Abstract:
A method and an apparatus for encoding multimedia contents, and a method and a system for applying multimedia contents are provided. The method for applying multimedia contents includes: storing an MAF file in a database, the MAF file including a header with location information that provides the location of media data, at least one single track with media data and metadata compatible with a predetermined standard, utilization data representing information for media application method; and browsing or sharing the MAF file stored in the database. The media metadata compatible with the predetermined standard is at least one of media player metadata and a media album metadata. Accordingly, even when the user does not have a specific application or a function for applying metadata, general-purpose multimedia content files can be effectively used by effectively browsing or sharing the multimedia content files.
Abstract:
The present invention provides a flexible copper-polyimide laminate including a linear random block polyimide layer formed on the at least one side thereof, the linear random block polyimide layer comprising 0.25 to 90.25 mol.% of a repeating unit l represented by the formula 1, 0.25 to 90.25 mol.% of a repeating unit m represented by the formula 2, 0.25 to 90.25 mol.% of a repeating unit n represented by the formula 3, and 0.25 to 90.25 mol.% of a repeating unit o represented by the formula 4. The flexible copper-polyimide laminate having a polyimide layer is free from curls and excellent in dimensional stability, tensile property, folding endurance and resistance to flexural fatigue with low moisture content.
Abstract:
The present invention is directed to a high-temperature resistance adhesive tape, and a fabrication method thereof. The high-temperature resistance adhesive tape prepared by coating an adhesive composition on a substrate film physically surface-modified by corona or plasma treatment to form an adhesive layer and then performing a heat treatment for drying and curing at 140 to 230 ˚ C shows an enhanced adhesion between the adhesive layer and the substrate film through the physical surface modification of the substrate film to minimize a residue of the tape on an adherend, enabling its use for a high-temperature semiconductor process, and minimizes the unreacted functional group of the platinum catalyst through a high temperature process to reduce an appreciable change in properties on ageing, such as a deterioration of adhesion.
Abstract:
Disclosed herein is an endless belt having a meandering prevention guide, wherein the meandering prevention guide is heat-treated, and thermoplastic double-sided adhesive tape exhibiting adhesivity using heat is applied to the meandering prevention guide.
Abstract:
Disclosed are a system and method for processing sensory effects. According to an embodiment of the present invention, sensory effects contained as content can be implemented in the real world by generating command data for controlling a sensory device based on sensory effect information and specific information about the sensory device. Also, the data transmission rate is high and a low bandwidth can be used by encoding metadata as binary before transmission, or encoding as XML before transmission, or encoding as XML and then further encoding as binary before transmission.
Abstract:
Disclosed are a virtual world processing device and method. By way of example, data collected from the real world is converted to binary form data which is then transmitted, or is converted to XML data, or the converted XML data is further converted to binary form data which is then transmitted, thereby allowing the data transmission rate to be increased and a low bandwidth to be used, and, in the case of a data-receiving adaptation RV engine, the complexity of the adaptation RV engine can be reduced as there is no need to include an XML parser.
Abstract:
Disclosed is an optical sheet for use in liquid crystal displays, which simultaneously functions to uniformly diffuse light emitted from a light guide plate and a diffusion plate and to increase brightness, decreases the loss of light, and enables the fabrication of thinner liquid crystal displays.
Abstract:
A hardmask composition for processing a resist underlayer film is provided. The hardmask composition comprises: (a) an organosilane polymer prepared by reacting polycondensation products of hydrolysates of compounds represented by Formulae 1, 2 and 3: [RO] 3 Si-Ar (1) (wherein R is methyl or ethyl and Ar is an aromatic ring-containing functional group), [RO] 3 Si-H (2) (wherein R is methyl or ethyl), and [RO] 3 Si-R' (3) (wherein R is methyl or ethyl and R'is substituted or unsubstituted cyclic or acyclic alkyl) with ethyl vinyl ether of Formula 4: CH 2 CHOCH 2 CH 3 (4) in the presence of an acid catalyst; (b) a solvent; and (c) a crosslinking catalyst.
Abstract:
The present invention relates to a CMP abrasive comprising a ceria slurry and a chemical additive having two or more functional groups by mixing and synthesizing a polymeric molecule and a monomer . Also, the present invention relates to a method for a manufacturing CMP abrasive by providing a ceria slurry, manufacturing a chemical additive having two or more functional groups by mixing and synthesizing of the polymeric moleculeand the monomer in a reactor, and mixing said slurry and said chemical additive. Therefore, when the abrasive according to the present invention is used as an STI CMP abrasive, it is possible to apply the abrasive to the patterning process required in the very large scale integration semiconductor process. Furthermore, the CMP abrasive of the present invention has a superior removal rate, superior polishing selectivity, superior within wafer non-uniformity (WIWNU), and minimized occurrence of micro scratches.
Abstract:
Disclosed herein is a method of manufacturing an endless belt, including the steps of: reacting a diamine monomer with a dianhydride monomer in a reactor filled with a conductive filler-dispersed liquid to obtain a reaction product, aging the reaction product and then discharging the aged reaction product from the reactor to prepare a semiconductive polyamic acid solution having a molecular weight distribution (Mw/Mn) of 1.3 ~ 3.0 and a weight average molecular weight (Mw) of 30,000 ~ 300,000; and applying the semiconductive polyamic acid solution to a seamless mold and completing an imidization reaction to obtain a polyimide film.