公开(公告)号：WO2010051134A1

公开(公告)日：2010-05-06

申请号：PCT/US2009/059581

申请日：2009-10-05

Applicant: MAXIM INTEGRATED PRODUCTS, INC. ,  ASHRAFZADEH, Ahmad ,  IZADINIA, Mansour ,  KALJE, Nitin ,  MCQUIRK, Ignacio

Inventor： ASHRAFZADEH, Ahmad ,  IZADINIA, Mansour ,  KALJE, Nitin ,  MCQUIRK, Ignacio

IPC: H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H01L23/495 ,  H02M3/28 ,  H05K1/16

CPC classification number: H01F17/0033 ,  H01F17/04 ,  H01F41/046 ,  H01F2027/2814 ,  H01L23/495 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Integrated circuit packages incorporating an inductor and methods for their fabrication. The lead frame used in packaging the integrated circuit includes a first area for receiving the integrated circuit (34), and a second area having a plurality of connections (32) from one side to the other side of the lead frame, thereby forming coil segments. After mounting the integrated circuit and wire bonding its connections, the lead frame is placed on a ferrite plate (38), the assembly is encapsulated in resin, and the leads (28) trimmed and bent. Mounting of the packaged integrated circuit on a properly prepared printed circuit interconnects the coil segments in the package to coil segments on the printed circuit, thereby forming a single, multi-turn coil around the ferrite plate.

Abstract translation: 包含电感器的集成电路封装及其制造方法。 用于封装集成电路的引线框架包括用于接收集成电路（34）的第一区域和具有从引线框架的一侧到另一侧的多个连接（32）的第二区域，从而形成线圈段 。 在安装集成电路和引线连接其连接之后，将引线框架放置在铁氧体板（38）上，将组件封装在树脂中，引线（28）被修整和弯曲。 将封装的集成电路安装在正确准备的印刷电路上将封装中的线圈段与印刷电路上的线圈段互连，从而在铁氧体板周围形成单个多匝线圈。

公开(公告)号：WO2010001336A1

公开(公告)日：2010-01-07

申请号：PCT/IB2009/052832

申请日：2009-06-30

Applicant: NXP B.V. ,  WEEKAMP, Johannes Wilhelmus ,  BERGVELD, Hendrik, J. ,  VAN GRUNSVEN, Eric Cornelis Egbertus ,  LAMY, Yann Pierre Roger ,  SCHOOFS, Franciscus Adrianus Cornelis Maria

Inventor： WEEKAMP, Johannes Wilhelmus ,  BERGVELD, Hendrik, J. ,  VAN GRUNSVEN, Eric Cornelis Egbertus ,  LAMY, Yann Pierre Roger ,  SCHOOFS, Franciscus Adrianus Cornelis Maria

IPC: H01F3/02

CPC classification number: H01F17/0033 ,  H01F1/344 ,  H01F3/10 ,  H01F41/02 ,  H01F2017/0066 ,  H01F2027/2814

Abstract: An inductor core (6) is described along with methods for its manufacture. The core comprises a body (20) formed of electrically insulating magnetic material,and a stack (22) of layers over the body, formed alternately of electrically conductive magnetic material (24) and insulating material(26), wherein the magnetic saturation level of the magnetic material of the body is lower than that of the magnetic layer material.Thus, two magnetic paths are provided in parallel, one through the stack of layers and one through the body material. This results in a higher inductance at low currents and maintenance of a lower inductance at higher currents. The core (6) is particularly suitable for use in inductors integrated inside a device package for example in an integrated DC/DC converter.

Abstract translation: 描述电感器芯（6）及其制造方法。 芯包括由电绝缘的磁性材料形成的主体（20）和主体上的叠层（22），其交替地由导电的磁性材料（24）和绝缘材料（26）形成，其中磁饱和度 本体的磁性材料低于磁性层材料的磁性材料。因此，两个磁路平行设置，一个穿过层叠层，一个穿过主体材料。 这导致在低电流下的较高的电感和在较高电流下维持较低的电感。 核心（6）特别适用于集成在器件封装内的电感器，例如集成的DC / DC转换器。

公开(公告)号：WO01097235A1

公开(公告)日：2001-12-20

申请号：PCT/US2001/015008

申请日：2001-05-10

IPC: H01F17/00 ,  H01F17/02 ,  H01F17/04 ,  H01F17/06 ,  H01F41/04 ,  H01L21/822 ,  H01L27/04 ,  H01R12/00 ,  H05K3/40 ,  H01F5/00

CPC classification number: H01F17/0006 ,  H01F17/0033 ,  H01F41/041 ,  H01F2027/2814 ,  H01G5/18 ,  H01G5/38 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2924/014 ,  H01L2924/19042 ,  H05K3/4092 ,  H01L2924/00014

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61a-65a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. Alternately, the loop winding can be formed of two elastic members (318, 320) in which the free ends are joined in mid-air. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract translation: 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件（61a-65a）。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 或者，环绕组可以由两个弹性构件（318,320）形成，其中自由端在空气中接合。 一系列单独的线圈结构可以通过它们的锚定部分连接以形成电感器和变压器。

公开(公告)号：WO98056016A1

公开(公告)日：1998-12-10

申请号：PCT/DE1998/001487

申请日：1998-06-02

IPC: H01F27/28 ,  H01F17/00 ,  H01F17/04 ,  H01F27/06 ,  H01F30/16

CPC classification number: H01F17/0033 ,  H01F30/16 ,  H01F2027/2814

Abstract: The invention relates to a extra-flat miniaturized inductive component comprising a magnetic core (5) made of a soft magnetic material, a substrate (1) with conductor strips (6) and through connections. The conductor strips (6) and connections running through the substrate (1) form part of the coils of a winding. The other part of the winding is formed by wires on the upper surface (3) of the substrate (1) which are bonded to metal pads (8) on the ends (7) of the conductor strips (6).

Abstract translation: 它呈现软磁材料的磁芯（5），在基板（1），该导体轨道涂层（6）的小型化，非常平坦的设计具有通孔电感分量。 导体轨道列车（6）和所述通孔穿过基板（1）形成一个绕组的匝的一部分。 绕组的另一部分在其上表面线形成（3），其在与金属焊盘的端部接合的技术过程连接在衬底（1）（8）（7）的导体轨道列车（6）。

公开(公告)号：WO2015125620A1

公开(公告)日：2015-08-27

申请号：PCT/JP2015/053215

申请日：2015-02-05

Applicant: 株式会社村田製作所

Inventor： 番場　真一郎 ,  酒井　範夫 ,  西出　充良

IPC: H01F17/00 ,  H01F17/06 ,  H01F41/04 ,  H01F41/08

CPC classification number: H01F27/2823 ,  H01F17/0013 ,  H01F17/0033 ,  H01F17/062 ,  H01F41/046 ,  H01F2027/2814

Abstract: 　コイルを内蔵するモジュールにおいて、安価な構成で、コイル特性の向上を図る。　モジュール１は、絶縁層３と、絶縁層３に内蔵された環状のコイルコア４と、コイルコア４の外周面に沿って配列された複数の外側金属ピン７と、各外側金属ピン７それぞれと複数の対を成すようにコイルコア４の内周面に沿って配列された複数の内側金属ピン８と、各対を成す外側金属ピン７および内側金属ピン８の一方の端面同士を接続するボンディングワイヤ９と、外側金属ピン７の他方の端面と、対を成す内側金属ピン８の所定側に隣接する内側金属ピン８の他方の端面とをそれぞれ接続する配線電極パターン１０とを有するコイル電極５と、絶縁層３よりも低い弾性率を有する非導電性材料により形成されコイルコア４の表面を被覆する緩衝膜６とを備える。

Abstract translation: 为了在具有内置线圈的模块中以廉价的结构提高线圈特性，该模块（1）设置有：绝缘层（3）; 内置在绝缘层（3）中的环形线圈芯（4）; 包括沿着所述线圈芯（4）的外周面配置的多个外金属销（7）的线圈电极（5），沿着所述线圈芯的内周面配置的多个内金属销（8） 4），以便与各个外部金属销（7），每个连接外部金属销（7）的一个端面和内部金属销（8）的一个端面的接合线（9）形成多个对， 与所述外部金属销形成一对;以及布线电极图案（10），其将每个外部金属销（7）的另一个端面与相邻的内部金属销（8）的另一个端面连接在预定的 与所述外金属销形成一对的内金属销（8）; 以及由具有比绝缘层（3）更低的弹性模量的非导电材料形成并且覆盖线圈芯（4）的表面的缓冲膜（6）。

公开(公告)号：WO2014140187A1

公开(公告)日：2014-09-18

申请号：PCT/EP2014/054977

申请日：2014-03-13

Applicant: ELDON TECHNOLOGY LIMITED TRADING AS ECHOSTAR EUROPE

Inventor： BROOKSBANK, John Nicholas

IPC: H01F17/06 ,  H01F27/28

CPC classification number: H01F41/041 ,  H01F17/062 ,  H01F27/2804 ,  H01F27/2847 ,  H01F41/10 ,  H01F2027/2814 ,  Y10T29/49073

Abstract: Systems and methods for creating an inductive element are disclosed. Multiple partial windings may be created relative to a core, where each of the partial windings is initially discontinuous. Multiple printed conductors may be created on a substrate, where the multiple printed conductors are arranged to electrically connect the multiple partial windings. The multiple partial windings may be electrically connected to the multiple printed conductors to create a complete winding around the core.

Abstract translation: 公开了用于产生电感元件的系统和方法。 可以相对于芯产生多个部分绕组，其中每个部分绕组最初是不连续的。 可以在基板上形成多个印刷导体，其中多个印刷导体布置成电连接多个部分绕组。 多个部分绕组可以电连接到多个印刷导体以在芯周围产生完整的绕组。

公开(公告)号：WO2013119229A3

公开(公告)日：2014-04-17

申请号：PCT/US2012024373

申请日：2012-02-08

Applicant: PULSE ELECTRONICS INC ,  SCHAFFER CHRISTOPHER P ,  GUTIERREZ AURELIO J

Inventor： SCHAFFER CHRISTOPHER P ,  GUTIERREZ AURELIO J

IPC: H01R4/60

CPC classification number: H01R13/7193 ,  H01F27/2804 ,  H01F2017/002 ,  H01F2027/2814 ,  H01R24/64 ,  H05K1/165 ,  H05K2201/086

Abstract: Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.

Abstract translation: 提供低成本，高精度感应装置的方法和装置。 在一个实施例中，感应装置包括基于基板的感应装置，其利用插入的导电针与电镀基板组合，该电镀基板替代设置在磁导芯周围的绕组。 在一些变型中，这是在不设置在相邻基板之间的头部的情况下实现的，而替代变型使用头部。 在另一个实施例中，衬底感应器件被并入集成连接器模块中。 还公开了制造和利用上述基板的感应装置和集成连接器模块的方法。

公开(公告)号：WO2012006049A1

公开(公告)日：2012-01-12

申请号：PCT/US2011/042094

申请日：2011-06-28

Applicant: QUALCOMM INCORPORATED ,  PARK, Sang-June ,  KIM, Jonghae ,  NOWAK, Matthew, M. ,  CICCARELLI, Steve, C

Inventor： PARK, Sang-June ,  KIM, Jonghae ,  NOWAK, Matthew, M. ,  CICCARELLI, Steve, C

IPC: H01F17/00 ,  H01F27/28 ,  H01L23/64

CPC classification number: H01F27/2804 ,  H01F17/0006 ,  H01F2027/2814 ,  H01L23/5225 ,  H01L23/5227 ,  H01L23/645 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A three-dimensional inductor or transformer for an electronic packaging system that includes a plurality of conductive traces and a plurality of conductive wire bonds. The traces are located in a single layer, and each have a first and second pad. Each of the wire bonds couples the second pad of one trace to the first pad of another trace. The trace and wire bonds create a continuous conductive path from the first pad of a first trace to the second pad of a last trace. Passing a current from the first trace to the last trace creates an electromagnetic field between the single layer and the wire bonds. The transformer includes two independent and electromagnetically coupled inductors that can be interleaved. The continuous conductive path can be solenoid-shaped. A shielding layer can also be included that blocks the substrate from the electromagnetic field of the inductor or transformer.

Abstract translation: 一种用于电子封装系统的三维电感器或变压器，其包括多个导电迹线和多个导电引线键合。 迹线位于单个层中，并且每个具有第一和第二焊盘。 每个线接合将一个迹线的第二个焊盘耦合到另一个迹线的第一个焊盘。 迹线和引线键形成从第一迹线的第一焊盘到最后迹线的第二焊盘的连续传导路径。 将电流从第一个轨迹传递到最后一个轨迹会在单层和引线键之间产生电磁场。 该变压器包括可以交错的两个独立的和电磁耦合的电感器。 连续导电路径可以是螺线管形的。 还可以包括阻挡基板与电感器或变压器的电磁场的屏蔽层。

公开(公告)号：WO2011149523A1

公开(公告)日：2011-12-01

申请号：PCT/US2011/000926

申请日：2011-05-24

Applicant: TYCO ELECTRONICS CORPORATION ,  DALMIA, Sidharth ,  NGUYEN, Khanh ,  DAS, Jaydip ,  MCGRATH, Mark ,  HARRISON, William, Lee

Inventor： DALMIA, Sidharth ,  NGUYEN, Khanh ,  DAS, Jaydip ,  MCGRATH, Mark ,  HARRISON, William, Lee

IPC: H01F17/00 ,  H01F17/06 ,  H01F27/28

CPC classification number: H01F27/2804 ,  H01F17/0006 ,  H01F17/045 ,  H01F17/062 ,  H01F2027/2814

Abstract: A multilayer inductor device (1500) comprises a planar substrate (1502) and a ferrite body (1506) disposed in the substrate (1502). The substrate includes a plurality of dielectric layers (1700). An outer conductive coil (1612) is helically wrapped around the ferrite body. The outer conductive coil includes a first plurality of upper conductors (1510) disposed on a first upper dielectric layer (1700 A) of the substrate, a first plurality of lower conductors (1602) disposed on a first lower dielectric layer (1700D) of the substrate, and a first plurality of conductive vias (1512, 1514) vertically extending through the substrate and conductively coupled with the first plurality of upper conductors and the first plurality of lower conductors. An inner conductive coil (1610) is helically wrapped around the ferrite body. The inner conductive coil includes a second plurality of upper conductors (1600) disposed on a second upper dielectric layer (1700B) of the substrate, a second plurality of lower conductors (1604) disposed on a second lower dielectric layer (1700C) of the substrate, and a second plurality of conductive vias (1606, 1608) vertically extending through the substrate and conductively coupled with the second plurality of upper conductors and the second plurality of lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.

Abstract translation: 多层电感器件（1500）包括平面衬底（1502）和设置在衬底（1502）中的铁氧体本体（1506）。 衬底包括多个电介质层（1700）。 外部导电线圈（1612）螺旋缠绕在铁氧体上。 外导电线圈包括设置在基板的第一上电介质层（1700A）上的第一多个上导体（1510），设置在基板的第一下介电层（1700D）上的第一多个下导体（1602） 衬底和垂直延伸穿过衬底并与第一多个上导体和第一多个下导体导电耦合的第一多个导电通孔（1512,1514）。 内部导电线圈（1610）螺旋缠绕在铁氧体上。 所述内导电线圈包括设置在所述基板的第二上电介质层（1700B）上的第二多个上导体（1600），设置在所述基板的第二下介电层（170C）上的第二多个下导体（1604） 以及垂直延伸穿过衬底并与第二多个上导体和第二多个下导体导电耦合的第二多个导电通孔（1606,1608）。 内部导电线圈设置在外部导电线圈和铁氧体之间。

公开(公告)号：WO2011014200A1

公开(公告)日：2011-02-03

申请号：PCT/US2009/052512

申请日：2009-07-31

Applicant: RADIAL ELECTRONICS, INC ,  QUILICI, James, E.

Inventor： QUILICI, James, E.

IPC: H01F27/28 ,  H01F27/32

CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F27/306 ,  H01F27/32 ,  H01F2027/2809 ,  H01F2027/2814

Abstract: Disclosed are apparatus and methods for a magnetic component. In accordance with an embodiment, a magnetic component comprises a base substrate defining a winding cup having a shape of a closed groove surrounding a hub. The winding cup defines a core space operable to receive a core therein. A first conductive pattern is disposed on at least a portion of the base substrate including the winding cup. A second substrate defines a second conductive pattern. The second substrate is coupled to the first base surface with the first conductive pattern in operable alignment with the second conductive pattern. The first and second conductive patterns are coupled in electrical communication so as to define one or more winding-type electric circuits surrounding the core space so as to induce a magnetic flux within the core space when the one or more electric circuits are energized by a voltage source.

Abstract translation: 公开了用于磁性部件的装置和方法。 根据一个实施例，磁性部件包括限定具有围绕轮毂的封闭凹槽的形状的绕线杯的基底基板。 绕组杯限定了可操作以在其中容纳芯的芯空间。 第一导电图案设置在包括绕线杯的基底基板的至少一部分上。 第二衬底限定第二导电图案。 第二衬底被耦合到第一基底表面，其中第一导电图案与第二导电图案可操作地对准。 第一和第二导电图案电连通地耦合，以便限定一个或多个围绕磁芯空间的绕组式电路，以便当一个或多个电路通过电压通电时，在磁芯空间内引起磁通量 资源。