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公开(公告)号：US20250008845A1
公开(公告)日：2025-01-02
申请号：US18830300
申请日：2024-09-10
Applicant: Google LLC
Inventor： Julian Shaw Kelly , Evan Jeffrey
Abstract: A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.
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公开(公告)号：US20250006666A1
公开(公告)日：2025-01-02
申请号：US18215480
申请日：2023-06-28
Applicant: Intel Corporation
Inventor： Jiun Hann Sir , Poh Boon Khoo
Abstract: An integrated circuit (IC) device includes an IC die on a substrate, and the substrate includes a group of conductive lines between a high-permittivity dielectric layer and a low-permittivity dielectric layer, with a ground plane separated from the conductive lines by either the high- or low-permittivity dielectric layer. The substrate may include other low-permittivity dielectric layers. The substrate may include other groups of conductive lines between ground planes. The high-permittivity dielectric layer may be within a low-permittivity dielectric core layer.
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公开(公告)号：US12148967B2
公开(公告)日：2024-11-19
申请号：US17750552
申请日：2022-05-23
Applicant: NEC Corporation
Inventor： Tsuyoshi Sukegawa , Takahiro Miyamoto
Abstract: A filter that can make a reflection delay of an initial stage coupling part correspond to a change in a passband due to a manufacturing error of a substrate or the like is realized. A filter according to an example embodiment includes: a substrate having a dielectric property; an initial stage coupling part formed on the substrate; and an interstage coupling part formed on the substrate. The initial stage coupling part is formed so that a reflection delay is decreased in accordance with an increase in a passband due to a manufacturing error of the substrate or the interstage coupling part, or so that the reflection delay is increased in accordance with a decrease in the passband.
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公开(公告)号：US20240380091A1
公开(公告)日：2024-11-14
申请号：US18779310
申请日：2024-07-22
Abstract: A metal injection filter includes a resonator chamber body and a plurality of resonators. The resonator chamber body is an enclosure that forms a resonance chamber. The plurality of resonators are mounted in the resonance chamber. At least one resonator of the plurality of resonators is molded by a metal injection molding process.
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公开(公告)号：US12142804B2
公开(公告)日：2024-11-12
申请号：US18449349
申请日：2023-08-14
Applicant: International Business Machines Corporation
Inventor： Patryk Gumann , Salvatore Bernardo Olivadese
IPC: H01P1/30 , G06N10/00 , H01B12/02 , H01P1/20 , H01P1/203 , H01P3/00 , H01P11/00 , H05K7/20 , H01P1/22
Abstract: An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.
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Patent Agency Ranking
公开(公告)号：US12107311B2
公开(公告)日：2024-10-01
申请号：US17514011
申请日：2021-10-29
Applicant: Dell Products L.P.
Inventor： Bhyrav Mutnury , Sandor Farkas
CPC classification number: H01P1/20 , H01P11/007
Abstract: A system for preventing crosstalk between adjacent channels comprises a crossover connector positioned along a length of one channel such that a portion of a positive trace for a first channel is positioned adjacent to a positive trace of a positive trace of an adjacent channel. The position of the crossover connector is based on preventing crosstalk and crossover connectors on adjacent channels may be staggered to further prevent crosstalk. A crossover connector may be based on capacitors or resistors to prevent crosstalk.
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公开(公告)号：US12095134B2
公开(公告)日：2024-09-17
申请号：US17651334
申请日：2022-02-16
Applicant: Alibaba (China) Co., Ltd.
Inventor： Chengchun Tang
CPC classification number: H01P11/003 , C23F1/20 , H01P3/003
Abstract: A method for preparing a coplanar waveguide structure includes acquiring a structure to be etched, the structure to be etched including an aluminum film provided on a substrate structure and a photoresist structure provided at an upper end of the aluminum film, wherein the photoresist structure is configured to cover partial areas of the aluminum film; performing a first etching operation on the aluminum film provided on the substrate structure by using an acidic solution to obtain a first etched structure; rinsing the first etched structure to obtain an intermediate structure; performing a second etching operation on the intermediate structure by using an alkaline solution to obtain a second etched structure; and rinsing the second etched structure to obtain a target structure for generating a coplanar waveguide structure, the target structure including the aluminum film and the photoresist structure, wherein the photoresist structure covers all areas of the aluminum film.
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公开(公告)号：US20240304974A1
公开(公告)日：2024-09-12
申请号：US18001798
申请日：2021-06-16
Applicant: SWISSto12 SA
Inventor： Mathieu Billod , Alexandre Dimitriades
CPC classification number: H01P3/14 , H01P11/002
Abstract: The invention concerns a flexible waveguide device (10), of the bellows type, for guiding a radio frequency signal at a given frequency range. The device comprises: a core (12) comprising outer and inner side walls (14a, 14b), the inner walls (14b) delimiting a waveguide channel (16); two fixing flanges (18a, 18b) connected to or integral with respective ends of the core (12), and at least one flexible corrugated portion (20) formed on a part of the outer side walls (14a) of the core (12) and comprising a plurality of circumferential ribs (22) adjacent to each other. Each rib (22) is devoid of corrugation along its circumference. The invention also relates to a method of manufacturing the flexible waveguide device.
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公开(公告)号：US20240266708A1
公开(公告)日：2024-08-08
申请号：US18429314
申请日：2024-01-31
Applicant: Purdue Research Foundation
Inventor： Dimitrios Peroulis , Michael Dimitri Sinanis
CPC classification number: H01P7/06 , H01P11/008
Abstract: A tunable radio frequency (RF) resonator may include an RF cavity core defining an RF cavity. The RF cavity core may include a post positioned within the RF cavity. The tunable RF resonator may further include a flexible membrane covering the RF cavity. A gap may be defined between the flexible membrane and the post. An actuator may cause movement of the flexible membrane and vary the distance between the membrane and the post. The RF cavity core is may be injection molded plastic with a metalized electroplating.
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公开(公告)号：US12057612B2
公开(公告)日：2024-08-06
申请号：US18299181
申请日：2023-04-12
Applicant: ALIBABA GROUP HOLDING LIMITED
CPC classification number: H01P3/003 , H05K1/0237 , G06N10/00 , H01P11/003
Abstract: A waveguide includes: a substrate; a first ground wire; a second ground wire; a signal wire; and a compensation structure. The first ground wire, the second ground wire, and the signal wire are disposed on the substrate at intervals, and the signal wire is located between the first ground wire and the second ground wire. The compensation structure is configured to contact at least one of the substrate, the first ground wire, the second ground wire, or the signal wire; and the compensation structure comprises a superconducting material.
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