-
公开(公告)号:US20240344178A1
公开(公告)日:2024-10-17
申请号:US18589320
申请日:2024-02-27
Applicant: CellMo Materials Innovation, Inc.
Inventor: Kicheol Hong , Hyeji Park , Teakyung Um , Heeman Choe
IPC: C22C1/08 , B22F1/06 , B22F1/10 , B22F3/10 , B22F3/11 , B22F3/22 , C22C23/00 , C22C23/02 , C22C23/04 , C22C23/06
CPC classification number: C22C1/08 , B22F1/06 , B22F1/10 , B22F3/11 , B22F3/222 , C22C23/00 , C22C23/02 , C22C23/04 , C22C23/06 , B22F3/10 , B22F2202/01 , B22F2301/058 , B22F2998/10 , C22C1/087
Abstract: Morphology, microstructure, compressive behavior, and biocorrosive properties of magnesium or magnesium alloy foams allow for their use in biodegradable biomedical, metal-air battery electrode, hydrogen storage, and lightweight transportation applications. Magnesium or Mg alloy foams are usually very difficult to manufacture due to the strong oxidation layer around the metallic particles; however, in this invention, they can be synthesized via a camphene-based freeze-casting process with the addition of graphite powder using precisely controlled heat-treatment parameters. The average porosity ranges from 45 to 85 percent and the median pore diameter is about a few tens to hundreds of microns, which are suitable for bio and energy applications utilizing their enhanced surface area. This invention based on powder-slurry freeze-casting method using camphene as a volatile solvent is also applicable for other metal foams such as iron, copper, or others to produce three-dimensional metal foams with high strut connectivity.
-
公开(公告)号:US11987870B2
公开(公告)日:2024-05-21
申请号:US17621530
申请日:2020-07-17
Applicant: Sanyo Special Steel Co., Ltd.
Inventor: Tetsuji Kuse , Yoshikazu Aikawa , Yuichi Nagatomi
CPC classification number: C22C9/00 , B22F1/00 , B22F1/05 , B22F1/06 , B22F1/065 , C22C9/06 , B22F2301/10 , B22F2304/10
Abstract: Provided is a Cu-based alloy powder that is suitable for a process involving rapid melting and rapid solidification and that can provide a shaped object superior in characteristics. The powder is composed of a Cu-based alloy, which contains an element M being one or more elements selected from Cr, Fe, Ni, Zr, and Nb: 0.1% by mass or more and 10.0% by mass or less, Si: more than 0% by mass and 0.20% by mass or less, P: more than 0% by mass and 0.10% by mass or less, and S: more than 0% by mass and 0.10% by mass or less, the balance being Cu and inevitable impurities. This powder has a ratio (D50/TD) of the average particle diameter D50 (μm) thereof to the tap density TD (Mg/m3) is 0.2×10−5·m4/Mg or more and 20×10−5·m4/Mg or less, and has a sphericity of 0.80 or more and 0.95 or less.
-
公开(公告)号:US20240141265A1
公开(公告)日:2024-05-02
申请号:US18547867
申请日:2021-12-08
Applicant: ASAHI GROUP HOLDINGS, LTD. , ASAHI BREWERIES, LTD.
Inventor: Nobuaki HAYASHI , Minori ENDO
Abstract: A low-alcohol beverage of the present invention is a citrus-savored low-alcohol beverage having an alcohol concentration of 3.0 v/v % or less, the low-alcohol beverage containing 0.1 to 2.5 v/v % gin converted to 100% of alcohol.
-
公开(公告)号:US11713274B2
公开(公告)日:2023-08-01
申请号:US17845512
申请日:2022-06-21
Applicant: DAEJOO ELECTRONIC MATERIALS CO., LTD.
Inventor: Chi Ho Yoon , Jin Ho Kwak , Won Jun Jo , Young Ho Lee , Jong Chan Lim , Moo Hyun Lim
IPC: H01B1/22 , C03C4/00 , C03C8/18 , C03C4/14 , C03C8/10 , C03C8/16 , H01L31/0224 , H01B1/02 , B22F1/00 , B22F1/10 , B22F1/06
CPC classification number: C03C8/18 , B22F1/00 , B22F1/06 , B22F1/10 , C03C4/14 , C03C8/10 , C03C8/16 , H01B1/02 , H01L31/022425 , C03C2204/00 , C03C2205/00
Abstract: A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.
-
公开(公告)号:US12116653B2
公开(公告)日:2024-10-15
申请号:US17026218
申请日:2020-09-19
Applicant: HRL Laboratories, LLC
Inventor: Jacob M. Hundley , Brennan D. Yahata , John H. Martin , Tobias A. Schaedler
IPC: B22F1/16 , B22F1/05 , B22F1/054 , B22F1/062 , B22F1/068 , B22F1/145 , B22F1/17 , B22F9/04 , C22C1/05
CPC classification number: C22C1/05 , B22F1/05 , B22F1/054 , B22F1/062 , B22F1/068 , B22F1/145 , B22F1/16 , B22F1/17 , B22F9/04 , B22F2009/043 , B22F2009/045 , B22F2304/05 , B22F2304/10 , B22F2304/15 , B22F2998/10 , B22F2999/00 , B22F1/06 , B22F1/05 , C22C1/05 , B22F2009/043 , B22F1/062
Abstract: This disclosure provides an improvement over the state of the art by teaching a low-cost method to produce feedstock powder, without undergoing a phase change, from industrially relevant wrought alloys that are widely available at low cost. The surfaces of aspherical particles are functionalized with particulates having a different size and composition than the particles, to control the solidification response of the feedstock. Some variations provide a metal-containing functionalized material comprising: a plurality of aspherical particles comprising a metal or a metal alloy; and a plurality of metal-containing or ceramic particulates that are assembled on surfaces of the aspherical particles, wherein the particulates are compositionally different than the aspherical particles. Methods of making and using the metal-containing functionalized materials are described. The invention provides an economic advantage over traditional gas-atomized or water-atomized metal powder feedstocks for powder-based metal additive manufacturing or other powder metallurgy processes.
-
公开(公告)号:US12100530B2
公开(公告)日:2024-09-24
申请号:US17417905
申请日:2019-11-28
Applicant: SHOEI CHEMICAL INC.
Inventor: Kousuke Nishimura , Naoto Shindo , Hiroshi Mashima
IPC: H01B1/22 , B22F1/00 , B22F1/06 , B22F1/10 , B22F1/102 , B22F1/103 , C09D5/24 , C09D7/40 , C09D7/61 , C09D101/02 , B22F1/052 , B22F1/065
CPC classification number: H01B1/22 , B22F1/00 , B22F1/06 , B22F1/10 , B22F1/102 , B22F1/103 , C09D5/24 , C09D7/61 , C09D7/69 , C09D7/70 , C09D101/02 , B22F1/052 , B22F1/065 , B22F2301/255 , B22F2304/10
Abstract: The present invention provides a silver paste, containing at least a silver powder, a binder resin, and an organic solvent, in which a content of the silver powder based on the silver paste is 80.00 to 97.00% by mass, D10 is 1.00 to 3.00 μm and D50 is 3.00 to 7.00 μm, where D10 and D50 respectively represent a 10% value and a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement of the silver powder, the silver powder has a specific surface area of 0.10 to 0.30 m2/g, the silver powder has a copper content of 10 to 5000 ppm by mass, a content of the binder resin based on the silver powder is 0.430 to 0.750% by mass, and the silver paste has a dry film density of 7.50 g/cm3 or more.
-
公开(公告)号:US12091729B2
公开(公告)日:2024-09-17
申请号:US16981766
申请日:2019-02-27
Applicant: ACR II GLASS AMERICA INC.
Inventor: Olivier Farreyrol
IPC: B23K1/00 , B22F1/06 , B23K3/02 , B23K35/26 , B23K35/30 , C03C27/04 , C22C13/00 , H01Q1/12 , H01R4/02 , H01R43/02 , H05B3/84 , B23K101/00 , B23K103/00
CPC classification number: C22C13/00 , B22F1/06 , B23K1/00 , B23K1/0008 , B23K1/0016 , B23K3/02 , B23K35/262 , B23K35/3006 , B23K35/302 , C03C27/04 , H01Q1/1278 , H01R4/024 , H01R43/02 , H05B3/84 , B23K1/0004 , B23K2101/006 , B23K2103/54 , H01R2201/02 , H05B2203/01 , B22F2999/00 , B22F7/062 , B22F1/06 , C22C1/0466
Abstract: A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat portions, each the flat portion having a respective surface to be soldered, (B) soldering lead-free solder onto the surfaces to form first and second blocks of lead-free solder on the surfaces of the first flat portion and the second flat portion, respectively, (C) providing a glass substrate layer on which an electrically conductive layer comprising a wire pattern and a busbar is formed, and (D) sandwiching the lead-free solder blocks between their respective surfaces and the busbar, and then melting the blocks to form solder connections between the connector and the busbar; wherein the amount of lead-free solder in each of the blocks is between 15 mg and 50 mg.
-
公开(公告)号:US20230347407A1
公开(公告)日:2023-11-02
申请号:US18219927
申请日:2023-07-10
Applicant: TAIYO NIPPON SANSO CORPORATION
Inventor: Kentaro MIYOSHI , Hiroshi IGARASHI
IPC: B22F1/00 , B22F1/06 , B22F7/08 , B23K35/30 , B22F1/05 , B22F1/054 , B22F1/052 , B22F1/145 , B23K35/02
CPC classification number: B22F1/00 , B22F1/06 , B22F7/08 , B23K35/302 , B22F1/05 , B22F1/056 , B22F1/052 , B22F1/145 , B23K35/0244 , B22F2301/10
Abstract: A method for producing a bonding material having a plate shape or a sheet shape includes a mixture producing step in which fine copper particles having an average particle diameter of 300 nm or less, coarse copper particles having an average particle diameter of 3 μm or more and 11 μm or less, and a reducing agent which reduces the fine copper particles and the coarse copper particles are mixed to produce a mixture: and a molding step in which the mixture is formed in a plate shape or a sheet shape.
-
公开(公告)号:US11685979B2
公开(公告)日:2023-06-27
申请号:US16087377
申请日:2017-03-15
Applicant: HÖGANÄS AB (PUBL)
Inventor: Caroline Larsson , Ulf Engström , Christophe Szabo
IPC: B22F1/05 , B22F3/16 , B22F3/24 , B22F9/04 , C22C33/02 , B22F1/10 , B22F1/16 , B22F1/052 , B22F1/17 , B22F1/06
CPC classification number: C22C33/0264 , B22F1/05 , B22F1/052 , B22F1/06 , B22F1/10 , B22F1/17 , B22F3/16 , B22F3/24 , B22F9/04 , C22C33/0235 , B22F2003/248 , B22F2301/35 , B22F2302/25 , Y10T428/12014 , Y10T428/12611 , B22F2998/10 , B22F1/17 , B22F1/10 , B22F3/02 , B22F3/10 , B22F2003/248
Abstract: Disclosed is a new diffusion-bonded powder consisting of an iron powder having 1-5%, preferably 1.5-4% and most preferably 1.5-3.5% by weight of copper particles diffusion bonded to the surfaces of the iron powder particles. The new diffusion bonded powder is suitable for producing components having high sintered density and minimum variation in copper content.
-
公开(公告)号:US11857034B2
公开(公告)日:2024-01-02
申请号:US16117130
申请日:2018-08-30
Applicant: Seiko Epson Corporation
Inventor: Keisuke Itotsubo
CPC classification number: A44C27/003 , B22F1/06 , B22F3/15 , B22F3/24 , B22F5/106 , C22C1/0458 , C22C14/00 , B22F5/00 , B22F2003/247 , B22F2201/01 , B22F2201/10 , B22F2301/205
Abstract: A titanium sintered body has an average crystal grain diameter on the surface of more than 30 μm and 500 μm or less, and a Vickers hardness on the surface of 300 or more and 800 or less. In the titanium sintered body, it is preferred that crystal structures on the surface have an average aspect ratio of 1 or more and 3 or less. Further, in the titanium sintered body, it is preferred that the oxygen content on the surface is 2000 ppm by mass or more and 5500 ppm by mass or less. Further, in the titanium sintered body, it is preferred that titanium is contained as a main component, and an α-phase stabilizing element and a β-phase stabilizing element are also present.
-
-
-
-
-
-
-
-
-