Active ester compound
    1.
    发明授权

    公开(公告)号:US11299448B2

    公开(公告)日:2022-04-12

    申请号:US16610582

    申请日:2018-04-10

    申请人: DIC Corporation

    摘要: An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.

    BRANCHED FLUORINE-CONTAINING COMPOUND

    公开(公告)号:US20210355077A1

    公开(公告)日:2021-11-18

    申请号:US17387004

    申请日:2021-07-28

    摘要: A novel branched fluorine-containing compound represented by formula (1): wherein L represents a predetermined carbon-containing linker moiety; Rf, in each occurrence, is the same or different and represents fluoroalkyl optionally having at least one ether bond; Y, in each occurrence, is the same or different and represents a predetermined divalent linking group or a bond; RY, in each occurrence, is the same or different and represents hydrogen or an organic group; L represents an (n1+n2)-valent carbon-containing linker moiety having at least one carbon atom; n1 represents a number greater than or equal to 1; n2 represents a number greater than or equal to 1; n1+n2 is a number from 3 to 6; X, in each occurrence, is the same or different and represents a divalent linking group or a bond; A, in each occurrence, is the same or different and represents -ArSO3M or the like; M, in each occurrence, is the same or different and represents hydrogen, —NR4, or a metal salt; and R represents hydrogen or a C1-4 organic group.

    Branched fluorine-containing compound

    公开(公告)号:US11104639B2

    公开(公告)日:2021-08-31

    申请号:US16332962

    申请日:2017-09-13

    摘要: A novel branched fluorine-containing compound represented by formula (1): (Rf—Yn1LX-A)n2  (1) wherein L represents a predetermined carbon-containing linker moiety; Rf, in each occurrence, is the same or different and represents fluoroalkyl optionally having at least one ether bond; Y, in each occurrence, is the same or different and represents a predetermined divalent linking group or a bond; RY, in each occurrence, is the same or different and represents hydrogen or an organic group; L represents an (n1+n2)-valent carbon-containing linker moiety having at least one carbon atom; n1 represents a number greater than or equal to 1; n2 represents a number greater than or equal to 1; n1+n2 is a number from 3 to 6; X, in each occurrence, is the same or different and represents a divalent linking group or a bond; A, in each occurrence, is the same or different and represents —ArSO3M or the like; M, in each occurrence, is the same or different and represents hydrogen, —NR4, or a metal salt; and R represents hydrogen or a C1-4 organic group.

    ACTIVE ESTER COMPOUND
    4.
    发明申请

    公开(公告)号:US20200148618A1

    公开(公告)日:2020-05-14

    申请号:US16610582

    申请日:2018-04-10

    申请人: DIC Corporation

    摘要: An active ester compound that can form a cured product having excellent dielectric properties and copper foil adhesion properties is provided, a curable composition including the active ester compound is provided, and a cured product of the curable composition is provided. Also provided are a semiconductor encapsulating material, a printed wiring board, and a build-up film formed by using the curable composition. Specifically, an active ester compound is provided which includes a fluorinated hydrocarbon structural moiety and a plurality of aromatic ester structural moieties in the structure of the molecule and includes an aryloxycarbonyl structure or an arylcarbonyloxy structure at an end of the molecule, a curable composition including the active ester compound, and a cured product of the curable composition, and also provided are a semiconductor encapsulation material, a printed wiring board, and a build-up film formed by using the curable composition.