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公开(公告)号：US09873178B2
公开(公告)日：2018-01-23
申请号：US15028087
申请日：2014-10-09
发明人： Kevin Inkster
IPC分类号： B23B45/16 , B25D9/00 , B25D11/00 , B25D13/00 , B25D16/00 , E21B1/00 , B24B23/03 , B24B23/04 , B24B27/06 , B24B27/08 , B24B47/00 , B24B47/12 , F16H1/32 , B26D5/08 , B28D1/04 , B28D1/06 , F16H1/20 , F16H1/28 , B26D1/00
CPC分类号： B24B23/03 , B23D47/12 , B24B23/04 , B24B27/06 , B24B27/08 , B24B47/00 , B24B47/12 , B26D1/00 , B26D5/08 , B27B19/006 , B28D1/04 , B28D1/045 , B28D1/06 , F16H1/20 , F16H1/28 , F16H1/32 , F16H2001/327
摘要： A cutting tool mechanism 11 for providing a cutting, abrading or grinding action is disclosed. The mechanism 11 has an inner circular part 17 having teeth 19 extending radially outwardly, a surrounding circular part 25 having inner teeth 27 extending radially inwardly. The circular parts 17 and 25 co-operate by engagement their teeth 19 and 27. Rotation of one circular part causes the other to move constrained by the engagement of the teeth in an orbital, oscillatory or impact motion. An input coupling 81 is provided for transmission of rotary motion, and an output coupling 37 is provided to transmit said orbital, oscillatory or impact motion to a blade 13. In further embodiments, the surrounding circular part 25 can be provided with outwardly extending teeth and surrounded by a further outer circular part with inwardly extending teeth, to cooperate with the outwardly extending teeth, to provide more complex orbital, oscillatory or impact motion.
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公开(公告)号：US09701043B2
公开(公告)日：2017-07-11
申请号：US14397040
申请日：2013-04-24
发明人： Takashi Fujita , Yasuo Izumi , Junji Watanabe
摘要： An object of the present invention is to provide a dicing blade which does not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision. A dicing blade 26 which performs the cutting process on the workpiece is integrally formed of a diamond sintered body 80 which is formed by sintering diamond abrasive grains 82 so as to have a discoid shape, and a content of the diamond abrasive grains 82 of the diamond sintered body 80 is 80 vol % or more. It is preferable that recessed parts which are formed on a surface of the diamond sintered body 80 are continuously provided in an outer circumferential part of the dicing blade 26 along a circumferential direction.
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公开(公告)号：US20170072594A1
公开(公告)日：2017-03-16
申请号：US15311325
申请日：2015-03-18
发明人： Tadahiro KATO
CPC分类号： B28D5/045 , B23D61/185 , B24B27/06 , B24B27/0633 , B24D3/00 , B24D3/004 , B24D11/00 , B28D5/0076 , H01L21/02005 , H01L21/304
摘要： The present invention is a fixed-abrasive-grain wire including a core wire and abrasive grains fixed on a surface of the core wire, wherein an abrasive grain density is 1200 grains/mm2 or more, where the abrasive grain density is the number of the abrasive grains per unit area on the surface of the core wire, and 2% or less of all distances between centroids of the abrasive grains are equal to or shorter than an average circle equivalent diameter of the whole abrasive grains. There can be provided a fixed-abrasive-grain wire, a wire saw, and a method for slicing a workpiece that can suppress meandering of the fixed-abrasive-grain wire during slicing a workpiece and improve TTV and warp of wafers sliced from the workpiece.
摘要翻译： 本发明是一种固定磨粒，其特征在于，包括固定在芯线表面的芯线和磨粒，其中磨粒密度为1200粒/ mm2以上，磨粒密度为 芯线表面的每单位面积的磨粒和磨粒的质心之间的所有距离的2％以下等于或小于整个磨粒的平均圆当量直径。 可以提供固定磨粒线，线锯，以及用于切割工件的方法，该工件可以在切割工件期间抑制固定磨粒线的弯曲，并改善从工件切片的晶片的TTV和翘曲 。
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公开(公告)号：US20140341796A1
公开(公告)日：2014-11-20
申请号：US13897701
申请日：2013-05-20
发明人： Jianmin Wang , Serapion C. Daof , Senghong Chua , Meng Lee
IPC分类号： B24B19/26
摘要： A dual-side wafer bar grinding method and apparatus is disclosed herein that slices wafer bars from a wafer block for use in manufacturing thin film magnetic heads, for example. By grinding opposing faces of the wafer bars sliced from the wafer block, variations in flatness, perpendicularity, surface finish, and/or overall dimensions are improved.
摘要翻译： 本文公开了一种双面晶圆棒研磨方法和装置，其例如从用于制造薄膜磁头的晶片块切片晶片棒。 通过磨削从晶片块切片的晶片棒的相对面，改善了平面度，垂直度，表面光洁度和/或总体尺寸的变化。
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公开(公告)号：US08702084B2
公开(公告)日：2014-04-22
申请号：US12984726
申请日：2011-01-05
摘要： A magnet holding jig comprises a platform and first and second holders disposed on opposite sides of the platform. The platform is provided with channels, the holders are comb-shaped to define digits and slits, the channels and the slits being aligned to define guide paths for permitting entry of a cutting tool therein, and the holders are also configured as digitate hooks. The holder hooks are in contact with a rare earth magnet block resting on the platform. The holders are pushed inward at their lower portions so as to bring each hook digit of the second holder in pressure abutment with the magnet block at a higher level than each hook digit of the first holder for thereby holding the magnet block in place on the platform.
摘要翻译： 磁体夹持夹具包括平台以及设置在平台的相对侧上的第一和第二支架。 平台设置有通道，保持器是梳状的以限定数字和狭缝，通道和狭缝对齐以限定用于允许切削工具进入其中的引导路径，并且保持器还被配置为数字钩。 支架钩与搁置在平台上的稀土磁体块接触。 保持器在其下部被向内推，以使第二保持器的每个钩数字与磁块的压力抵接在比第一保持器的每个钩位高的高度，从而将磁块保持在平台上的适当位置 。
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公开(公告)号：US08702083B2
公开(公告)日：2014-04-22
申请号：US12984717
申请日：2011-01-05
CPC分类号： B28D7/04 , B24B27/06 , B28D1/24 , Y10T29/49046 , Y10T83/9403
摘要： A magnet holding jig comprises a platform and first and second holders disposed on opposite sides of the platform. The platform is provided with channels, the holders are comb-shaped to define digits and slits, the channels and the slits being aligned to define guide paths for permitting entry of a cutting tool therein, and the holders are also configured as digitate hooks. The holder hooks are in contact with a rare earth magnet block resting on the platform. The holders are pushed inward at their lower portions so as to elastically deform the digitate hook and move it backward and to bring the hook digits in pressure abutment with the magnet block, thereby holding the magnet block in place on the platform.
摘要翻译： 磁体夹持夹具包括平台以及设置在平台的相对侧上的第一和第二支架。 平台设置有通道，保持器是梳状的以限定数字和狭缝，通道和狭缝对齐以限定用于允许切削工具进入其中的引导路径，并且保持器还被配置为数字钩。 支架钩与搁置在平台上的稀土磁体块接触。 保持器在其下部被向内推，以便使数字钩弹性变形并向后移动，并使挂钩数字与磁体块压力邻接，从而将磁块保持在平台上的适当位置。
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公开(公告)号：US20110165822A1
公开(公告)日：2011-07-07
申请号：US12984726
申请日：2011-01-05
摘要： A magnet holding jig comprises a platform and first and second holders disposed on opposite sides of the platform. The platform is provided with channels, the holders are comb-shaped to define digits and slits, the channels and the slits being aligned to define guide paths for permitting entry of a cutting tool therein, and the holders are also configured as digitate hooks. The holder hooks are in contact with a rare earth magnet block resting on the platform. The holders are pushed inward at their lower portions so as to bring each hook digit of the second holder in pressure abutment with the magnet block at a higher level than each hook digit of the first holder for thereby holding the magnet block in place on the platform.
摘要翻译： 磁体夹持夹具包括平台以及设置在平台的相对侧上的第一和第二支架。 平台设置有通道，保持器是梳状的以限定数字和狭缝，通道和狭缝对齐以限定用于允许切削工具进入其中的引导路径，并且保持器还被配置为数字钩。 支架钩与搁置在平台上的稀土磁体块接触。 保持器在其下部被向内推，以使第二保持器的每个钩数字与磁块的压力抵接在比第一保持器的每个钩位高的高度，从而将磁块保持在平台上的适当位置 。
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8.发明申请DISK-SHAPED GLASS SUBSTRATE AND METHOD OF MANUFACTURING DISK-SHAPED GLASS SUBSTRATE 审中-公开盘形玻璃基板及制造盘形玻璃基板的方法公开(公告)号：US20110159319A1
公开(公告)日：2011-06-30
申请号：US12977485
申请日：2010-12-23
CPC分类号： B26F1/3846 , B24B27/06 , B24D7/18 , G11B5/8404 , Y10T83/06
摘要： A front end portion of a core drill is formed in an arc shape in which longitudinal cross-sectional portions have the same radius. A contact width of a cutting edge of the core drill which first comes in contact with a surface of the glass sheet is small for the surface of the glass sheet, and the contact width of the cutting edge which comes in contact with the surface of the glass sheet is gradually increased as the core drill is lowered. An annular cavity into which the front end portion of the core drill is inserted is formed on an upper surface of the stage on which the glass sheet is placed. The annular cavity is formed so that its cavity width in the radial direction is wider than a drill width of the core drill.
摘要翻译： 芯钻的前端部形成有长度方向相同半径的圆弧状。 首先与玻璃板的表面接触的芯钻的切割刃的接触宽度对于玻璃板的表面而言较小，并且与该表面接触的切割刃的接触宽度 随着芯钻下降，玻璃板逐渐增加。 在放置玻璃板的台架的上表面上形成有插入芯钻的前端部的环形空腔。 环形空腔的形状使得其径向的腔宽度大于钻芯的钻头宽度。
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公开(公告)号：US06659843B2
公开(公告)日：2003-12-09
申请号：US10075109
申请日：2002-02-13
申请人： John N. Boucher , David E. Bajune
发明人： John N. Boucher , David E. Bajune
IPC分类号： B24B4900
CPC分类号： B23D59/002 , B24B27/06 , B24B49/183 , B28D5/022
摘要： A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center. In addition, prior to cutting along the edges of the substrate, the dicing blade is first aligned for travel parallel to and proximate the edge of the substrate, and an alignment offset is provided to the programmable dicing saw for laterally moving the blade toward the center of the substrate prior to making a cut and avoiding damage to the blade and substrate that typically results when the blade slides along the substrate edge rather than cutting into the substrate. In addition, by knowing the substrate center location, an arcuate cut can be accurately made into the substrate by making multiple straight cuts with a rotation of the substrate about its center between each cut. A flange clearance is monitored by measuring the blade exposure after a preselected number of cuts during the substrate dicing, and a minimum flange clearance permitted before blade movement toward the substrate is automatically stopped.
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公开(公告)号：US20020173224A1
公开(公告)日：2002-11-21
申请号：US10037981
申请日：2001-11-09
IPC分类号： B24B049/00 , B24B051/00
CPC分类号： B23D59/001 , B24B27/06 , B24B47/22 , B24B49/16 , B24B49/183 , B28D7/005 , G05B19/4166 , G05B2219/49072
摘要： Apparatus for removing material from a workpiece is described, in which the apparatus comprises means for advancing an abrasive tool towards the workpiece to bring an abrasive surface of the tool into contact with the surface of the workpiece, means for moving the abrasive surface relative to the workpiece to remove material from the workpiece, means for detecting a load applied to the tool by the workpiece, and means for controlling the rate of advancement of the abrasive tool towards the workpiece depending on the magnitude of the detected load.
摘要翻译： 描述了从工件去除材料的装置，其中装置包括用于将研磨工具推向工件以使工具的研磨表面与工件的表面接触的装置，用于相对于工件移动磨料表面的装置 工件以从工件移除材料，用于检测由工件施加到工具的负载的装置，以及用于根据检测到的负载的大小来控制研磨工具朝向工件的前进速率的装置。
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