公开(公告)号：US12173149B2

公开(公告)日：2024-12-24

申请号：US17672776

申请日：2022-02-16

Applicant: SUN MEDICAL CO., LTD.

Inventor： Yuya Yamamoto ,  Tatsuya Ori ,  Tamaki Otsuki ,  Asami Okuda ,  Akari Yamamoto

IPC: C08L33/12 ,  C08J3/20 ,  C08K3/26 ,  C08K5/55

Abstract: The present invention improves the long-term storage stability of an organoborane-Lewis base complex. First composite particles of the present invention include particles of an organic polymer (B), and an organoborane-Lewis base complex (A) contained in the particles. Second composite particles of the present invention include particles of an inorganic compound (B′), and an organoborane-Lewis base complex (A) adsorbed on the particles.

公开(公告)号：US20240254279A1

公开(公告)日：2024-08-01

申请号：US18289335

申请日：2022-05-11

Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED

Inventor： Kenichi TAKEUCHI ,  Hirofumi KATO

IPC: C08G59/24 ,  C08G59/40 ,  C08G59/50 ,  C08G59/62 ,  C08K5/55

CPC classification number: C08G59/245 ,  C08G59/4007 ,  C08G59/5073 ,  C08G59/621 ,  C08K5/55

Abstract: There is provided an epoxy resin composition comprising an epoxy resin (A), a curing agent (B), an imidazole adduct-type curing accelerator (C), and a Lewis acid compound (D) having a boron atom or an aluminum atom, wherein the curing agent (B) comprises a compound (B-1) represented by a formula (B-1) [R1 denotes a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms]; and the content of a compound (B-2) represented by a formula (B-2) [R2 denotes a hydrogen atom, a halogen atom, a methyl group or a methoxy group] in the curing agent (B) is 0 parts by mass or higher and lower than 2.0 parts by mass based on 100 parts by mass of the epoxy resin (A).

公开(公告)号：US11945917B2

公开(公告)日：2024-04-02

申请号：US16897540

申请日：2020-06-10

Applicant: FUJIFILM Corporation

Inventor： Yutaro Fukami ,  Yushi Kaneko ,  Junichi Ito ,  Kazuya Ota ,  Hiromu Koizumi

IPC: C08F2/46 ,  C08F2/50 ,  C08G61/04 ,  C08G63/08 ,  C08G63/91 ,  C08G64/18 ,  C08G81/02 ,  C08K5/00 ,  C08K5/3437 ,  C08K5/3447 ,  C08K5/55 ,  C08L81/02 ,  G02F1/1335 ,  H01L27/146

CPC classification number: C08G81/027 ,  C08G63/08 ,  C08G63/912 ,  C08G64/18 ,  C08K5/0041 ,  C08K5/3437 ,  C08K5/3447 ,  C08K5/55 ,  C08L81/02 ,  G02F1/133514 ,  H01L27/14621

Abstract: A composition includes a compound represented by Formula (1) and a pigment. In Formula (1), R1 represents an (m+n)-valent linking group, P1 represents a polymer chain which has a polyester repeating unit in a main chain, and of which a weight-average molecular weight is 1000 or more, P2 represents a polymer chain which is different from P1 and has a repeating unit derived from a monomer having an ethylenically unsaturated bonding group in a main chain, m represents a number of 1 to 9, n represents a number of 1 to 9, and m+n satisfies 4 to 18.

公开(公告)号：US20240101789A1

公开(公告)日：2024-03-28

申请号：US18273855

申请日：2021-01-29

Applicant: Momentive Performance Materials Inc.

Inventor： Zhiqiang REN ,  Yu SUN ,  Tiberiu Mircea SICLOVAN

IPC: C08K5/55 ,  C09J7/38 ,  C09J11/06 ,  C09J183/04

CPC classification number: C08K5/55 ,  C09J7/38 ,  C09J11/06 ,  C09J183/04 ,  C09J2301/302

Abstract: The present invention relates to a silicone pressure sensitive adhesive composition comprising a boron-containing additive containing a boron-containing compound selected from the group consisting of a boroxine-based compound and a borane-based compound containing a covalent boron-nitrogen bond. The present invention also relates to an article such as a pressure sensitive adhesive tape comprising the silicone pressure sensitive adhesive composition.

公开(公告)号：US11773252B1

公开(公告)日：2023-10-03

申请号：US17400388

申请日：2021-08-12

Applicant: MORSECORP, Inc.

Inventor： Adam Lomazoff ,  Matthew DiLeo

IPC: C08L61/18 ,  C08G63/08 ,  C08L55/02 ,  C08K5/00 ,  C08K5/02 ,  C08K5/55 ,  C08K5/01

CPC classification number: C08L61/18 ,  C08G63/08 ,  C08L55/02 ,  C08K5/0016 ,  C08K5/01 ,  C08K5/02 ,  C08K5/55

Abstract: Polymer blends are described that are formed from a transient polymer material, a polymer comprising an acrylonitrile group (e.g., ABS, SAN), and/or one or more polyester polymers. For blends in which two or more polyester polymers are blended with a transient polymer material, at least two of the polyester polymers are immiscible with one another, and one of the polyester polymers has a glass transition temperature less than or equal to 0° C. The polymer blends herein can decompose into liquid phase decomposition products upon exposure to a transience reaction trigger in less than 8 hours even at temperatures of less than −20° C.

公开(公告)号：US20230203217A1

公开(公告)日：2023-06-29

申请号：US17996132

申请日：2021-04-07

Applicant: BOSTIK SA ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE ,  UNIVERSITE DE BORDEAUX ,  INSTITUT POLYTECHNIQUE DE BORDEAUX

Inventor： Marine DELGADO ,  Guillaume MICHAUD ,  Boris COLIN ,  Frédéric SIMON ,  Stéphane FOUQUAY ,  Mathieu PUCHEAULT

IPC: C08F210/14 ,  C08F220/14 ,  C08K5/55 ,  C08F2/44 ,  C08F2/56

CPC classification number: C08F210/14 ,  C08F220/14 ,  C08K5/55 ,  C08F2/44 ,  C08F2/56 ,  C08F2810/20

Abstract: The present invention relates to a two-component composition comprising a first part (A) comprising a borane BH3-amine complex and an alkene compound, and a second part (B) comprising at least one radically polymerizable compound comprising at least one ethylenic bond, and to an adhesive composition obtained therefrom, and also to uses thereof. The invention also relates to articles made with this composition.

公开(公告)号：US11667734B2

公开(公告)日：2023-06-06

申请号：US16785162

申请日：2020-02-07

Applicant: DREXEL UNIVERSITY

Inventor： Andrew J. D. Magenau ,  Olivia Rae Wilson

IPC: C08F20/56 ,  C08F2/06 ,  C08F2/38 ,  C08K5/55 ,  C08K5/39

CPC classification number: C08F20/56 ,  C08F2/06 ,  C08F2/38 ,  C08K5/39 ,  C08K5/55 ,  C08F2438/03

Abstract: A polymerization method including radically polymerizing a monomer in a polymerization medium comprising a chain transfer agent, and a free radical initiator prepared by oxidizing a reaction product of a ligand-reactive decomplexation agent and an alkyl-borane complex of the formula:




wherein R1, R2, and R3 are independently selected from hydrogen, an alkyl group containing from 1 to 12 carbon atoms, a cycloalkyl group containing from 3-12 carbon atoms, and an aryl group containing from 6 to 12 carbon atoms, wherein the aryl group may be optionally substituted with an alkyl group having from 1 to 10 carbon atoms, and at least one of R1, R2, and R3 is an alkyl group, a cycloalkyl group or an aryl group, and L is a complexing agent selected from one or more amine groups, amidine groups, hydroxide groups, alkoxyl groups, alkyl ether groups, alkoxide groups and mixtures thereof.

公开(公告)号：US11505676B2

公开(公告)日：2022-11-22

申请号：US16634828

申请日：2018-07-27

Applicant: DOW SILICONES CORPORATION

Inventor： Yusheng Chen ,  Shaohui Wang ,  Rui Wang ,  Mark D. Fisher

IPC: C08K5/55 ,  C08K5/14 ,  C08L27/18 ,  C08L83/04 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20

Abstract: A handling additive composition is disclosed. The composition is useful to improve handling of silicone elastomers prepared from polydiorganosiloxanes and silicone elastomers made therewith.

公开(公告)号：US11459445B2

公开(公告)日：2022-10-04

申请号：US16963580

申请日：2019-02-12

Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED

Inventor： Kenta Sakurada ,  Eiji Nitta ,  Takaya Ichimiya ,  Shota Konishi

IPC: C08K5/07 ,  C08K5/05 ,  C08L33/16 ,  C08K5/053 ,  C08K5/09 ,  C08K5/1545 ,  C08K5/3417 ,  C08K5/3437 ,  C08K5/375 ,  C08K5/55 ,  C08K11/00

Abstract: The present invention provides a composition capable of reducing adhesion of biofilms and therefore useful for producing a molded body. The composition comprises at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, and a quorum sensing inhibitor (B), and is configured such that a common logarithm log S of solubility of the quorum sensing inhibitor (B) in water of 25° C. is less than 0.1, and Ra1 is greater than 3.2 MPa1/2, provided that Ra1 is a distance between a Hansen solubility parameter of the at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins and a Hansen solubility parameter of the quorum sensing inhibitor (B).

公开(公告)号：US11326051B2

公开(公告)日：2022-05-10

申请号：US17293566

申请日：2020-06-10

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takuya Okada ,  Daisuke Sunaga

IPC: C08L59/04 ,  C08G2/04 ,  C08G2/06 ,  C08G2/10 ,  C08K5/55

Abstract: It has been desired to develop a method for producing an oxymethylene polymer, by which an oxymethylene polymer having a high polymerization degree can be produced with high efficiency while suppressing increase in the amount of generation of an odor. Further, it has been desired to develop an oxymethylene polymer resin composition, wherein generation of an odor at the time of molding or after molded to obtain a molded body is suppressed. The present invention provides a method for producing an oxymethylene polymer, wherein the oxymethylene polymer is produced by polymerizing a cyclic oligomer of formaldehyde, and wherein a boron trifluoride compound and an aryl fluoride boron compound are used as polymerization catalysts. The present invention also provides an oxymethylene polymer resin composition containing an oxymethylene polymer and a derivative of an aryl fluoride boron compound.