 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure provides a chemical mechanical polishing (CMP) system. The CMP system includes a pad designed for wafer polishing, a motor driver coupled with the pad and designed to drive the pad during the wafer polishing, and a controller coupled with the motor driver and designed to control the motor driver. The CMP system further includes an in-situ rate monitor designed to collect polishing data from a wafer on the pad, determine CMP endpoint based on a life stage of the pad, and provide the CMP endpoint to the controller.

Abstract translation: 本公开提供了一种化学机械抛光（CMP）系统。 CMP系统包括设计用于晶片抛光的焊盘，与焊盘耦合并设计成在晶片抛光期间驱动焊盘的电动机驱动器，以及与电动机驱动器耦合并设计成控制电动机驱动器的控制器。 CMP系统还包括原位速率监测器，其设计用于收集来自焊盘上的晶片的抛光数据，基于焊盘的寿命阶段确定CMP端点，并将CMP端点提供给控制器。

公开(公告)号：US08367429B2

公开(公告)日：2013-02-05

申请号：US13045289

申请日：2011-03-10

Applicant: Chu-An Lee ,  Hui-Chi Huang ,  Peng-Chung Jangjian

Inventor： Chu-An Lee ,  Hui-Chi Huang ,  Peng-Chung Jangjian

IPC: H01L21/66 ,  H01L21/306

CPC classification number: B24B37/20 ,  B24B37/013 ,  B24B37/205 ,  B24B49/12 ,  G05B2219/49085 ,  H01J37/32963 ,  H01L21/3212 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure provides a semiconductor manufacturing method. The method includes defining a plurality of time regions of pad life for a polishing pad in a chemical mechanical polishing (CMP) system; assigning a ladder coefficient to the polishing pad according to the plurality of time regions of pad life; defining a plurality of endpoint windows to the plurality of time regions, respectively, according to pad life effect; applying a CMP process to a wafer positioned on the polishing pad; determining a time region of a polishing signal of the wafer based on the ladder coefficient; associating one of the endpoint windows to the polishing signal according to the time region; and ending the CMP process at an endpoint determined by the endpoint window.

Abstract translation: 本发明提供一种半导体制造方法。 该方法包括在化学机械抛光（CMP）系统中为抛光垫定义多个焊盘寿命的时间区域; 根据焊盘寿命的多个时间区域向抛光垫分配梯形系数; 根据垫寿命效应分别将多个端点窗口定义到多个时间区域; 将CMP处理施加到位于抛光垫上的晶片; 基于梯形系数确定晶片的抛光信号的时间区域; 根据时间区域将端点窗口之一与抛光信号相关联; 并在由端点窗口确定的端点处结束CMP进程。

公开(公告)号：US20040043700A1

公开(公告)日：2004-03-04

申请号：US10232854

申请日：2002-08-28

Inventor： Jim Hofmann

IPC: B24B049/00 ,  B24B051/00

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/00 ,  G05B13/04 ,  G05B2219/33043 ,  G05B2219/45232 ,  G05B2219/49085

Abstract: An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop operates online, and the outer control loop operates asynchronously with respect to the inner control loop. The online control loop is updated for each subsequent process. The offline metrology is optionally updated for each subsequent process.

Abstract translation: 一种算法使用离线计量来通过将信息从外部控制环路传递到内部控制回路来控制过程，扩展卡尔曼滤波器估计器。 内部控制回路在线运行，外部控制回路相对于内部控制回路异步运行。 在每个后续过程中更新在线控制循环。 可选地为每个后续过程更新离线计量。

公开(公告)号：US20160018815A1

公开(公告)日：2016-01-21

申请号：US14333395

申请日：2014-07-16

Applicant: Applied Materials, Inc.

Inventor： Tomohiko Kitajima ,  Jeffrey Drue David ,  Jun Qian ,  Taketo Sekine ,  Garlen C. Leung ,  Sidney P. Huey

IPC: G05B19/418

CPC classification number: G05B19/418 ,  B24B37/013 ,  G05B2219/45031 ,  G05B2219/45232 ,  G05B2219/49085 ,  H01L21/31053 ,  H01L22/12 ,  H01L22/26 ,  Y02P90/02

Abstract: A method of controlling polishing includes storing a base spectrum, the base spectrum being a spectrum of light reflected from a substrate after deposition of a deposited dielectric layers overlying a metallic layer or semiconductor wafer and before deposition of a non-metallic layer over the plurality of deposited dielectric layer. After deposition of the non-metallic layer and during polishing of the non-metallic layer on the substrate, measurements of a sequence of raw spectra of light reflected the substrate during polishing are received from an in-situ optical monitoring system. Each raw spectrum is normalized to generate a sequence of normalized spectra using the raw spectrum and the base spectrum. At least one of a polishing endpoint or an adjustment for a polishing rate is determined based on at least one normalized predetermined spectrum from the sequence of normalized spectra.

Abstract translation: 控制抛光的方法包括：存储基色谱，所述基色谱是在沉积覆盖在金属层或半导体晶片上的沉积的介电层之后并且在非金属层上沉积多个 沉积介电层。 在沉积非金属层之后并且在非金属层的抛光过程中，从原位光学监测系统接收在抛光期间反射基板的原始光谱序列的测量。 对每个原始光谱进行归一化，以使用原始光谱和基色谱产生归一化光谱序列。 基于归一化光谱序列中的至少一个归一化的预定光谱来确定抛光终点或抛光速率的调整中的至少一个。

公开(公告)号：US20120231555A1

公开(公告)日：2012-09-13

申请号：US13045289

申请日：2011-03-10

Applicant: Chu-An Lee ,  Hui-Chi Huang ,  Peng-Chung Jangjian

Inventor： Chu-An Lee ,  Hui-Chi Huang ,  Peng-Chung Jangjian

IPC: H01L21/66 ,  H01L21/306 ,  B24B49/00

CPC classification number: B24B37/20 ,  B24B37/013 ,  B24B37/205 ,  B24B49/12 ,  G05B2219/49085 ,  H01J37/32963 ,  H01L21/3212 ,  H01L22/26 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure provides a semiconductor manufacturing method. The method includes defining a plurality of time regions of pad life for a polishing pad in a chemical mechanical polishing (CMP) system; assigning a ladder coefficient to the polishing pad according to the plurality of time regions of pad life; defining a plurality of endpoint windows to the plurality of time regions, respectively, according to pad life effect; applying a CMP process to a wafer positioned on the polishing pad; determining a time region of a polishing signal of the wafer based on the ladder coefficient; associating one of the endpoint windows to the polishing signal according to the time region; and ending the CMP process at an endpoint determined by the endpoint window.

Abstract translation: 本发明提供一种半导体制造方法。 该方法包括在化学机械抛光（CMP）系统中为抛光垫定义多个焊盘寿命的时间区域; 根据焊盘寿命的多个时间区域向抛光垫分配梯形系数; 根据垫寿命效应分别将多个端点窗口定义到多个时间区域; 将CMP处理施加到位于抛光垫上的晶片; 基于梯形系数确定晶片的抛光信号的时间区域; 根据时间区域将端点窗口之一与抛光信号相关联; 并在由端点窗口确定的端点处结束CMP进程。

公开(公告)号：US07087527B2

公开(公告)日：2006-08-08

申请号：US10232854

申请日：2002-08-28

Applicant: Jim Hofmann

Inventor： Jim Hofmann

IPC: H01L21/302

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/00 ,  G05B13/04 ,  G05B2219/33043 ,  G05B2219/45232 ,  G05B2219/49085

Abstract: An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop operates online, and the outer control loop operates asynchronously with respect to the inner control loop. The online control loop is updated for each subsequent process. The offline metrology is optionally updated for each subsequent process.

Abstract translation: 一种算法使用离线计量来通过将信息从外部控制环路传递到内部控制回路来控制过程，扩展卡尔曼滤波器估计器。 内部控制回路在线运行，外部控制回路相对于内部控制回路异步运行。 在每个后续过程中更新在线控制循环。 可选地为每个后续过程更新离线计量。

公开(公告)号：US20050284569A1

公开(公告)日：2005-12-29

申请号：US11216675

申请日：2005-08-31

Applicant: Jim Hofmann

Inventor： Jim Hofmann

IPC: G05B13/04 ,  C23F1/00

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/00 ,  G05B13/04 ,  G05B2219/33043 ,  G05B2219/45232 ,  G05B2219/49085

Abstract: An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop operates online, and the outer control loop operates asynchronously with respect to the inner control loop. The online control loop is updated for each subsequent process. The offline metrology is optionally updated for each subsequent process.

Abstract translation: 一种算法使用离线计量来通过将信息从外部控制环路传递到内部控制回路来控制过程，扩展卡尔曼滤波器估计器。 内部控制回路在线运行，外部控制回路相对于内部控制回路异步运行。 在每个后续过程中更新在线控制循环。 可选地为每个后续过程更新离线计量。

公开(公告)号：US11969855B2

公开(公告)日：2024-04-30

申请号：US18198587

申请日：2023-05-17

Applicant: Applied Materials, Inc.

Inventor： Sivakumar Dhandapani

IPC: B24B37/013 ,  B24B37/30 ,  B24B49/10

CPC classification number: B24B37/013 ,  B24B49/10 ,  B24B37/30 ,  G05B2219/49085

Abstract: A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, filtering a signal from the monitoring system to generate a filtered signal, and determining at least one of a polishing endpoint or an adjustment for a polishing rate from the filtered signal. The filtering includes modelling a plurality of periodic disturbances at a plurality of different frequencies using a plurality of disturbance states, modelling an underlying signal using a plant state, and applying a linear prediction filter to the plant state and the plurality of disturbance states to generate a filtered signal representing the underlying signal.

公开(公告)号：US09811077B2

公开(公告)日：2017-11-07

申请号：US14333395

申请日：2014-07-16

Applicant: Applied Materials, Inc.

Inventor： Tomohiko Kitajima ,  Jeffrey Drue David ,  Jun Qian ,  Taketo Sekine ,  Garlen C. Leung ,  Sidney P. Huey

IPC: G06F19/00 ,  G05B19/418

CPC classification number: G05B19/418 ,  B24B37/013 ,  G05B2219/45031 ,  G05B2219/45232 ,  G05B2219/49085 ,  H01L21/31053 ,  H01L22/12 ,  H01L22/26 ,  Y02P90/02

Abstract: A method of controlling polishing includes storing a base spectrum, the base spectrum being a spectrum of light reflected from a substrate after deposition of a deposited dielectric layers overlying a metallic layer or semiconductor wafer and before deposition of a non-metallic layer over the plurality of deposited dielectric layer. After deposition of the non-metallic layer and during polishing of the non-metallic layer on the substrate, measurements of a sequence of raw spectra of light reflected the substrate during polishing are received from an in-situ optical monitoring system. Each raw spectrum is normalized to generate a sequence of normalized spectra using the raw spectrum and the base spectrum. At least one of a polishing endpoint or an adjustment for a polishing rate is determined based on at least one normalized predetermined spectrum from the sequence of normalized spectra.

公开(公告)号：US07329168B2

公开(公告)日：2008-02-12

申请号：US11216675

申请日：2005-08-31

Applicant: Jim Hofmann

Inventor： Jim Hofmann

IPC: B24B51/00

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B49/00 ,  G05B13/04 ,  G05B2219/33043 ,  G05B2219/45232 ,  G05B2219/49085

Abstract: An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop operates online, and the outer control loop operates asynchronously with respect to the inner control loop. The online control loop is updated for each subsequent process. The offline metrology is optionally updated for each subsequent process.

Abstract translation: 一种算法使用离线计量来通过将信息从外部控制环路传递到内部控制回路来控制过程，扩展卡尔曼滤波器估计器。 内部控制回路在线运行，外部控制回路相对于内部控制回路异步运行。 在每个后续过程中更新在线控制循环。 可选地为每个后续过程更新离线计量。