公开(公告)号：US20140312497A1

公开(公告)日：2014-10-23

申请号：US13866811

申请日：2013-04-19

申请人： INFINEON TECHNOLOGIES AG

发明人： Kok Chai Goh ,  Meng Tong Ong

IPC分类号： H01L23/00 ,  H01L23/28

CPC分类号： H01L24/27 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49524 ,  H01L23/60 ,  H01L24/31 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04034 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/24245 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/4005 ,  H01L2224/40101 ,  H01L2224/40105 ,  H01L2224/40245 ,  H01L2224/84002 ,  H01L2224/84005 ,  H01L2224/848 ,  H01L2224/84801 ,  H01L2224/84897 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/84 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/014

摘要： A method and apparatus for packaging a semiconductor chip is presented. A semiconductor device includes a chip, a lead, and an encapsulant. The encapsulant includes a stabilization layer, a laminate molding layer connected to the stabilization layer, and a conductive strip connected to the laminate molding layer. The conductive strip electrically connects the contact area of the chip to the lead.

摘要翻译： 提出了一种用于封装半导体芯片的方法和装置。 半导体器件包括芯片，引线和密封剂。 密封剂包括稳定层，连接到稳定层的层压成型层和连接到层压成型层的导电条。 导电带将芯片的接触区域电连接到引线。

公开(公告)号：US09209152B2

公开(公告)日：2015-12-08

申请号：US13866811

申请日：2013-04-19

申请人： Infineon Technologies AG

发明人： Kok Chai Goh ,  Meng Tong Ong

IPC分类号： H01L23/00 ,  H01L23/28 ,  H01L23/495 ,  H01L23/60 ,  H01L23/36 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/27 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/49524 ,  H01L23/60 ,  H01L24/31 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04034 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/24245 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/4005 ,  H01L2224/40101 ,  H01L2224/40105 ,  H01L2224/40245 ,  H01L2224/84002 ,  H01L2224/84005 ,  H01L2224/848 ,  H01L2224/84801 ,  H01L2224/84897 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/84 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/014

摘要： A method and apparatus for packaging a semiconductor chip is presented. A semiconductor device includes a chip, a lead, and an encapsulant. The encapsulant includes a stabilization layer, a laminate molding layer connected to the stabilization layer, and a conductive strip connected to the laminate molding layer. The conductive strip electrically connects the contact area of the chip to the lead.

摘要翻译： 提出了一种用于封装半导体芯片的方法和装置。 半导体器件包括芯片，引线和密封剂。 密封剂包括稳定层，连接到稳定层的层压成型层和连接到层压成型层的导电条。 导电带将芯片的接触区域电连接到引线。

公开(公告)号：US20130284794A1

公开(公告)日：2013-10-31

申请号：US13772208

申请日：2013-02-20

申请人： SANYO Electric Co., Ltd.

发明人： Takashi SUZUKI ,  Kouichi SAITOU ,  Yasuyuki YANASE

IPC分类号： B23K20/24 ,  B23K20/02

CPC分类号： B23K20/24 ,  B23K20/023 ,  B23K20/10 ,  B23K20/16 ,  B23K20/233 ,  B23K2101/42 ,  B23K2103/12 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37012 ,  H01L2224/37147 ,  H01L2224/7701 ,  H01L2224/773 ,  H01L2224/77621 ,  H01L2224/84002 ,  H01L2224/84011 ,  H01L2224/841 ,  H01L2224/84203 ,  H01L2224/84897 ,  H01L2924/00014

摘要： The metal bonding apparatus comprises: a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion; a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; and a heating unit configured to heat the first bonding portion and the second bonding portion, wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit.

摘要翻译： 金属接合装置包括：溶液供给单元，被配置为将能够以氧化铜作为主要成分洗脱氧化物的溶液供给到第一接合部和第二接合部中的至少一个; 压力单元，其构造成对所述第一接合部和所述第二接合部施加压力，以将所述溶液夹在所述第一接合部和所述第二接合部之间，并且在所述第一接合部和所述第二接合部之间的距离 结合部分减少; 以及加热单元，其构造成加热所述第一接合部和所述第二接合部，其中，所述第一接合部和所述第二接合部通过由所述加压单元施加的压力和来自所述加热单元的热而接合。