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公开(公告)号：US20240424637A1
公开(公告)日：2024-12-26
申请号：US18412053
申请日：2024-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： WONKEUN CHO , DONGHOON KWON
Abstract: A back grinding apparatus includes a grinding wheel that is rotatable and movable in a vertical direction and including at least one abrasive, and a grinding gauge below the grinding wheel and configured to measure a wear amount of the at least one abrasive, where the grinding gauge includes a measuring body and a photoelectric sensor supported by the measuring body and configured to determine the wear amount of the at least one abrasive, and where the photoelectric sensor includes at least one light emitter, and at least one light receiver spaced apart from the at least one light emitter in a horizontal direction and configured to receive light emitted from the at least one light emitter.
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公开(公告)号：US20240383099A1
公开(公告)日：2024-11-21
申请号：US18318880
申请日：2023-05-17
Applicant: Applied Materials, Inc.
Inventor： Christopher Heung-Gyun LEE , Ghunbong CHEUNG , Jay GURUSAMY , Ekaterina MIKHAYLICHENKO , Chih-Han YANG
Abstract: Embodiments of the present disclosure provided herein include an apparatus and method for pad conditioning in a chemical mechanical polishing system. The apparatus includes a first conditioning head coupleable to a first pad conditioning disk disposed at a first head distance from the first conditioning head. The apparatus further includes a second a third conditioning head configured similarly to the first conditioning head. The apparatus includes a controller configured to receive sensor readings, determine whether the sensor readings are outside of a predetermined range, and adjust the first, second, and third head distances. A method of conditioning a polishing pad includes receiving sensor readings from at least one pad thickness sensor, determining if the sensor readings are outside of a predetermined range, and, upon determining that the sensor readings are outside of the predetermined range, adjusting a head distance of a conditioning head based on the sensor readings.
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公开(公告)号：US11850696B2
公开(公告)日：2023-12-26
申请号：US17943747
申请日：2022-09-13
Applicant: DISCO CORPORATION
Inventor： Kazuma Sekiya
CPC classification number: B24B27/0683 , B24B27/0608 , B24B49/186 , B24B53/003 , B24B53/12
Abstract: A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.
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公开(公告)号：US11673223B2
公开(公告)日：2023-06-13
申请号：US17711724
申请日：2022-04-01
Inventor： Yu-Chen Wei , Jheng-Si Su , Shih-Ho Lin , Jen-Chieh Lai , Chun-Chieh Chan
IPC: B24B49/18 , B24B49/16 , B24B49/10 , B24B37/005 , B24B37/32 , B24B53/017 , B24B37/20 , B24B37/04 , H01L21/321 , B24B53/00
CPC classification number: B24B37/20 , B24B37/005 , B24B37/04 , B24B37/32 , B24B49/10 , B24B49/16 , B24B49/18 , B24B53/001 , B24B53/017 , H01L21/3212
Abstract: A chemical mechanical polishing method is provided, including polishing a batch of wafers in sequence on a polishing surface of a polishing pad; conditioning the polishing surface with a pad conditioner, wherein the pad conditioner is operable to apply downward force according to a predetermined downward force stored in a controller to condition the polishing surface; measuring the downward force applied by the pad conditioner with a measurement tool when the pad conditioner is at a home position and after conditioning the polishing surface; comparing the downward force measured by the measurement tool and the predetermined downward force with the controller to determine whether a difference between the downward force measured by the measurement tool and the predetermined downward force exceeds a range of acceptable values; and calibrating the downward force applied by the pad conditioner with the controller when the difference exceeds the range of acceptable values.
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公开(公告)号：US11325224B2
公开(公告)日：2022-05-10
申请号：US16861729
申请日：2020-04-29
Applicant: EBARA CORPORATION
Inventor： Hiroyuki Shinozaki
Abstract: A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient.
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Patent Agency Ranking
公开(公告)号：US11285578B2
公开(公告)日：2022-03-29
申请号：US16934626
申请日：2020-07-21
Applicant: DISCO CORPORATION
Inventor： Jiro Genozono
IPC: B24B49/04 , B24B49/18 , B24B37/013 , B24B37/30
Abstract: A height of an upper surface of a sub-chuck table is measured by a holding surface measuring unit in contact with the upper surface of the sub-chuck table. A height of a holding surface of a chuck table is measured by an upper surface height measuring unit in contact with the holding surface of the chuck table. A first difference between the height of the upper surface of the sub-chuck table and the height of the holding surface of the chuck table is calculated. A workpiece is held on the holding surface, and the height of the upper surface of the sub-chuck table is calculated again by the holding surface measuring unit. The upper surface height measuring unit is brought into contact with the upper surface of the workpiece by vertically moving it, and the height of the upper surface of the workpiece is measured.
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公开(公告)号：US20220032423A1
公开(公告)日：2022-02-03
申请号：US17163968
申请日：2021-02-01
Applicant: HKC CORPORATION LIMITED
Abstract: Disclosed is a method for measuring a remaining amount of the abrasive for an edger. The edger includes a cover and an abrase wheel installed inside the cover, a bottom surface of the cover is parallel to a rotating shaft of the abrase wheel, abrasives are outside an outer wheel of the abrase wheel, in which a distance sensor is installed on an inner wall of the bottom surface of the cover, and the method for measuring the remaining amount of the abrasive for the edger includes: acquiring distance data detected by the distance sensor; acquiring the remaining amount of the abrasive according to the distance data.
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公开(公告)号：US20200269384A1
公开(公告)日：2020-08-27
申请号：US16874403
申请日：2020-05-14
Inventor： ChunHung CHEN , Sheng-Chen WANG
IPC: B24B53/017 , B24B49/12 , B24B49/16 , B24B49/18
Abstract: A method of conditioning a polishing pad includes positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of a polishing pad. The method further includes generating a first pressure signal using a first pressure sensor based on a force being applied to the polishing surface by the conditioning pad. The method further includes generating a surface condition signal using an optical scanner. The method further includes adjusting the positioning of the conditioning pad in response to at least one of the first pressure signal or the surface condition signal.
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公开(公告)号：US10532443B2
公开(公告)日：2020-01-14
申请号：US15554027
申请日：2016-03-11
Applicant: Erwin Junker Maschinenfabrik GmbH
Inventor： Erwin Junker
Abstract: A method is disclosed for grinding grooves on workpieces using a profiled grinding wheel, the profile of which is crushed. A reshaping crush process includes driven crush rollers, each being controlled on the basis of a rotational speed and current consumption. Thus, relative advancement between the grinding wheel and crush roller is controlled according to the speed and current consumption. A grinding machine is also disclosed for grinding a workpiece, wherein the workpiece is held by means of a workpiece spindle head. A crush device comprising a crush roller with a dedicated rotary drive is provided on the grinding machine. The grinding wheel is applied to the crush roller in order to dress the grinding wheel profile. The crush roller has a profile-crushing portion for profile-crushing the grinding wheel with a first dressing volume and a reshaping profile-crushing portion for profile-crushing the grinding wheel with a second dressing volume.
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公开(公告)号：US10478938B2
公开(公告)日：2019-11-19
申请号：US15434736
申请日：2017-02-16
Applicant: Ebara Corporation
Inventor： Tsuneo Torikoshi
IPC: B24B37/04 , B24B49/00 , B24B37/005 , B24B53/017 , B24B37/34 , B24B53/007 , B24B49/18 , B24B37/013 , B24B27/00
Abstract: A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.
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