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    Solid-state imaging device and imaging device with combined dynamic vision sensor and imaging functions
    3.
    发明授权
    Solid-state imaging device and imaging device with combined dynamic vision sensor and imaging functions 有权

    公开(公告)号：US12058457B2

    公开(公告)日：2024-08-06

    申请号：US17641269

    申请日：2020-09-07

    申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION

    发明人： Pooria Mostafalu ,  Frederick Brady

    IPC分类号： H04N25/702 ,  H01L27/146 ,  H04N25/75

    CPC分类号： H04N25/702 ,  H01L27/14605 ,  H04N25/75 ,  H01L27/14643

    摘要： An imaging device includes a plurality of unit pixels or pixels, with each pixel separated from every other unit pixel by an isolation structure. Each unit pixel includes a photoelectric conversion unit, a pixel imaging signal readout circuit, and an address event detection readout circuit. A first transfer transistor selectively connects the photoelectric conversion unit to the pixel imaging signal readout circuit, and a second transfer transistor selectively connects the photoelectric conversion unit to the address event detection readout circuit. The photoelectric conversion unit, the pixel imaging signal readout circuit, the address event detection readout circuit, and the first and second transfer transistors for a given pixel are located within a pixel area defined by the isolation structure. The isolation structure may be in the form of a full thickness dielectric trench isolation structure.

    FOVEATED ROBOTIC VISION SYSTEM
    8.
    发明公开
    FOVEATED ROBOTIC VISION SYSTEM 审中-公开

    公开(公告)号：US20240022819A1

    公开(公告)日：2024-01-18

    申请号：US18221816

    申请日：2023-07-13

    申请人： Summer Robotics, Inc.

    发明人： Gerard Dirk Smits ,  Steven Dean Gottke

    IPC分类号： H04N23/695 ,  H04N25/702 ,  H04N23/56 ,  G06T7/13 ,  G06T7/20

    CPC分类号： H04N23/695 ,  H04N25/702 ,  H04N23/56 ,  G06T7/13 ,  G06T7/20

    摘要： Embodiments are directed to vision systems. Enclosures that each include event scanners, beam generators, or frame cameras may be provided such that the event cameras or the frame cameras may be arranged to provide foveated resolution and such that the enclosures each may include an aperture that enables beams from the beam generators to scan a scene that may be in a field-of-view (FOV) of the aperture. Paths may be scanned across objects in the scene with the beams. Events may be determined based on detection of beam reflections corresponding to objects in the scene. The enclosures may be rotated to orient the apertures into a physical position for continued scanning of the objects within the FOV based on directions of travel for the objects such that the directions of travel for the objects is based on scanned trajectories.

    Binnable time-of-flight pixel
    10.
    发明授权
    Binnable time-of-flight pixel 有权

    公开(公告)号：US11832003B2

    公开(公告)日：2023-11-28

    申请号：US17712171

    申请日：2022-04-03

    申请人： Shenzhen Goodix Technology Co., Ltd.

    发明人： Robert Daniel McGrath

    IPC分类号： H04N25/59 ,  H04N25/75 ,  H04N25/76 ,  H04N25/702 ,  H04N25/46 ,  H04N25/705 ,  H04N23/667 ,  H04N25/701

    CPC分类号： H04N25/59 ,  H04N23/667 ,  H04N25/46 ,  H04N25/702 ,  H04N25/705 ,  H04N25/75 ,  H04N25/76 ,  H04N25/701

    摘要： Binnable time-of-flight (ToF) pixels are described, such as for integration with image sensor pixels. Each binnable ToF pixel includes a central dump gate and sub-pixels that are nominally mirror-symmetric and identical around the dump gate. Each sub-pixel includes a photodiode region (or a respective portion of a photodiode region), a storage gate, a storage region, a transfer gate, and a floating diffusion (FD) region. In an array, the binnable ToF pixels are arranged to share FD regions with other binnable ToF pixels of the array. In an un-binned mode, each sub-pixel can integrate photocharge in its storage region until it is time for readout, at which time the photocharges can be transferred to its respective floating diffusion region for individualized readout. In a binned mode, sub-pixels can integrate photocharge directly in their FD regions, which facilitates charge binning of integrated photocharge from all sub-pixels sharing the same FD region.