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公开(公告)号：US09873159B2
公开(公告)日：2018-01-23
申请号：US14983954
申请日：2015-12-30
申请人： SunEdison, Inc.
CPC分类号： B23D65/00 , B23D61/185 , B28D5/045
摘要： A method for designing a diamond coated wire for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated, wherein the intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and wherein penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.
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公开(公告)号：US09266253B2
公开(公告)日：2016-02-23
申请号：US14116773
申请日：2013-06-19
发明人： Liang Huang , Chengye Wu , Ligang Zhu
摘要： An electric double-blade slot cutting machine include a first cutting unit having a first cutting part and provided along a cutting route and presents a reciprocating movement; a second cutting unit having a second cutting part provided along the cutting route and presents the reciprocating movement, wherein moving directions of the first cutting unit and the second cutting unit is opposite while cutting; a restriction holder for restricting the first cutting unit and the second cutting unit to moving along the cutting route; a transmission unit; and a motor. With the foregoing structure, the electric double-blade slot cutting machine can work with small vibration and stable performances; a speed of the motor is increased for improving work efficiency; and with an extension rod, the electric double-blade slot cutting machine is adaptable for standing utilization.
摘要翻译： 电动双刀槽切割机包括：第一切割单元，具有第一切割部分，沿着切割路线设置并呈往复运动; 第二切割单元，具有沿着切割路径设置的第二切割部，并且呈现往复运动，其中第一切割单元和第二切割单元的移动方向在切割时相反; 限制保持器，用于限制第一切割单元和第二切割单元沿着切割路线移动; 传输单元; 和电机。 利用上述结构，电动双刀槽切割机可以工作，振动小，性能稳定; 增加电机的转速以提高工作效率; 并具有延长杆，电动双刀槽切割机适用于站立利用。
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公开(公告)号：US09140333B2
公开(公告)日：2015-09-22
申请号：US13748528
申请日：2013-01-23
发明人： Pablo Gomez , Juan Vielma , Greg Ferguson
CPC分类号： F16H3/32 , B28D1/068 , F16H2200/0043 , Y10T74/19251 , Y10T74/19307
摘要： A motor-driven concrete cutting saw and method in which the motor has an idler gear, a top slider gear slidably engageable and disengageable with the idler gear; and a bottom slider gear slidably engageable and disengageable with the idler gear. Both the top and bottom slider gears have two toothed disks, and the idler gear has two toothed disks, a main gap, and a third toothed disk. The toothed disks are sized to produce, when engaged with one another, multiple speeds including a neutral setting that would allow the motor to disengage from the saw blade while running.
摘要翻译： 一种马达驱动的混凝土切割锯和方法，其中所述马达具有空转齿轮，可以与所述空转齿轮可滑动地接合和分离的顶部滑动齿轮; 以及可滑动地与空转齿轮接合并脱离的底部滑动齿轮。 顶部和底部滑动齿轮都具有两个齿形盘，并且惰轮具有两个带齿的盘，主间隙和第三齿盘。 齿盘的尺寸设计成在彼此接合时产生多个速度，包括允许电机在运行时与锯片脱离的中性设置。
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4.发明授权Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material 有权从由半导体材料构成的晶体上切割多个晶片的方法公开(公告)号：US08844511B2
公开(公告)日：2014-09-30
申请号：US13009957
申请日：2011-01-20
申请人： Maximilian Kaeser , Albert Blank
发明人： Maximilian Kaeser , Albert Blank
CPC分类号： B28D5/045
摘要： A method for slicing a plurality of wafers from a crystal includes providing a crystal of semiconductor material having a longitudinal axis, a cross section and at least one pulling edge. The crystal is fixed on a table and guided through a wire gang defined by sawing wire so as to form the wafers. The guiding is provided by a relative movement between the table and the wire gang such that entry sawing or exit sawing using the sawing wire occurs in a vicinity of the at least one pulling edge of the crystal.
摘要翻译： 从晶体中切割多个晶片的方法包括提供具有纵向轴线，横截面和至少一个拉拔边缘的半导体材料的晶体。 将晶体固定在桌子上并引导通过由锯线限定的线束，以形成晶片。 引导通过工作台和电线组之间的相对运动来提供，使得使用锯线的进入锯切或出口锯切发生在晶体的至少一个拉动边缘附近。
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5.发明授权Method, apparatus, system and heat exchanger for increasing the temperature of a substance which is initially in an at least partly solidified state in a container 有权方法，装置，系统和热交换器，用于增加容器中初始处于至少部分固化状态的物质的温度公开(公告)号：US08734005B2
公开(公告)日：2014-05-27
申请号：US13170767
申请日：2011-06-28
CPC分类号： F28D1/0213 , B67D7/80
摘要： One aspect of the present invention relates to a method for increasing the temperature of a substance which is initially in an at least partly solidified state in a container, where at least one heat exchanger is arranged in the container. One object is to obtain that the temperature of a substance may be changed relatively fast. This is obtained by having pumping means for displacing the substance, exchanging heat between a heat exchanger and the substance, displacing substance with the pumping means for increased heat exchange between the heat exchanger and the substance, as well as stirring the substance with the pumping means by displacing the substance inside the container. When the substance is displaced, then not only stagnant substance is in contact with the heat exchanger for heat exchange. The amount of substance in contact with the heat exchanger is thereby greatly increased, and the heat transfer is less dependent on thermal conductivity of the substance.
摘要翻译： 本发明的一个方面涉及一种用于提高容器中初始处于至少部分固化状态的物质的温度的方法，其中在容器中布置有至少一个热交换器。 一个目的是获得物质的温度可以相对较快地改变。 这是通过具有用于移置物质的泵送装置，在热交换器和物质之间交换热量，将物质与泵送装置置换以增加热交换器和物质之间的热交换，以及用泵送装置搅拌该物质 通过移动容器内的物质。 当物质移位时，不仅停滞物质与热交换器接触以进行热交换。 因此，与热交换器接触的物质的量大大增加，并且热传递较少依赖于物质的导热性。
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公开(公告)号：US08286623B2
公开(公告)日：2012-10-16
申请号：US13056780
申请日：2009-08-12
摘要： The present invention is a band saw cutting apparatus including: a cutting table on which an ingot is horizontally placed; an endless-belt blade provided in a tensioned state between pulleys, the blade having a blade-abrasive-grain portion and a blade base; and a coolant spraying opening for spraying a coolant on the blade, the band saw cutting apparatus cutting the ingot by relatively feeding the blade from above to below, the blade being driven to rotate by rotating the pulleys, wherein the pulleys is configured to be rotatable about an axis thereof in both directions, and a direction of driving to rotate the blade can be changed to cut the ingot. As a result, there is provided a band saw cutting apparatus and an ingot cutting method that can stably secure the quality of the ingot to be cut, increase the lifetime of the blade, and improve the productivity.
摘要翻译： 本发明是一种带锯切割装置，包括：切割台，水平放置锭子; 设置在皮带轮之间处于张紧状态的环形皮带刀片，所述刀片具有刀片磨粒部分和刀片基部; 以及用于将冷却剂喷射在所述刀片上的冷却剂喷射开口，所述带锯切割设备通过相对地将所述刀片从上方输送到下方来切割所述锭，所述刀片通过旋转所述滑轮被驱动而旋转，其中所述滑轮构造成可旋转 围绕其两个方向的轴线，并且可以改变驱动叶片旋转的方向以切割锭。 结果，提供了能够稳定地确保待切割锭的质量的带锯切割装置和锭切割方法，增加了刀片的使用寿命，并且提高了生产率。
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7.发明申请WORKPIECE FOR FRAME GANG SAW, METHOD FOR CUTTING THE WORKPIECE, AND PRODUCT CUT BY THE METHOD 有权框架锯条的工作原理，切割工件的方法和方法的切割公开(公告)号：US20110253121A1
公开(公告)日：2011-10-20
申请号：US13141471
申请日：2009-12-23
申请人： Hee-Dong Park , Nam-Kwang Kim
发明人： Hee-Dong Park , Nam-Kwang Kim
CPC分类号： B28D1/06 , Y10T428/2457
摘要： There is provided a method of cutting or drilling workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.
摘要翻译： 提供了一种使用框架锯锯切割或钻孔工件的方法，包括大理石和花岗岩，砖，混凝土和沥青等石材。 提供由框架组合锯切割的工件，其包括具有多个切割尖端的一个或多个叶片，或包括不包括切割尖端的叶片; 通过使用框架锯切割工件的方法; 和通过切割方法提供的产品。 工件被设置为包括一个或多个凹槽，多个切割尖端中的至少一个切割尖端的至少一部分或没有切割尖端的至少一部分刀片被插入到该凹槽中，并且其形成在其中。 这里，可以缩短工件上的初始切割时间，以通过显着降低叶片的偏转力来改善框架组合锯片的生产率和产品的质量以及寿命。
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公开(公告)号：US20100163462A1
公开(公告)日：2010-07-01
申请号：US12647991
申请日：2009-12-28
申请人： Alexis Grabbe , Tracy M. Ragan
发明人： Alexis Grabbe , Tracy M. Ragan
CPC分类号： B03D1/02 , B01D21/0009 , B03C1/288 , B03C2201/20 , B03D1/085 , B08B3/08 , B24B27/06 , B24B55/12 , B28D5/007 , C10M175/005 , C10M175/02 , C10M2203/1006 , C10M2209/1045 , Y02P70/179
摘要： The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.
摘要翻译： 本公开内容一般涉及从切割硅锭（例如单晶或多晶硅锭）而产生的锯切屑或用尽的磨料浆料回收硅的方法。 更具体地说，本公开涉及从锯切或排出的浆料中分离和纯化硅的方法，使得所得的硅可以用作原料，例如太阳能级硅原料。
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公开(公告)号：US20100006082A1
公开(公告)日：2010-01-14
申请号：US12499966
申请日：2009-07-09
CPC分类号： B28D5/045 , B28D1/30 , B28D5/0064 , B28D5/0088 , Y10T83/9292
摘要： A wire slicing system and method for using it include one or more of the following features: arrangements and/or operations that relate to handling the wire; apparatus and methods that relate to wire tensioning; equipment and techniques for manipulating the workpiece; arrangements and/or operations designed for cooling and swarf (debris) removal; controls and/or automation that can be used in conjunction with these features.
摘要翻译： 线切割系统及其使用方法包括以下特征中的一个或多个：与处理线相关的布置和/或操作; 涉及电线张紧的装置和方法; 用于操纵工件的设备和技术; 设计用于冷却和切屑（碎片）去除的布置和/或操作; 可以与这些功能结合使用的控制和/或自动化。
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公开(公告)号：US07306508B2
公开(公告)日：2007-12-11
申请号：US10540020
申请日：2004-10-22
申请人： Takafumi Kawasaki , Hirozoh Tsuruta , Hirokazu Nishida , Seiichi Mimura , Masayuki Hamayasu , Hisashi Tominaga
发明人： Takafumi Kawasaki , Hirozoh Tsuruta , Hirokazu Nishida , Seiichi Mimura , Masayuki Hamayasu , Hisashi Tominaga
CPC分类号： B28D5/007 , B24B27/0633 , B28D5/045 , H01L21/304 , Y02P70/179
摘要： A multi-wire saw according to the present invention cuts a workpiece while supplying a slurry containing an alkali or mixed acid to a cutting interface between the workpiece and a wire, and includes: a storage tank with a heating mechanism for storing and heating the slurry; a thermal insulating pipe for transporting the slurry sent with a pump from the storage tank with a heating mechanism to a position before a position where the wire is incorporated into the workpiece, while keeping the slurry at a predetermined temperature; a thermostat for keeping a temperature in a vicinity of the workpiece fixed to a stage at the predetermined temperature; and a wire heating mechanism for heating the wire to the predetermined temperature. Consequently, the cutting resistance decreases during cutting machining of a silicon ingot, and the variation in the cutting resistance also decreases, whereby a high-quality wafer can be obtained at a high efficiency and a low cost.
摘要翻译： 根据本发明的多线锯在将含有碱或混合酸的浆料供给到工件和线材之间的切割界面的同时切割工件，并且包括：具有用于储存和加热浆料的加热机构的储罐 ; 绝热管，用于将具有加热机构的从所述储存罐输送的浆料输送到所述线材并入所述工件的位置之前，同时将所述浆料保持在预定温度; 用于将工件附近的温度固定在预定温度的台上的恒温器; 以及用于将线材加热到预定温度的线材加热机构。 因此，在硅锭的切割加工期间切削阻力降低，并且切削阻力的变化也降低，从而可以以高效率和低成本获得高质量的晶片。
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