Electromagnetic stamping method and device

    公开(公告)号:US11890661B2

    公开(公告)日:2024-02-06

    申请号:US17700173

    申请日:2022-03-21

    IPC分类号: B21D26/14

    CPC分类号: B21D26/14

    摘要: The present disclosure relates to an electromagnetic stamping method and an electromagnetic stamping device. The electromagnetic stamping method includes: dividing a blank holder of a stamping device into a plurality of blank holder areas based on a contour characteristic of a workpiece to be stamped; setting a blank holder force function over time for each blank holder area based on a shape characteristic of the blank holder area; collecting blank holder force data of each blank holder area every cycle period t0, and calculating an error between the blank holder force data and a value of the blank holder force function at a current time; and controlling a blank holder force for each blank holder area based on the error, and obtaining the workpiece to be stamped by stamping sheet material under the blank holder force.

    Methods for shaping/welding parts by means of magnetic pulse

    公开(公告)号:US11433447B2

    公开(公告)日:2022-09-06

    申请号:US16768685

    申请日:2018-12-03

    申请人: ADM28 S.ÀR.L

    发明人: Victor Shribman

    摘要: A method for shaping a part using a magnetic pulse is provided. A thin conductive layer is positioned on the part. The part is positioned between a coil and a matrix, the conductive layer being arranged between the coil and the part. An induced current, generated by the coil, is configured: to vaporize the conductive layer generating a pressure wave in the direction of the part. Additionally, the induced current is configured to accelerate the part in the direction of the matrix in association with a magnetic field generated by the coil, pressing the part against the matrix, thereby shaping the part. Further, a method for welding a part using a magnetic pulse is provided.

    Electromagnetic stamping apparatus

    公开(公告)号:US11413676B2

    公开(公告)日:2022-08-16

    申请号:US16746516

    申请日:2020-01-17

    摘要: An electromagnetic stamping apparatus includes a work platform configured to load a work piece. A stamping component is coupled to the work platform and has a first position and a second position. The stamping component includes a stamping rod and a stamping head. The stamping head stamps the work piece on the first position. An electromagnetic device is coupled to the stamping rod and generates a magnetic force according to an alternating current to push the stamping component to the first position to make the stamping component stamp the work piece. A compression spring pushes the stamping component to the second position according to the restoring force of the compression spring. Wherein, the magnetic force is greater than the restoring force of the compression spring to make the stamping component stamp the work piece twice in every waveform period of the alternating current.

    HIGH-FREQUENCY CONTINUOUS ELECTROMAGNETIC FORMING DEVICE FOR PLATE FORMATION

    公开(公告)号:US20210046536A1

    公开(公告)日:2021-02-18

    申请号:US16966955

    申请日:2019-01-03

    IPC分类号: B21D26/14

    摘要: A high-frequency continuous electromagnetic forming device for plate formation comprises a charger, a control terminal, a continuous charge-discharge device, a forming coil and a plate access terminal. The charger is used for charging the continuous charge-discharge device. Capacitor banks are arranged in the continuous charge-discharge device, and capacitors in the capacitor banks are sequentially discharged through an electromagnetic coil to apply a pulsed electromagnetic force to a workpiece to complete one forming process, and after discharging, the capacitors are charged to prepare for further discharging, so that continuous formation is realized. The control terminal is connected to the continuous charge-discharge device and the plate access terminal, and the forming coil is connected to the continuous charge-discharge device through a wire. Compared with the prior art, the high-frequency continuous electromagnetic forming device is reasonable in structure, solves the problem that large plates cannot be electromagnetically formed at a time, improves the production efficiency by about two times, and is easy to adjust, low in cost, and suitable for plate formation.

    MOLDING DEVICE
    6.
    发明申请
    MOLDING DEVICE 审中-公开

    公开(公告)号:US20200282442A1

    公开(公告)日:2020-09-10

    申请号:US16650990

    申请日:2018-10-16

    IPC分类号: B21D26/14 B21D5/01

    摘要: The objective of the present invention is to provide a molding device capable of performing press-molding accurately with respect to a material to be molded. A molding device (1) is provided with an electromagnetic coil (2), a fluid (10) which is electrically conductive and is installed along a plate-shaped material (50) on one surface side of the plate-shaped material (50), and a molding die (4) which is installed on the other surface side of the plate-shaped material (50) and is formed in such a way as to impart a molded shape to the plate-shaped material (50), wherein an electromagnetic force generated by the electromagnetic coil (2) is caused to act on the fluid (10), and the fluid (10) presses the plate-shaped material (50) against the molding die (4).

    ULTRA-HIGH-SPEED FORMING METHOD USING ELECTROPLASTICITY EFFECT

    公开(公告)号:US20170326614A1

    公开(公告)日:2017-11-16

    申请号:US15533149

    申请日:2015-12-02

    IPC分类号: B21D26/14 B21D26/06

    CPC分类号: B21D26/14 B21D26/06

    摘要: A method for forming or deforming a workpiece at a high speed using electroplasticity effect includes: applying a first level of pulse current to the work piece to cause the electroplasticity effect and lower a flow stress of the work piece; and applying a first level of electromagnetic force to the workpiece for 150˜300 μs to form or deform the work piece in a desired shape while the flow stress of the work piece is maintained at the lowered level, wherein the first level of electromagnetic force is lower than a second level of electromagnetic force which is required to form or deform the workpiece in the desired shape without applying the first level of pulse current.