Abstract:
Die Erfindung bezieht sich auf Halbleiterbauteile, insbesondere Solarzellen aus III -V Verbindungshalbleitern, wie sie in terrestrischen PV Konzentratorsystemen oder zur elektrischen Energieversorgung in Satelliten eingesetzt werden. Sie findet jedoch auch Anwendung in anderen optoelektronischen Bauteilen, wie Laser und Leuchtdioden, wo entweder hohe Tunnel stromdichten nötig sind oder spezielle Materialien zum Einsatz kommen und wo eine Verspannung der Gesamtstruktur nicht erwünscht ist. Die erfindung besteht darin, Tunneldioden von Halbleiterbauteilen aus spannungskompensierten Halbleiterschichten zu bilden.
Abstract:
In accordance with a first aspect of the invention, an optical device is presented, the optical device being a superluminescent light emitting diode or amplifier chip, the optical device comprising a semiconductor quantum well heterostructure embedded in a cladding structure, and a current injector for injecting charge carriers in the heterostructure, so that radiation reaching the heterostructure is amplifiable by stimulated emission. The heterostructure defines a first and a second discrete energy level in a conduction band, the first and second energy levels spaced apart from each other by more than a thermal excitation energy kT w at a working temperature T w of the optical device, with essentially no energy levels between the first and the second energy level, and the higher one of the first and second energy levels being spaced from a conduction energy band of the cladding structure by more than the thermal excitation energy at the working temperature, the optical device further comprising feedback suppressing means.
Abstract:
Group III (Al, Ga, In)N single crystals, articles and films useful for producing optoelectronic devices (such as light emitting diodes (LEDs), laser diodes (LDs) and photodetectors) and electronic devices (such as high electron mobility transistors (HEMTs)) composed of III-V nitride compounds, and methods for fabricating such crystals, articles and films.
Abstract:
Semiconductor-on-diamond devices and methods for making such devices are provided. One such method may include depositing a semiconductor layer (14) on a semiconductor substrate (12), depositing an adynamic diamond layer (16) on the semiconductor layer (14) opposite the semiconductor substrate (12), and coupling a support substrate (18) to the adynamic diamond layer (16) opposite the semiconductor layer (14) to support the adynamic layer.
Abstract:
A solid state light emitting device comprising an emitter structure having an active region of semiconductor material and a pair of oppositely doped layers of semiconductor material on opposite sides of the active region. 'The active region emits light at a predetermined wavelength in response to an electrical bias across the doped layers. An absorption layer of semiconductor material is included that is integral to said emitter structure and doped with at least one rare earth or transition element. The absorption layer absorbs at least some of the light emitted from the active region and re-emits at least one different wavelength of light. A substrate is included with the emitter structure and absorption layer disposed on the substrate.
Abstract:
A compound semiconductor light-emitting diode includes a light-emitting layer 133 formed of aluminum-gallium-indium phosphide, a light-emitting part 13 having component layers individually formed of a Group III-V compound semiconductor, a transparent supporting layer 14 bonded to one of the outermost surface layers 135 of the light-emitting part 13 and transparent to the light emitted from the light-emitting layer 133, and a bonding layer 141 formed between the supporting layer 14 and the one of the outermost surface layers 135 of the light-emitting part 13 containing oxygen atoms at a concentration of 1 x 10 20 CM -3 or less. The compound semiconductor light-emitting diode can avoid exertion of stress on the light-emitting part, suppress the occurrence of a crystal defect, enhance the bonding strength between the light-emitting part and the supporting layer, further decrease electric resistance in the bonding interface and thereby enhance the forward voltage (Vf), also heighten the reverse voltage and materialize impartation of high luminance:
Abstract:
Light-emitting devices, and related components, systems and methods are disclosed. The light-emitting device can include a multi-layer stack of materials and a support. The multi-layer stack of materials can include a light-generating region and a first layer supported by the light-generating region. The light-generating region can be between the first layer and the support. The surface of the first layer can be configured so that light generated by the light-generating region can emerged from the light-emitting device via the surface of the first layer. The surface of the first layer can have a dielectric function that varies spartially according to a pattern. The pattern can be formed of the holes in surface of the first layer. The pattern is configured so that light generated by the light-generating region that emerges from the light-emitting device via the surface of the first layer is more collimated than a Lambertian distribution of light.