利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

2082 条记录 (耗时 0.036 秒)

    SYSTEM, APPARATUS, AND METHOD OF LINK TRAINING OVER A REDRIVER-BASED OPTICAL INTERCONNECT
    2.
    发明公开
    SYSTEM, APPARATUS, AND METHOD OF LINK TRAINING OVER A REDRIVER-BASED OPTICAL INTERCONNECT 审中-公开

    公开(公告)号：US20240345345A1

    公开(公告)日：2024-10-17

    申请号：US18757571

    申请日：2024-06-28

    申请人： Intel Corporation

    发明人： Debendra Das Sharma

    IPC分类号： G02B6/42 ,  G02B6/43

    CPC分类号： G02B6/4274 ,  G02B6/43

    摘要： For example, an electronic system may include interconnect circuitry to communicate over an electrical interconnect; and a Physical layer (PHY) controller configured to access a plurality of optical-capability registers to identify optical-training control information and optical-capability information. For example, the optical-training control information may include a start-training bit. For example, based on a determination that the start-training bit is set to a predefined value, the PHY controller may initiate an optical-based link training procedure via the electrical interconnect to train a link between the electronic system and a partner electronic system over a redriver-based optical interconnect. For example, the optical-based link training procedure may be based on the optical-capability information.

    Photonic integrated circuit chip
    4.
    发明授权
    Photonic integrated circuit chip 有权

    公开(公告)号：US12117661B2

    公开(公告)日：2024-10-15

    申请号：US17466081

    申请日：2021-09-03

    申请人： Molex, LLC

    发明人： Li-Chi Yang ,  Bing-Hao Shih ,  Chih-Chung Wu ,  Zuon-Min Chuang

    IPC分类号： G02B6/42 ,  G02B6/43 ,  H04B10/25 ,  H04B10/40 ,  H04J14/02 ,  H04J14/06

    CPC分类号： G02B6/4246 ,  G02B6/4213 ,  G02B6/43 ,  H04B10/25891 ,  H04B10/40 ,  H04J14/02 ,  H04J14/06

    摘要： The present disclosure provides a photonic integrated circuit chip. The photonic integrated circuit chip comprises a plurality of connection ports, multiple polarization beam splitting structures, a photodetector structure, an interleaver and a modulator. The plurality of connection ports are used to receive a plurality of first optical signals to the photonic integrated circuit chip. The multiple polarization beam splitting structures each are used to split the first optical signal passing through the polarization beam splitting structure into a first mode optical signal and a second mode optical signal. The photodetector structure comprises a first component for split beam and a second component for split beam. The interleaver is used to transfer the first mode optical signal or the second mode optical signal to the second component for split beam. The modulator is used to transfer second optical signals with different wavelengths to the interleaver. The interleaver further transfers the second optical signals to the different connection ports according to the different wavelengths of the second optical signals.

    Package structure including photonic package and interposer having waveguide
    10.
    发明授权
    Package structure including photonic package and interposer having waveguide 有权

    公开(公告)号：US12044892B2

    公开(公告)日：2024-07-23

    申请号：US17703374

    申请日：2022-03-24

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Chen-Hua Yu ,  Hsing-Kuo Hsia

    IPC分类号： G02B6/43 ,  G02B6/42 ,  H01S5/02326 ,  G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/4274 ,  H01S5/02326 ,  G02B6/12002 ,  G02B6/12004

    摘要： A semiconductor package includes a first interposer having a first substrate, a first redistribution structure over a first side of the first substrate, and a first waveguide over the first redistribution structure and proximate to a first side of the first interposer, where the first redistribution structure is between the first substrate and the first waveguide. The semiconductor package further includes a photonic package attached to the first side of the first interposer, where the photonic package includes: an electronic die, and a photonic die having a plurality of dielectric layers and a second waveguide in one of the plurality of dielectric layers, where a first side of the photonic die is attached to the electronic die, and an opposing second side of the photonic die is attached to the first side of the first interposer, where the second waveguide is proximate to the second side of the photonic die.