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公开(公告)号：US20240355570A1
公开(公告)日：2024-10-24
申请号：US18763832
申请日：2024-07-03
IPC分类号： H01H85/055 , H01H69/02 , H01H85/045 , H01H85/10 , H01H85/11 , H01H85/12 , H01H85/143 , H01H85/175 , H01H85/18 , H01H85/20
CPC分类号： H01H85/055 , H01H69/02 , H01H85/0456 , H01H85/10 , H01H85/11 , H01H85/12 , H01H85/175 , H01H85/203 , H01H85/143 , H01H85/18 , H01H2239/044 , Y10T29/49108
摘要： In one embodiment, a method of manufacturing a high voltage power fuse includes inserting a housing over a first assembly leg of an assembly frame, assembling a first terminal fabrication to the first assembly leg of the assembly frame, assembling a second terminal fabrication to a second assembly leg of the assembly frame, connecting a full-range fuse element assembly in a gap between the first terminal fabrication and the second terminal fabrication, sliding the housing over the connected full-range fuse element assembly, securing the housing in position to enclose the full-range fuse element assembly, and applying a silicated filler material to the assembled housing, full-range fuse element, and first and second terminals to establish a mechanical bond between the silicated filler material and the assembled housing, full-range fuse element, and first and second terminals.
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公开(公告)号：US12087535B2
公开(公告)日：2024-09-10
申请号：US17920303
申请日：2021-07-14
发明人： Sang Ok Seon
IPC分类号： H01H85/08 , H01H69/02 , H01H85/046 , H01H85/06 , H01H85/143
CPC分类号： H01H85/08 , H01H69/022 , H01H85/046 , H01H85/06 , H01H85/143
摘要： A flexible printed circuit board (FPCB) including a pattern circuit layer. The pattern circuit layer has a pattern fuse embedded therein, and the pattern fuse includes a first conductive wire made of a metal and having a spiral structure, and a second conductive wire made of a metal and having a spiral structure. The first conductive wire and the second conductive wire have a double helix structure.
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公开(公告)号：US20240274390A1
公开(公告)日：2024-08-15
申请号：US18433822
申请日：2024-02-06
申请人： Littelfuse, Inc.
IPC分类号： H01H85/06 , H01H69/02 , H01H85/0445
CPC分类号： H01H85/06 , H01H69/022 , H01H85/0445 , H01H2229/002
摘要： Provided herein a circuit protection devices including a fusible element attached to a ceramic substrate, the fusible element comprising a paste including a plurality of nickel particles.
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公开(公告)号：US12002643B2
公开(公告)日：2024-06-04
申请号：US17538438
申请日：2021-11-30
IPC分类号： H01H85/046 , H01H69/02 , H01H85/042 , H01H85/38
CPC分类号： H01H85/046 , H01H69/022 , H01H85/042 , H01H85/38
摘要： A printed fuse fabrication is provided. The printed fuse includes a low thermal conductivity ceramic substrate and a fusible element printed on the substrate. The fusible element printed on the substrate includes a series of portions of reduced printed thickness, defining weak spots for fusible operation of the fusible element, respectively separated by portions of increased printed thickness.
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公开(公告)号：US20240021396A1
公开(公告)日：2024-01-18
申请号：US17865719
申请日：2022-07-15
CPC分类号： H01H85/38 , H01H85/0013 , H01H69/02
摘要： The disclosed concept relates generally to overlay composite fuse elements, materials for their construction that include copper and silver metals, and methods of production and fabrication using metal stamping and ultrasonic welding processes. In certain embodiments, a composite overlay fuse element includes a composite metal material 37 constructed of silver and copper metals, which includes a plurality of strain absorbing bend features 39 constructed of copper metal, and a plurality of arc interrupting weak spot features 43 constructed of a silver metal portion and a copper metal portion. The silver and copper metal portions on each of the plurality of arc interrupting weak spot features 43 are connected by a weld joint surface 45 that is structured to form an overlay of the silver and copper metal portions.
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公开(公告)号：US20230420210A1
公开(公告)日：2023-12-28
申请号：US18207779
申请日：2023-06-09
发明人： Changcai ZHAO , Wei SHI , Guojun XIAO , Rong Guan , Qiang Zhao , Xinping Shi , Kangsheng Lin
CPC分类号： H01H85/06 , H01H69/02 , H01H85/08 , H01H2229/00
摘要： The present disclosure relates to thermal cutoff device pellet composition. Provided is a pellet composition having enhanced aging performance, electrical performance, pellet output, pellet density and pellet crush strength for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound having a low vapor pressure at room temperature, such as tetraphenylsilane. The thermal pellet composition comprising tetraphenylsilane can significantly improve interruption performance, pellet output, pellet density, pellet crush strength and aging performance of the thermal cutoff device.
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公开(公告)号：US20230187160A1
公开(公告)日：2023-06-15
申请号：US18165806
申请日：2023-02-07
发明人： Robert S. Douglass , John Trublowski , Rajen Modi , Nilay Mehta , Venkat raman Thenkarai Narayanan
IPC分类号： H01H85/046 , H01H85/143 , H01H69/02
CPC分类号： H01H85/046 , H01H85/143 , H01H69/022 , H01H2085/383
摘要： A power fuse for protecting an electrical load subject to transient load current cycling events in a direct current electrical power system is provided. The power fuse includes at least one fuse element assembly that includes one or more substrates, one or more sets of weak spots, and a conductor. The weak spots are formed on the substrates, and the substrates are longitudinally spaced apart from one another along the conductor. The conductor is separately provided from the substrate and the weak spots. The conductor includes one or more strips of metal having no stamped weak spot openings therein and therefore avoiding thermal-mechanical fatigue strain in the conductor when subjected to the transient load current cycling events. The conductor includes connector sections that are attached to respective ones of the sets of weak spots, and extending sections coupling the connector sections.
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公开(公告)号：US20230051371A1
公开(公告)日：2023-02-16
申请号：US17792964
申请日：2020-12-10
发明人： Takayuki Sasama , Shigeki Yabashi
摘要： Provided are a fuse having a structure that facilitates bending of a fuse element, and a method for manufacturing the fuse. In a fuse including a fuse element having a pair of terminal portions, a middle portion provided between the terminal portions, and a fusing portion provided in the middle portion, at least two or more of the middle portions are provided in the terminal portion, at least one of the middle portions is bent along a long direction such that a center side protrudes from long sides on both sides, and the middle portions are disposed to face each other when the terminal portion is folded at a bending point K2 of the terminal portion.
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公开(公告)号：US11508542B2
公开(公告)日：2022-11-22
申请号：US17530008
申请日：2021-11-18
申请人： Littelfuse, Inc.
IPC分类号： H01H85/17 , H01H69/02 , H01H85/041 , H01H85/06 , H01H85/165
摘要： A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.
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公开(公告)号：US11348754B2
公开(公告)日：2022-05-31
申请号：US16404093
申请日：2019-05-06
IPC分类号： H01H85/041 , H01H85/157 , H01H69/02 , H01H85/045 , H01H85/175
摘要： A high-capacity miniature cartridge fuse is provided. A fuse includes a cylindrical housing, a fusible wire, and first and second deep-drawn ferrules fabricated from aluminum alloy. The aluminum is plated with nickel. The ferrule includes a side wall and an end wall. The side wall surrounds the first or second end of the housing, and has a thickness of approximately 0.50 mm or less. The end wall includes a boss extending toward an interior of the housing, and has a thickness greater than the thickness of the side wall.
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