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    SEMICONDUCTOR PACKAGE
    1.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20230387075A1

    公开(公告)日：2023-11-30

    申请号：US18303693

    申请日：2023-04-20

    Applicant: MEDIATEK INC.

    Inventor： Yi-Lin TSAI ,  Wen-Sung HSU ,  Nai-Wei LIU

    IPC: H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00

    CPC classification number: H01L25/0655 ,  H01L23/5385 ,  H01L23/5383 ,  H01L23/3185 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

    Abstract: A semiconductor package includes an interposer over a substrate that includes interconnect traces, a redistribution structure on the interposer, a first semiconductor structure, a second semiconductor structure and a third semiconductor structure on the redistribution structure. The first semiconductor structure includes a first semiconductor die and a first encapsulant that encapsulates the first semiconductor die. The second semiconductor structure includes a second semiconductor die and a second encapsulant that encapsulates the second semiconductor die. The third semiconductor structure is disposed adjacent to a corner or an edge of the substrate in a top plan view of the substrate. The third semiconductor structure includes a third semiconductor die and a third encapsulant that encapsulates the third semiconductor die. The third semiconductor structure is electrically insulated from the substrate, the first semiconductor structure and the second semiconductor structure.

    SEMICONDUCTOR PACKAGE INCLUDING LID STRUCTURE WITH OPENING AND RECESS
    3.
    发明申请
    SEMICONDUCTOR PACKAGE INCLUDING LID STRUCTURE WITH OPENING AND RECESS 审中-公开

    公开(公告)号：US20190043771A1

    公开(公告)日：2019-02-07

    申请号：US16002138

    申请日：2018-06-07

    Applicant: MEDIATEK INC.

    Inventor： Chia-Cheng CHANG ,  Tzu-Hung LIN ,  I-Hsuan PENG ,  Nai-Wei LIU

    IPC: H01L23/053 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16 ,  H01L23/00

    Abstract: A semiconductor package structure including a package substrate, at least one semiconductor die, a lid structure, a first electronic component and a heat sink is provided. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is on the first surface of the package substrate and is surrounded by an encapsulating layer. The lid structure surrounds and is spaced apart from the encapsulating layer. The lid structure includes a first opening that is covered by the first surface of the package substrate. The first electronic component is over the first surface of the package substrate and arranged within the first opening of the lid structure. The heat sink covers the lid structure and the semiconductor die.

    SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
    7.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME 有权

    公开(公告)号：US20220157732A1

    公开(公告)日：2022-05-19

    申请号：US17515864

    申请日：2021-11-01

    Applicant: MEDIATEK INC.

    Inventor： Yi-Lin TSAI ,  Nai-Wei LIU ,  Wen-Sung HSU

    IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

    Abstract: A semiconductor package includes a first die structure, a first redistribution structure that is disposed on the first die structure, a second die structure that is disposed on the first redistribution structure, and a second redistribution structure that is disposed on the second die structure. The first die structure includes an interposer, and the interposer includes a semiconductor substrate and through-vias that penetrate through the semiconductor substrate. A first integrated circuit die is disposed in the semiconductor substrate of the interposer. The second die structure includes a second integrated circuit die that is encapsulated in an encapsulant and several conductive pillars that penetrate through the encapsulant. The first integrated circuit die is electrically connected to the second integrated circuit die through the first redistribution structure, the conductive pillars, and the second redistribution structure.

    SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA
    9.
    发明申请
    SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING ANTENNA 有权

    公开(公告)号：US20210035930A1

    公开(公告)日：2021-02-04

    申请号：US16910354

    申请日：2020-06-24

    Applicant: MEDIATEK INC.

    Inventor： Yen-Yao CHI ,  Nai-Wei LIU ,  Tzu-Hung LIN

    IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01Q1/38 ,  H01Q1/22

    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes an antenna device and semiconductor package. The antenna device includes a conductive pattern layer including a first antenna element, formed in an insulating substrate and adjacent to a first surface of the insulating substrate. The antenna device also includes a second antenna element formed on a second surface of the insulating substrate opposite the first surface. The semiconductor package includes a redistribution layer (RDL) structure bonded and electrically connected to the conductive pattern layer. The semiconductor package also includes a first semiconductor die electrically connected to the RDL structure, and an encapsulating layer formed on the RDL structure and surrounding the first semiconductor die.

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