Abstract:
The vacuum tube subject to the present invention comprises a filament and two pairs of a grid and an anode. The filament is tensioned linearly and emitting thermoelectrons. Both of the anodes are formed on the same face on a planar substrate. The filament is arranged parallel to the planar substrate at a position facing both of the anodes. Each of the grids is arranged, such that the grid faces the anode in the same pair at a first predetermined distance from the anode and has a second predetermined distance from the filament, between the anode and the filament. The vacuum tube comprises an intermediate filament fixing part fixing the filament at a position corresponding to an intermediate point between the anodes of the two pairs.
Abstract:
A high voltage, high current vacuum integrated circuit includes a common vacuum enclosure that includes at least two cold-cathode field emission electron tubes, and contains at least one internal vacuum pumping means, at least one exhaust tubulation, vacuum-sealed electrically-insulated feedthroughs, and internal electrical insulation. The cold-cathode field emission electron tubes are configured to operate at high voltage and high current and interconnected with each other to implement a circuit function.
Abstract:
A vacuum tube includes a filament and two pairs of a grid and an anode. The filament is tensioned linearly and emits thermoelectrons. Both of the anodes are formed on a same face on a planar substrate. The filament is arranged parallel to the planar substrate at a position facing both of the anodes. Each of the grids is arranged, such that the grid faces the anode of a same pair at a first predetermined distance from the anode and has a second predetermined distance from the filament, between the anode and the filament. The vacuum tube further includes an intermediate filament fixing part fixing the filament at a position corresponding to an intermediate point between the anodes of the two pairs.
Abstract:
An object of the present invention is to provide a vacuum tube with a structure close to that of an inexpensive and easily available vacuum fluorescent display which easily operates as an analog amplifier. A vacuum tube subject to the present invention comprises: a filament which is tensioned linearly and emits thermoelectrons, an anode arranged parallel to the filament, and a grid arranged between the filament and the anode such that the grid faces the anode. The present invention is characterized in that a distance between the filament and the grid is between 0.2 mm and 0.6 mm, including 0.2 mm and 0.6 mm.
Abstract:
A high voltage, high current vacuum integrated circuit includes a common vacuum enclosure that includes at least two cold-cathode field emission electron tubes, and contains at least one internal vacuum pumping means, at least one exhaust tubulation, vacuum-sealed electrically-insulated feedthroughs, and internal electrical insulation. The cold-cathode field emission electron tubes are configured to operate at high voltage and high current and interconnected with each other to implement a circuit function.
Abstract:
A vacuum device, including a substrate and a support structure having a support perimeter, where the support structure is disposed over the substrate. In addition, the vacuum device also includes a non-evaporable getter layer having an exposed surface area. The non-evaporable getter layer is disposed over the support structure, and extends beyond the support perimeter, in at least one direction, of the support structure forming a vacuum gap between the substrate and the non-evaporable getter layer increasing the exposed surface area.
Abstract:
An object of the present invention is to provide a vacuum tube with a structure close to that of an inexpensive and easily available vacuum fluorescent display which easily operates as an analog amplifier. A vacuum tube subject to the present invention comprises: a filament which is tensioned linearly and emits thermoelectrons, an anode arranged parallel to the filament, and a grid arranged between the filament and the anode such that the grid faces the anode. The present invention is characterized in that a distance between the filament and the grid is between 0.2 mm and 0.6 mm, including 0.2 mm and 0.6 mm.
Abstract:
High voltage high current regulator circuit for regulating current is interposed between first and second terminals connected to an external circuit and comprises at least one main-current carrying cold-cathode field emission electron tube conducting current between the first and second terminals. First and second grid-control cold-cathode field emission electron tubes provide control signals for first and second grids of the at least one main-current carrying cold-cathode field emission electron tube for positive and negative excursions of voltage on the first and second terminals, respectively. The current regulator circuit may be accompanied by a voltage-clamping circuit that includes at least one cold-cathode field emission electron tube. At least two cold-cathode field emission electron tubes, configured to operate at high voltage and high current, are preferably contained within a single vacuum enclosure and are interconnected to provide a circuit function, so as to form a high voltage high current vacuum integrated circuit.
Abstract:
A vacuum device, including a substrate and a support structure having a support perimeter, where the support structure is disposed over the substrate. In addition, the vacuum device also includes a non-evaporable getter layer having an exposed surface area. The non-evaporable getter layer is disposed over the support structure, and extends beyond the support perimeter, in at least one direction, of the support structure forming a vacuum gap between the substrate and the non-evaporable getter layer increasing the exposed surface area.
Abstract:
A microdevice assembly (20) that includes a device microstructure (22), a housing (30), and a fine grain getter layer (40). The housing (30) has a base portion (32) and a lid (34). The device microstructure (22) is attached to the base portion (32) and the lid (34) is hermetically sealed to the base portion (32). The housing (30) defines a cavity (38) surrounding the device microstructure (22). The fine grain getter layer (40) is on an interior side (42) of the lid (34) for maintaining a vacuum in the cavity (38) surrounding the device microstructure (22). The lid (34) may be made of metal or have at least a metallic surface in the region where the fine grain getter layer (40) is applied. The fine grain getter layer (40) has a sub-micron grain size. There is also a method for making the microdevice assembly (20).