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公开(公告)号:US20170098628A1
公开(公告)日:2017-04-06
申请号:US15212125
申请日:2016-07-15
申请人: MediaTek Inc.
发明人: Nai-Wei LIU , Tzu-Hung LIN , I-Hsuan PENG , Ching-Wen HSIAO , Wei-Che HUANG
IPC分类号: H01L25/065 , H01L23/498 , H01L21/56 , H01L23/00 , H01L23/31
CPC分类号: H01L25/0657 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3128 , H01L23/3142 , H01L23/49805 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/73 , H01L24/94 , H01L24/97 , H01L25/105 , H01L2224/03011 , H01L2224/03502 , H01L2224/036 , H01L2224/04042 , H01L2224/04105 , H01L2224/06136 , H01L2224/06146 , H01L2224/06156 , H01L2224/06166 , H01L2224/10126 , H01L2224/12105 , H01L2224/16235 , H01L2224/17136 , H01L2224/17146 , H01L2224/17156 , H01L2224/17166 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06548 , H01L2225/06568 , H01L2225/06572 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/10253 , H01L2924/1431 , H01L2924/1432 , H01L2924/1436 , H01L2924/15311 , H01L2924/18162 , H01L2924/19105 , H01L2924/3511 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/83 , H01L2224/214 , H01L2924/00
摘要: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor body and a conductive structure disposed below the semiconductor body. The semiconductor package structure also includes an insulating layer surrounding the conductive structure. The semiconductor package structure further includes a redistribution layer structure coupled to the conductive structure. In addition, the semiconductor package structure includes a molding compound surrounding the semiconductor body. A portion of the molding compound extends between the redistribution layer structure and the semiconductor body.