METHOD AND APPARATUS FOR ENCODING MULTIMEDIA CONTENTS AND METHOD AND SYSTEM FOR APPLYING ENCODED MULTIMEDIA CONTENTS
    11.
    发明申请
    METHOD AND APPARATUS FOR ENCODING MULTIMEDIA CONTENTS AND METHOD AND SYSTEM FOR APPLYING ENCODED MULTIMEDIA CONTENTS 审中-公开
    用于编码多媒体内容的方法和装置以及应用编码多媒体内容的方法和系统

    公开(公告)号:WO2007029918A1

    公开(公告)日:2007-03-15

    申请号:PCT/KR2006/002865

    申请日:2006-07-20

    Abstract: A method and an apparatus for encoding multimedia contents, and a method and a system for applying multimedia contents are provided. The method for applying multimedia contents includes: storing an MAF file in a database, the MAF file including a header with location information that provides the location of media data, at least one single track with media data and metadata compatible with a predetermined standard, utilization data representing information for media application method; and browsing or sharing the MAF file stored in the database. The media metadata compatible with the predetermined standard is at least one of media player metadata and a media album metadata. Accordingly, even when the user does not have a specific application or a function for applying metadata, general-purpose multimedia content files can be effectively used by effectively browsing or sharing the multimedia content files.

    Abstract translation: 提供了一种用于编码多媒体内容的方法和装置,以及用于应用多媒体内容的方法和系统。 用于应用多媒体内容的方法包括:将MAF文件存储在数据库中,MAF文件包括具有提供媒体数据位置的位置信息的报头,至少一个具有媒体数据的单个轨道和与预定标准兼容的元数据,利用率 表示媒体应用方法信息的数据; 并浏览或共享存储在数据库中的MAF文件。 与预定标准兼容的媒体元数据是媒体播放器元数据和媒体相册元数据中的至少一个。 因此,即使用户不具有特定的应用或应用元数据的功能,也可以有效地浏览或共享多媒体内容文件来有效地使用通用多媒体内容文件。

    HIGH-TEMPERATURE RESISTANCE ADHESIVE TAPE AND FABRICATION METHOD THEREOF
    13.
    发明申请
    HIGH-TEMPERATURE RESISTANCE ADHESIVE TAPE AND FABRICATION METHOD THEREOF 审中-公开
    高温电阻胶带及其制造方法

    公开(公告)号:WO2005033238A1

    公开(公告)日:2005-04-14

    申请号:PCT/KR2004/002536

    申请日:2004-10-04

    Abstract: The present invention is directed to a high-temperature resistance adhesive tape, and a fabrication method thereof. The high-temperature resistance adhesive tape prepared by coating an adhesive composition on a substrate film physically surface-modified by corona or plasma treatment to form an adhesive layer and then performing a heat treatment for drying and curing at 140 to 230 ˚ C shows an enhanced adhesion between the adhesive layer and the substrate film through the physical surface modification of the substrate film to minimize a residue of the tape on an adherend, enabling its use for a high-temperature semiconductor process, and minimizes the unreacted functional group of the platinum catalyst through a high temperature process to reduce an appreciable change in properties on ageing, such as a deterioration of adhesion.

    Abstract translation: 本发明涉及耐高温胶带及其制造方法。 将通过电晕或等离子体处理物理表面改性的粘合剂组合物涂布在粘合剂层上,然后在140-230℃下进行干燥和固化的热处理而制备的耐高温胶粘剂显示出 通过基板膜的物理表面改性来增强粘合剂层和基材膜之间的粘附性,以使被粘物上的带的残留最小化,使其能够用于高温半导体工艺,并且使未被反应的官能团 铂催化剂通过高温过程降低老化性能的显着变化,例如粘附性的劣化。

    CERIA ABRASIVE FOR CMP
    19.
    发明申请
    CERIA ABRASIVE FOR CMP 审中-公开
    CERIA研磨CMP

    公开(公告)号:WO2004101702A9

    公开(公告)日:2005-12-15

    申请号:PCT/KR2004001139

    申请日:2004-05-14

    CPC classification number: C09G1/02 C09K3/1463 H01L21/31053

    Abstract: The present invention relates to a CMP abrasive comprising a ceria slurry and a chemical additive having two or more functional groups by mixing and synthesizing a polymeric molecule and a monomer . Also, the present invention relates to a method for a manufacturing CMP abrasive by providing a ceria slurry, manufacturing a chemical additive having two or more functional groups by mixing and synthesizing of the polymeric moleculeand the monomer in a reactor, and mixing said slurry and said chemical additive. Therefore, when the abrasive according to the present invention is used as an STI CMP abrasive, it is possible to apply the abrasive to the patterning process required in the very large scale integration semiconductor process. Furthermore, the CMP abrasive of the present invention has a superior removal rate, superior polishing selectivity, superior within wafer non-uniformity (WIWNU), and minimized occurrence of micro scratches.

    Abstract translation: 本发明涉及通过混合和合成聚合物分子和单体,其包含二氧化铈浆料和具有两个或更多个官能团的化学添加剂的CMP磨料。 另外,本发明涉及通过提供二氧化铈浆料制造CMP研磨剂的方法,通过在反应器中混合和合成聚合物分子和单体制备具有两个或多个官能团的化学添加剂,并将所述浆料和所述 化学添加剂。 因此,当将根据本发明的研磨剂用作STI CMP研磨剂时,可以将磨料施加到非常大规模的集成半导体工艺中所需的图案化工艺。 此外,本发明的CMP磨料具有优异的去除速度,优异的抛光选择性,在晶片不均匀性(WIWNU)内优异,并且最小化微小划痕的发生。

    ENDLESS BELT
    20.
    发明申请
    ENDLESS BELT 审中-公开
    无限皮带

    公开(公告)号:WO2013048019A1

    公开(公告)日:2013-04-04

    申请号:PCT/KR2012/006918

    申请日:2012-08-30

    Abstract: Disclosed herein is a method of manufacturing an endless belt, including the steps of: reacting a diamine monomer with a dianhydride monomer in a reactor filled with a conductive filler-dispersed liquid to obtain a reaction product, aging the reaction product and then discharging the aged reaction product from the reactor to prepare a semiconductive polyamic acid solution having a molecular weight distribution (Mw/Mn) of 1.3 ~ 3.0 and a weight average molecular weight (Mw) of 30,000 ~ 300,000; and applying the semiconductive polyamic acid solution to a seamless mold and completing an imidization reaction to obtain a polyimide film.

    Abstract translation: 本文公开了一种制造环形带的方法,包括以下步骤:在填充有导电填料分散液体的反应器中使二胺单体与二酐单体反应,得到反应产物,使反应产物老化,然后排出老化 反应产物,制备分子量分布(Mw / Mn)为1.3〜3.0,重均分子量(Mw)为30,000〜300,000的半导电性聚酰胺酸溶液; 并将半导体聚酰胺酸溶液施加到无缝模具中并完成酰亚胺化反应以获得聚酰亚胺膜。

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