公开(公告)号：US12227867B2

公开(公告)日：2025-02-18

申请号：US18152089

申请日：2023-01-09

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chen-Yu Tsai ,  Ku-Feng Yang ,  Wen-Chih Chiou

IPC: C25D21/04 ,  C25D7/12 ,  C25D17/00 ,  C25D17/08 ,  C25D21/10 ,  H01L21/768

Abstract: A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

公开(公告)号：US20240209541A1

公开(公告)日：2024-06-27

申请号：US18427250

申请日：2024-01-30

Applicant: Snap-on Incorporated

Inventor： Kraig A. Tabor ,  Thomas L. Kassouf ,  Ricardo M. Guedes ,  Greg P. Formella ,  Alan J. Birschbach ,  Peter W. Eisch ,  Garry L. Dillon ,  Chad J. Kaschak ,  Michael G. Gentile

IPC: C25D21/08 ,  C25D5/08 ,  C25D17/00 ,  C25D17/02 ,  C25D17/04 ,  C25D17/06 ,  C25D17/08 ,  C25D17/10 ,  C25D21/10 ,  C25D21/12

CPC classification number: C25D21/08 ,  C25D5/08 ,  C25D17/00 ,  C25D17/02 ,  C25D17/04 ,  C25D17/06 ,  C25D17/08 ,  C25D17/10 ,  C25D21/10 ,  C25D21/12

Abstract: A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.

公开(公告)号：US20240150923A1

公开(公告)日：2024-05-09

申请号：US18548773

申请日：2022-02-16

Applicant: MTI GMBH

Inventor： Markus HACKSTEINER

IPC: C25D17/00 ,  C25D17/08

CPC classification number: C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/08

Abstract: Described is a method for wet-chemical treatment of microchip substrates, wherein the microchip substrates are inserted into a holding device. The holding device is docked using an adapter onto a unit for wet-chemical treatment, such as metallization.

公开(公告)号：US11905612B2

公开(公告)日：2024-02-20

申请号：US17859717

申请日：2022-07-07

Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

Inventor： Takeharu Naito ,  Osamu Hashiguchi ,  Yumiko Kobori ,  Akifumi Nakamura ,  Yosuke Honda ,  Masanori Takahashi

IPC: C25D7/04 ,  C25D17/06 ,  C25D3/02 ,  C25D5/02 ,  C25D17/00 ,  C25D17/08

CPC classification number: C25D3/02 ,  C25D5/02 ,  C25D7/04 ,  C25D17/005 ,  C25D17/06 ,  C25D17/08

Abstract: In a plating method for mounting a tubular workpiece having openings at both ends in an axial direction thereof on a power feeding clip and immersing the tubular workpiece in a circulated plating solution to plate the tubular workpiece, the mounting of the tubular workpiece on the power feeding clip is performed by inserting the power feeding clip into the tubular workpiece from one of the openings of the tubular workpiece. The power feeding clip is configured by a folded metal plate, and includes a plurality of elastic contact pieces that can elastically contact the inner surface of the tubular workpiece to hold the tubular workpiece and supply power to the tubular workpiece, and a restraining part that is located inside the tubular workpiece and restrains flow of the plating solution in the axial direction.

公开(公告)号：US20230399766A1

公开(公告)日：2023-12-14

申请号：US18033776

申请日：2021-06-01

Applicant: EBARA CORPORATION

Inventor： Naoto TAKAHASHI

IPC: C25D17/08 ,  C25D17/10 ,  C25D17/02 ,  C25D21/12

CPC classification number: C25D17/08 ,  C25D17/10 ,  C25D17/02 ,  C25D21/12

Abstract: Provided are a plating apparatus and a plating method for preventing or mitigating electric field diversion irrespective of the physical or mechanical structure. According to one embodiment, provided is a plating apparatus comprising: a substrate holder configured so as to hold a substrate; a plating bath configured so as to accommodate the substrate holder which holds the substrate, and provided with a first tank on a first surface side of the substrate and a second tank on a second surface side of the substrate, the first tank and the second tank communicating with each other with a gap therebetween; a first anode electrode arranged in the first tank of the plating bath; a first power source configured so as to supply a plating current between the substrate and the first anode electrode; an auxiliary anode electrode arranged on the first tank side of the gap; an auxiliary cathode electrode arranged on the second tank side of the gap; and an auxiliary power source configured so as to supply an auxiliary current between the auxiliary anode electrode and the auxiliary cathode electrode.

公开(公告)号：US11414775B1

公开(公告)日：2022-08-16

申请号：US17319330

申请日：2021-05-13

Applicant: U-PRO MACHINES CO., LTD.

Inventor： Hsin-Chi Iou ,  Huan-Chun Lin ,  Hsu-Cheng Peng

IPC: C25D17/08

Abstract: A power supply system for a vertical continuous electroplating frame, comprising: a power supply rail arranged on the vertical continuous electroplating device; and an electrode case, arranged a case body on the top surface of the electroplating frame, inside the case body having an electrode plate corresponding to the power supply rail, at the bottom of the electrode plate having an elastic unit, the top surface of the case body having a positioning groove corresponding to the electrode plate, when the electrode plate is electrical contacted with the power supply rail, the electroplating current is provided to the object to be plated through the electroplating frame.

公开(公告)号：US20220205126A1

公开(公告)日：2022-06-30

申请号：US17137267

申请日：2020-12-29

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chen-Yu Tsai ,  Ku-Feng Yang ,  Wen-Chih Chiou

IPC: C25D21/04 ,  H01L21/768 ,  C25D17/00 ,  C25D17/08 ,  C25D21/10 ,  C25D7/12

Abstract: A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

公开(公告)号：US20220186395A1

公开(公告)日：2022-06-16

申请号：US17689312

申请日：2022-03-08

Applicant: EBARA CORPORATION

Inventor： Shota Moriyama ,  Matsutaro Miyamoto

IPC: C25D17/08 ,  C25D21/00

Abstract: There is provided a substrate holder for holding a substrate including a first holding member having a first opening portion for exposing a first surface of the substrate, and a second holding member configured to hold the substrate together with the first holding member and having a second opening portion for exposing a second surface of the substrate, wherein the first holding member has at least one first external connection contact, and the second holding member has at least one second external connection contact that is independent of the first external connection contact.

公开(公告)号：US11299817B2

公开(公告)日：2022-04-12

申请号：US16609884

申请日：2018-06-12

Applicant: EBARA CORPORATION

Inventor： Shota Moriyama ,  Matsutaro Miyamoto

IPC: C25D17/08 ,  C25D21/00

Abstract: There is provided a substrate holder for holding a substrate including a first holding member having a first opening portion for exposing a first surface of the substrate, and a second holding member configured to hold the substrate together with the first holding member and having a second opening portion for exposing a second surface of the substrate, wherein the first holding member has at least one first external connection contact, and the second holding member has at least one second external connection contact that is independent of the first external connection contact.

公开(公告)号：US20220106701A1

公开(公告)日：2022-04-07

申请号：US17469069

申请日：2021-09-08

Applicant: EBARA CORPORATION

Inventor： Kazuhito Tsuji ,  Shao Hua Chang ,  Masashi Shimoyama

IPC: C25D21/04 ,  C25D17/00 ,  C25D17/10 ,  C25D17/08

Abstract: A technique that ensures suppressing deterioration of a plating quality of a substrate caused by air bubbles accumulated on a lower surface of a membrane is provided. An air bubble removing method of a plating apparatus is an air bubble removing method for removing air bubble in an anode chamber 13 in a plating apparatus 1000 including a plating tank 10 and a substrate holder 30. The air bubble removing method includes: supplying a plating solution Ps from at least one supply port 70 disposed in an outer peripheral portion 12 of the anode chamber to the anode chamber and causing at least one discharge port 71 disposed in the outer peripheral portion of the anode chamber so as to face the supply port to suction the supplied plating solution to form a shear flow Sf of the plating solution along a lower surface on the lower surface 61a of a membrane 61 in the anode chamber.