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    POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION OF OUTER LAYER
    1.
    发明申请
    POLISHING WITH MEASUREMENT PRIOR TO DEPOSITION OF OUTER LAYER 审中-公开
    在外层沉积之前进行抛光

    公开(公告)号：US20160284615A1

    公开(公告)日：2016-09-29

    申请号：US15173584

    申请日：2016-06-03

    申请人： Applied Materials, Inc.

    发明人： Tomohiko Kitajima ,  Jeffrey Drue David ,  Jun Qian ,  Taketo Sekine ,  Garlen C. Leung ,  Sidney P. Huey

    IPC分类号： H01L21/66 ,  H01L21/321 ,  B24B49/10 ,  H01L21/311 ,  B24B37/013 ,  H01L21/3105 ,  H01L21/67

    CPC分类号： H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L22/14 ,  H01L22/20 ,  H01L22/34

    摘要： A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer, after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.

    摘要翻译： 控制抛光的方法包括存储基底测量，所述基底测量是沉积覆盖在半导体晶片上的至少一个层之后并且在外层沉积外层之后在所述至少一个层上沉积之后的衬底的测量值 层，并且在衬底上的外层的抛光期间，从原位监测系统接收衬底的原始测量序列，对原始测量序列中的每个原始测量进行归一化，以生成标准化的序列 使用原始测量和基础测量的测量，以及至少基于归一化测量的顺序来确定抛光终点或抛光速率的调整中的至少一个。

    POLISHING WITH PRE DEPOSITION SPECTRUM
    2.
    发明申请
    POLISHING WITH PRE DEPOSITION SPECTRUM 有权
    用预沉积光谱进行抛光

    公开(公告)号：US20160018815A1

    公开(公告)日：2016-01-21

    申请号：US14333395

    申请日：2014-07-16

    申请人： Applied Materials, Inc.

    发明人： Tomohiko Kitajima ,  Jeffrey Drue David ,  Jun Qian ,  Taketo Sekine ,  Garlen C. Leung ,  Sidney P. Huey

    IPC分类号： G05B19/418

    CPC分类号： G05B19/418 ,  B24B37/013 ,  G05B2219/45031 ,  G05B2219/45232 ,  G05B2219/49085 ,  H01L21/31053 ,  H01L22/12 ,  H01L22/26 ,  Y02P90/02

    摘要： A method of controlling polishing includes storing a base spectrum, the base spectrum being a spectrum of light reflected from a substrate after deposition of a deposited dielectric layers overlying a metallic layer or semiconductor wafer and before deposition of a non-metallic layer over the plurality of deposited dielectric layer. After deposition of the non-metallic layer and during polishing of the non-metallic layer on the substrate, measurements of a sequence of raw spectra of light reflected the substrate during polishing are received from an in-situ optical monitoring system. Each raw spectrum is normalized to generate a sequence of normalized spectra using the raw spectrum and the base spectrum. At least one of a polishing endpoint or an adjustment for a polishing rate is determined based on at least one normalized predetermined spectrum from the sequence of normalized spectra.

    摘要翻译： 控制抛光的方法包括：存储基色谱，所述基色谱是在沉积覆盖在金属层或半导体晶片上的沉积的介电层之后并且在非金属层上沉积多个 沉积介电层。 在沉积非金属层之后并且在非金属层的抛光过程中，从原位光学监测系统接收在抛光期间反射基板的原始光谱序列的测量。 对每个原始光谱进行归一化，以使用原始光谱和基色谱产生归一化光谱序列。 基于归一化光谱序列中的至少一个归一化的预定光谱来确定抛光终点或抛光速率的调整中的至少一个。