公开(公告)号：WO2003006216A1

公开(公告)日：2003-01-23

申请号：PCT/US2002/022476

申请日：2002-07-15

申请人： BROOKS AUTOMATION, INC.

发明人： GILCHRIST, Ulysses

IPC分类号： B25J15/02

CPC分类号： B25J18/04 ,  B25J9/042 ,  B25J9/1045 ,  B25J15/0052 ,  H01L21/67742 ,  Y10T74/20305 ,  Y10T74/20317 ,  Y10T74/20329 ,  Y10T74/20335

摘要： A substrate processing apparatus (10) comprising a frame (16), a drive section (42), an articulated arm (44), and at least one pair of end effectors (64, 66). The drive section (42) is connected to the frame (16). The articulated arm (44) is connected to the drive section (42). The articulated arm (44) has a shoulder (72) and a wrist. The arm (44) is pivotally mounted to the drive section (42) at the shoulder (72). The pair of end effectors (64, 66) is connected to the articulated arm (44). The pair of end effectors (64, 66) is pivotally jointed to the wrist of the articulated arm (44) to rotate relative to the articulated arm (44) about a common axis of rotation at the wrist. Each end effector (64, 66) is independently pivotable about the common axis of rotation of the wrist relative to the articulated arm (44).

摘要翻译： 一种基板处理装置（10），包括框架（16），驱动部分（42），铰接臂（44）和至少一对端部执行器（64,66）。 驱动部分（42）连接到框架（16）。 铰接臂（44）连接到驱动部分（42）。 铰接臂（44）具有肩部（72）和手腕。 臂（44）在肩部（72）处枢转地安装到驱动部分（42）。 一对末端执行器（64,66）连接到铰接臂（44）。 所述一对末端执行器（64,66）枢转地连接到所述铰接臂（44）的腕部，以相对于所述铰接臂（44）围绕手腕的公共旋转轴线旋转。 每个端部执行器（64,66）可以相对于铰接臂（44）围绕手腕的公共旋转轴线独立地枢转。

公开(公告)号：WO0222321A3

公开(公告)日：2002-12-27

申请号：PCT/US0129004

申请日：2001-09-17

申请人： APPLIED MATERIALS INC

发明人： OLGADO DONALD J K ,  TEPMAN AVI ,  FRANKLIN TIMOTHY J

IPC分类号： B25J9/16 ,  C25D7/12 ,  H01L21/00 ,  H01L21/288 ,  H01L21/677 ,  H01L21/687 ,  H05K3/24

CPC分类号： H01L21/67126 ,  B25J9/1638 ,  C25D7/12 ,  G05B2219/40351 ,  G05B2219/41457 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67742 ,  H01L21/68707 ,  H05K3/241 ,  Y10T74/20311

摘要： The present invention provides an apparatus and associated method in which the apparatus comprises a multiple blade robot and a compensating device. The multiple blade robot includes at least one set of robot blades. The compensating device adjusts for differences in spacing between the set of robot blades and spacing between two or more cells. In different embodiments, the compensating device may be coupled to one or more of the process cells, one or more of the substrate holder systems, or one or more of the robot blades.

摘要翻译： 本发明提供了一种装置和相关方法，其中该装置包括多刀片机器人和补偿装置。 多刀片机器人包括至少一组机器人刀片。 补偿装置调整机器人叶片组之间的间距差异和两个或更多个单元之间的间距。 在不同的实施例中，补偿装置可以耦合到一个或多个处理单元，一个或多个衬底保持器系统或一个或多个机器人刀片。

公开(公告)号：WO02022321A2

公开(公告)日：2002-03-21

申请号：PCT/US2001/029004

申请日：2001-09-17

IPC分类号： B25J9/16 ,  C25D7/12 ,  H01L21/00 ,  H01L21/288 ,  H01L21/677 ,  H01L21/687 ,  H05K3/24

CPC分类号： H01L21/67126 ,  B25J9/1638 ,  C25D7/12 ,  G05B2219/40351 ,  G05B2219/41457 ,  H01L21/2885 ,  H01L21/67051 ,  H01L21/67742 ,  H01L21/68707 ,  H05K3/241 ,  Y10T74/20311

摘要： The present invention provides an apparatus and associated method in which the apparatus comprises a multiple blade robot and a compensating device. The multiple blade robot includes at least one set of robot blades. The compensating device adjusts for differences in spacing between the set of robot blades and spacing between two or more cells. In different embodiments, the compensating device may be coupled to one or more of the process cells, one or more of the substrate holder systems, or one or more of the robot blades.

摘要翻译： 本发明提供了一种装置和相关联的方法，其中该装置包括多叶片机器人和补偿装置。 多刀片机器人包括至少一组机器人刀片。 补偿装置调节机器人刀片组之间的间距和两个或更多个单元之间的间隔的差异。 在不同的实施例中，补偿装置可以耦合到一个或多个处理单元，一个或多个基板保持器系统或一个或多个机器人叶片。

公开(公告)号：WO0163651A3

公开(公告)日：2001-12-06

申请号：PCT/US0105050

申请日：2001-02-16

申请人： WAFERMASTERS INC

发明人： YOO WOO SIK

IPC分类号： B65G49/00 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67748

摘要： A wafer processing system which requires no isolation between the operational areas within the processing system. The system of the present invention includes operational areas, such as a loading area, a transport area, and a reactor or thermal processing area. Advantageously, since there are no isolation devices or gate valves separating the areas, the processing system effectively has each operational area combined into a "single" chamber. Preferably, the single chamber has a single slit valve, hinge door, or other vacuum sealable door disposed proximate to the loading area to allow for the removal/insertion of the wafers into the loading area. Once the door to the loading area has been closed the internal pressure within the chamber can be kept uniform throughout each operational area.

摘要翻译： 晶片处理系统，其不需要处理系统内的操作区域之间的隔离。 本发明的系统包括诸如装载区域，运输区域和反应器或热处理区域的操作区域。 有利地，由于没有隔离区域的隔离装置或闸阀，处理系统有效地将每个操作区域组合成“单个”室。 优选地，单室具有靠近装载区域设置的单个狭缝阀，铰链门或其它可真空密封的门，以允许将晶片移除/插入装载区域。 一旦装载区域的门已经关闭，则室内的内部压力可以在每个操作区域内保持均匀。

公开(公告)号：WO01041197A1

公开(公告)日：2001-06-07

申请号：PCT/US2000/032866

申请日：2000-11-30

IPC分类号： B25J9/06 ,  H01L21/677 ,  H01L21/00

CPC分类号： H01L21/67778 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67766 ,  H01L21/67772 ,  Y10S438/908

摘要： A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.

摘要翻译： 通过使用垂直安装的模块，如反应堆，装载锁和冷却站，晶圆处理系统占地面积最小。 通过使用采用旋转运动的装载站将晶片载体移动到装载锁中，可以进一步节省占地面积。 晶片处理系统包括具有用于访问垂直安装的模块的延伸，旋转和垂直运动的机器人。 机器人内部冷却并具有耐热的末端执行器，使机器人与高温半导体加工兼容。

公开(公告)号：WO00041855A1

公开(公告)日：2000-07-20

申请号：PCT/US2000/000930

申请日：2000-01-14

IPC分类号： B25J9/06 ,  B25J9/04 ,  B25J9/10 ,  B25J18/02 ,  B25J18/04 ,  B25J19/00 ,  B65G49/00 ,  B65G49/07 ,  H01L21/677 ,  H01L21/687 ,  B25J18/00

CPC分类号： H01L21/68707 ,  B25J9/042 ,  B25J9/104 ,  B25J18/02 ,  B25J18/04 ,  B25J19/0079 ,  H01L21/67742 ,  Y10T74/20323

摘要： A wafer handling robot (100) is disclosed for transporting workpieces. The robot includes a base (102) comprising a rigid backbone (112) for providing stability to the robot. The base further includes a mast (116), a linear drive system (122) for translating the mast, and a shoulder drive system (120) for rotating the mast. The shoulder drive system includes a harmonic drive reduction system (138) for providing output rotation of the mast for rotation with the mast, and a distal link (106) rotatably mounted to the proximal link. An end effector (108) for supporting workpieces is rotationally mounted to the distal end of the distal link. An elbow drive (150) is mounted to the proximal link, extending down into the mast section, for driving rotation of the distal link with respect to the proximal link.

摘要翻译： 公开了一种用于运输工件的晶片处理机器人（100）。 机器人包括一个基座（102），它包括用于提供机器人稳定性的刚性骨架（112）。 基座还包括桅杆（116），用于平移桅杆的线性驱动系统（122）和用于旋转桅杆的台肩驱动系统（120）。 所述台肩驱动系统包括谐波驱动减速系统（138），用于提供所述桅杆的输出旋转以与所述桅杆一起旋转，以及可旋转地安装到所述近端连杆的远端连杆（106）。 用于支撑工件的端部执行器（108）旋转地安装到远端连杆的远端。 肘部驱动器（150）安装到近端连杆，向下延伸到桅杆部分中，用于驱动远端连杆相对于近端连杆的旋转。

公开(公告)号：WO9961350A3

公开(公告)日：2000-07-13

申请号：PCT/IB9901507

申请日：1999-05-13

申请人： APPLIED KOMATSU TECHNOLOGY INC

发明人： BLONIGAN WENDELL T ,  WHITE JOHN M

IPC分类号： B65G49/06 ,  B65G49/07 ,  H01L21/673 ,  H01L21/677 ,  H01L21/00

CPC分类号： H01L21/67742 ,  H01L21/67709 ,  H01L21/6776 ,  Y10S414/139

摘要： A magnetic drive system for moving a substrate transfer shuttle along a linear path between chambers in a semiconductor fabrication apparatus. A rack with rack magnets is secured to the shuttle, and a rotatable pinion with pinion magnets is positioned adjacent the rack so that the pinion magnets can magnetically engage the rack magnets. Thus, rotation of the pinion will cause the shuttle to move along the linear path. The magnets may be oriented with a helix angle between their primary axis and the axis of rotation of the pinion. One rack and one pinion are located on each side of the shuttle. A set of lower guide rollers supports the shuttle, and a set of upper guide rollers prevents the shuttle from lifting off the lower guide rollers.

摘要翻译： 一种磁性驱动系统，用于在半导体制造装置中沿着室之间的线性路径移动基板传送梭。 具有齿条磁体的机架固定到梭子上，并且具有小齿轮磁体的可旋转小齿轮定位成邻近齿条，使得小齿轮磁体可以磁性地接合齿条磁体。 因此，小齿轮的旋转将使梭子沿线性路径移动。 磁体可以在它们的主轴线和小齿轮的旋转轴线之间具有螺旋角定向。 一个机架和一个小齿轮位于梭子的每一侧。 一组下导辊支撑梭子，一组上导辊防止梭子从下导辊上脱落。

公开(公告)号：WO99061350A2

公开(公告)日：1999-12-02

申请号：PCT/IB1999/001507

申请日：1999-05-13

IPC分类号： B65G49/06 ,  B65G49/07 ,  H01L21/673 ,  H01L21/677 ,  B65G

CPC分类号： H01L21/67742 ,  H01L21/67709 ,  H01L21/6776 ,  Y10S414/139

摘要： A magnetic drive system for moving a substrate transfer shuttle along a linear path between chambers in a semiconductor fabrication apparatus. A rack with rack magnets is secured to the shuttle, and a rotatable pinion with pinion magnets is positioned adjacent the rack so that the pinion magnets can magnetically engage the rack magnets. Thus, rotation of the pinion will cause the shuttle to move along the linear path. The magnets may be oriented with a helix angle between their primary axis and the axis of rotation of the pinion. One rack and one pinion are located on each side of the shuttle. A set of lower guide rollers supports the shuttle, and a set of upper guide rollers prevents the shuttle from lifting off the lower guide rollers.

摘要翻译： 一种磁性驱动系统，用于在半导体制造装置中沿着室之间的线性路径移动基板传送梭。 具有齿条磁体的机架固定到梭子上，并且具有小齿轮磁体的可旋转小齿轮定位成邻近齿条，使得小齿轮磁体可以磁性地接合齿条磁体。 因此，小齿轮的旋转将使梭子沿线性路径移动。 磁体可以在其主轴线和小齿轮的旋转轴线之间具有螺旋角度定向。 一个机架和一个小齿轮位于梭子的每一侧。 一组下导辊支撑梭子，一组上导辊防止梭子从下导辊上脱落。

公开(公告)号：WO99018601A1

公开(公告)日：1999-04-15

申请号：PCT/US1998/020605

申请日：1998-09-28

IPC分类号： B65G49/07 ,  B25J15/00 ,  H01L21/677 ,  H01L21/687 ,  H01L21/00

CPC分类号： H01L21/68707 ,  H01L21/67742 ,  Y10S414/135

摘要： The present invention provides a robot blade and a method of using the robot blade for transferring objects, namely substrates, through a process system, the robot blade comprising an upper platform having a first object supporting surface and a lower platform having a second object supporting surface. The robot blade is mounted onto a moveable member, and the assembly facilitates substrate transfers, such as removal of a processed substrate and insertion of an unprocessed substrate within a processing chamber through a single entry of the robot blade into the processing chamber.

摘要翻译： 本发明提供了一种机器人刀片和使用该机器人刀片的方法，用于通过处理系统传送物体即基底，该机器人刀片包括具有第一物体支撑表面的上平台和具有第二物体支撑表面的下平台 。 机器人刀片安装在可移动构件上，并且组件便于衬底传送，例如移除经处理的衬底并且将未处理衬底插入处理室内，通过机器人刀片的单个进入到处理室中。

公开(公告)号：WO99016111A1

公开(公告)日：1999-04-01

申请号：PCT/US1998/017234

申请日：1998-08-19

IPC分类号： B65G49/07 ,  B25J15/08 ,  H01L21/673 ,  H01L21/677 ,  H01L21/687 ,  H01L21/00

CPC分类号： H01L21/68707 ,  H01L21/67742

摘要： The present invention generally provides a robot that can transfer two workpieces, such as silicon wafers, simultaneously and at increased speeds and accelerations and decelerations. More particularly, the present invention provides a robot wrist associated with the robot arm for mechanically clamping a workpiece to a workpiece handling member attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In one embodiment, a clamp for securing silicon wafers uses two clamp fingers connected to a single flexure member to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that wafers are normally clamped except near full extension of the workpiece handling member to deliver or pick up a wafer.

摘要翻译： 本发明通常提供一种能够同时并以增加的速度和加速度和减速度传送两个工件（例如硅晶片）的机器人。 更具体地，本发明提供了一种与机器人臂相关联的机械手，用于将工件机械地夹持到附接到臂的工件处理构件。 晶片夹具选择性地施加足够的力来保持工件，并且在处理构件的快速旋转和线性移动期间防止滑动和损坏工件。 在一个实施例中，用于固定硅晶片的夹具使用连接到单个挠曲构件的两个夹钳指状件，以最小的颗粒产生和晶片损坏来定位和保持晶片。 夹具被设计成使得晶片通常被夹紧，除了工件处理构件的完全延伸以便递送或拾取晶片。