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公开(公告)号：US12221714B2
公开(公告)日：2025-02-11
申请号：US17674276
申请日：2022-02-17
Applicant: EBARA CORPORATION
Inventor： Ryuya Koizumi , Masashi Shimoyama , Mizuki Nagai
Abstract: A plating method capable of saving a substrate in an event of a failure of a transporter, a plating tank, or other component when the substrate is being plated is disclosed. The plating method includes: transporting a plurality of substrates to a plurality of plating tanks, respectively, with a transporter; immersing the plurality of substrates in a plating solution held in the plurality of plating tanks to plate the plurality of substrates; detecting a failure that has occurred in the transporter or a post-processing tank; and replacing the plating solution in the plurality of plating tanks with a preservative liquid to thereby immerse the plurality of substrates in the preservative liquid.
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公开(公告)号：US12195867B2
公开(公告)日：2025-01-14
申请号：US17538245
申请日：2021-11-30
Applicant: Applied Materials, Inc.
Inventor： Kwan Wook Roh , Xundong Dai , Keith Edward Ypma , Scott A. Wehrmann
Abstract: Electrochemical deposition systems and methods are described that have enhanced crystallization prevention features. The systems may include a bath vessel operable to hold an electrochemical deposition fluid having a metal salt dissolved in water. The systems may also include sensors including a thermometer and concentration sensor operable to measure characteristics of the electrochemical deposition fluid. The systems further include a computer configured to perform operations that include receiving system data from the electrochemical system and generating a control signal to change a characteristic of the electrochemical deposition fluid to prevent crystallization of a metal salt in the fluid. The computer generates the control signal based on processing that may include comparing an actual metal salt concentration in the electrochemical deposition fluid to a theoretical solubility limit for the metal salt in the fluid.
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公开(公告)号：US12188143B2
公开(公告)日：2025-01-07
申请号：US17588242
申请日：2022-01-29
Inventor： Daiqiong (Diana) Zhang , Yuelin (Kevin) Liang , Dongqing (Gates) Peng , Chunyan (Cherie) Zhou , Zhongxi Huang
Abstract: An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.
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公开(公告)号：US12152311B2
公开(公告)日：2024-11-26
申请号：US17761304
申请日：2020-12-28
Applicant: EBARA CORPORATION
Inventor： Shao Hua Chang , Masaya Seki
Abstract: Provided is a wetting method for substrate that allows reducing an amount of air bubbles attached to a surface to be plated with a simple structure.
The wetting method for substrate includes a holding step 102 of holding a back surface of a substrate with a back plate such that a surface to be plated of the substrate is opposed to a liquid surface of a plating solution housed in a plating tank, a supplying step 104 of supplying the plating solution to the plating tank such that the plating solution upwardly flows through a plurality of through-holes in a center part of an ionically resistive element arranged inside the plating tank to raise a center part of the liquid surface of the plating solution, a first lowering step 106 of lowering a supporting member for supporting an outer edge portion of the surface to be plated of the substrate held by the holding member toward the liquid surface of the plating solution, and a second lowering step 108 of lowering the holding member such that the substrate is sandwiched by the supporting member lowered in the first lowering step 106 and the holding member while the center part of the liquid surface of the plating solution is raised in the supplying step 104.-
公开(公告)号：US12121873B2
公开(公告)日：2024-10-22
申请号：US17409013
申请日：2021-08-23
Applicant: BOE Technology Group Co., Ltd.
Inventor： Shaodong Sun , Junwei Yan , Guangcai Yuan , Guocai Zhang , Shihao Dong , Lilei Zhang , Haoran Gao , Wenyue Fu , Chengfei Wang , Xiaojie Pan
CPC classification number: B01F35/189 , B01D45/04 , B01F23/59 , B01F35/71805 , C25D3/38 , C25D21/04 , C25D21/14 , B01F23/56 , B01F2101/22
Abstract: The present disclosure provides a gas-solid separation structure including: a feeding pipeline including a first feeding part, a second feeding part and a first valve disposed between the first and second feeding parts; a discharge pipeline having a first opening and a second opening opposite to each other, the second feeding part extending into the discharge pipeline via the first opening; wherein an exhaust channel is formed between the second feeding part and the discharge pipeline, exhaust holes are formed in a portion of the discharge pipeline opposite to the second feeding part, and the exhaust channel is in communication with the exhaust holes. The present disclosure further provides a feeding device and an electrochemical deposition apparatus. The present disclosure can improve the problem of interference with medicine powder release caused by gases entering the discharge pipeline.
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Patent Agency Ranking
公开(公告)号：US12104270B2
公开(公告)日：2024-10-01
申请号：US18311888
申请日：2023-05-03
Applicant: FABRIC8LABS, INC.
Inventor： Kareemullah Shaik , Andrew Edmonds , Ryan Nicholl , David Pain
CPC classification number: C25D3/02 , C25D17/007 , C25D21/14
Abstract: A method of electroplating a target electrode comprises establishing a first electric current through an electrolytic solution, comprising a quantity of an electrically charged material, an initial electrode, and a transitional electrode, so that a quantity of the electrically charged material is converted to a quantity of an electrically neutral material, which is electroplated, as a deposit, onto the transitional electrode; and establishing a second electric current through the electrolytic solution, the transitional electrode, and the target electrode so that a quantity of the electrically neutral material from the deposit is converted to a quantity of the electrically charged material, which is dissolved into the electrolytic solution, and a quantity of the electrically charged material in the electrolytic solution is converted to a quantity of the electrically neutral material, which is electroplated onto the surface of the target electrode.
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公开(公告)号：US12024787B2
公开(公告)日：2024-07-02
申请号：US17514971
申请日：2021-10-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Guocai Zhang , Junwei Yan , Shihao Dong , Shaodong Sun , Chengfei Wang
Abstract: The present disclosure relates to a filling device and apparatus, an electrochemical deposition system, and a filling method. The filling device includes: a feeding structure including a first feed port and a first discharge port; a container including a second feed port and a second discharge port; a weighing means disposed on the container; a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; and a control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means.
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公开(公告)号：US11906299B2
公开(公告)日：2024-02-20
申请号：US17616906
申请日：2021-01-20
Applicant: EBARA CORPORATION
Inventor： Masaya Seki , Masaki Tomita , Shao Hua Chang
CPC classification number: G01B7/06 , C25D5/007 , C25D17/005 , C25D17/02 , C25D17/10 , C25D21/14 , G01R15/12 , G01R15/181
Abstract: Provided is a technique that allows measuring a film thickness of a substrate in a plating process.
A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.-
公开(公告)号：US20220298668A1
公开(公告)日：2022-09-22
申请号：US17297470
申请日：2020-08-21
Applicant: YUKEN INDUSTRY CO., LTD.
Inventor： Toshihiro SUGIURA , Yasunori AOKI
Abstract: Provided is a method for suppressing an increase in the zinc concentration of a plating solution when a zinc alloy plating member using nickel as an alloy element is manufactured using a zinc alloy plating apparatus. The plating apparatus includes: a plating tank; a first diaphragm tank having a first diaphragm; a cathode holding member; a first anode holding member; a soluble zinc-containing member held by the first anode holding member; a soluble metal-containing member containing the nickel which is the alloy element; and a second anode holding member for anode-electrolyzing the soluble metal-containing member. The first diaphragm tank is arranged in a manner that the first electrolytic solution is in contact with one surface of the first diaphragm and the plating solution is in contact with the other surface of the first diaphragm during use.
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公开(公告)号：US20220243355A1
公开(公告)日：2022-08-04
申请号：US17588242
申请日：2022-01-29
Inventor： Daiqiong (Diana) Zhang , Yuelin (Kevin) Liang , Dongqing (Gates) Peng , Chunyan (Cherie) Zhou , Zhongxi Huang
Abstract: An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.
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